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1. 发明授权

US08474934B1 Method for improving gloss of a print 有权
标题翻译：提高印刷品光泽度的方法
公开(公告)号：US08474934B1
公开(公告)日：2013-07-02
申请号：US12772152
申请日：2010-04-30
申请人： Brian E. Curcio , Joshua A. Mann , Dustin W. Blair , Glenn Thomas Haddick , Thomas Jeffrey Winter
发明人： Brian E. Curcio , Joshua A. Mann , Dustin W. Blair , Glenn Thomas Haddick , Thomas Jeffrey Winter
IPC分类号： B41J29/38 , B41J2/21
CPC分类号： B41J2/21
摘要： A method for improving gloss of a print includes configuring a printing system to deposit ink drops from a plurality of inks in an ink set onto a print surface. During the depositing, the printing system is further configured to control micro-coalescence of the ink drops. The micro-coalescence is controlled by i) depositing the ink drops onto the print surface according to a predefined order of color based upon solids content, ii) adjusting a number of printing passes, iii) adjusting a delay time between the printing passes, and/or iv) depositing different amounts of the ink drops onto the print surface during different printing passes.
摘要翻译：一种用于改善印刷品的光泽度的方法包括配置打印系统以将墨滴从油墨组中的多种墨水沉积到印刷表面上。在沉积期间，打印系统还被配置为控制墨滴的微聚合。通过i）控制微聚结; i）基于固体含量，按照预定的颜色顺序将墨滴沉积到印刷表面上，ii）调整打印通过次数，iii）调节打印通过之间的延迟时间，以及 /或iv）在不同的印刷过程中将不同量的墨滴沉积到印刷表面上。

2. 发明授权

US08267498B1 Methods, apparatus and articles of manufacture to control gloss quality 有权
标题翻译：方法，设备和制品以控制光泽度
公开(公告)号：US08267498B1
公开(公告)日：2012-09-18
申请号：US12791648
申请日：2010-06-01
申请人： Dustin W. Blair , Brian E. Curcio , David S. Vejtasa , Glenn Thomas Haddick
发明人： Dustin W. Blair , Brian E. Curcio , David S. Vejtasa , Glenn Thomas Haddick
IPC分类号： B41J29/38
CPC分类号： H04N1/54
摘要： Example methods, apparatus and articles of manufacture to control gloss quality in printed images are disclosed. A disclosed example apparatus includes a print engine to print a plurality of images for respective ones of a plurality of colors, each image representing a plurality of different print parameter combinations, a scan module to measure a first plurality of light reflectances for respective ones of the plurality of images and the print parameter combinations, and a calibrator to calibrate an operation of the print engine for respective ones of the plurality of colors based on the first plurality of measured light reflectances, the operations of the print engine including at least one of an order of ink application, a rate of ink application, a density of ink application, or an applied amount of gloss enhancer.
摘要翻译：公开了用于控制印刷图像中的光泽度的示例性方法，设备和制品。所公开的示例性设备包括打印引擎，用于打印多种颜色中的各种颜色的多个图像，每个图像表示多个不同的打印参数组合;扫描模块，用于测量各个多个图像和打印参数组合，以及校准器，用于基于第一多个测量的光反射来校准针对多个颜色中的相应颜色的打印引擎的操作，打印引擎的操作包括以下各项中的至少一个：油墨应用顺序，油墨应用速率，油墨应用密度或光泽增强剂的施加量。

3. 发明授权

US07076869B2 Solid via layer to layer interconnect 失效
标题翻译：实体通过层间互连
公开(公告)号：US07076869B2
公开(公告)日：2006-07-18
申请号：US10260153
申请日：2002-09-27
申请人： Brian E. Curcio , Donald S. Farquhar , Voya R. Markovich , Konstantinos I. Papathomas
发明人： Brian E. Curcio , Donald S. Farquhar , Voya R. Markovich , Konstantinos I. Papathomas
IPC分类号： H01K3/10
CPC分类号： H05K3/462 , H05K3/321 , H05K3/423 , H05K3/4623 , H05K2201/09536 , H05K2201/09563 , H05K2201/096 , H05K2203/0733 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.
摘要翻译：本发明涉及一种在多层电路板的层之间提供互连的方法。形成延伸通过第一层的总厚度的第一通孔。第一通孔完全填充有第一固体导电插塞，并且第一固体导电插塞的端部包括与第一层的表面接触的第一接触垫。形成延伸穿过第二层的总厚度的第二通孔。通过完全填充第二固体导电插塞和第二固体导电插塞的端部的第二通孔包括与第二层的表面接触的第二接触垫。第二层通过与第一插头的端部和第二插头的端部电接触和机械接触的导电粘合剂电和机械地耦合到第一层。

4. 发明授权

US07303639B2 Method for producing Z-axis interconnection assembly of printed wiring board elements 失效
标题翻译：印制电路板元件Z轴互连组件的制造方法
公开(公告)号：US07303639B2
公开(公告)日：2007-12-04
申请号：US11208982
申请日：2005-08-22
申请人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
发明人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
IPC分类号： H01B13/00 , B32B3/00
CPC分类号： B32B3/266 , H01L21/4857 , H01L23/49833 , H01L2224/16 , H01L2224/16235 , H01L2924/01078 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K3/4652 , H05K2201/0394 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T156/10 , Y10T156/1052 , Y10T156/1062 , Y10T428/24917 , Y10T428/2804
摘要： A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
摘要翻译：一种形成用于接合的构件以形成复合布线板的方法。该构件包括电介质基片。将胶带施加到所述基底的至少一个面上。至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。将导电材料分配到每个开口中并部分固化。去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

5. 发明授权

US06638607B1 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 有权
标题翻译：制造印刷电路板元件Z轴互连组件的方法和结构
公开(公告)号：US06638607B1
公开(公告)日：2003-10-28
申请号：US10285162
申请日：2002-10-30
申请人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
发明人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
IPC分类号： B32B300
CPC分类号： B32B3/266 , H01L21/4857 , H01L23/49833 , H01L2224/16 , H01L2224/16235 , H01L2924/01078 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K3/4652 , H05K2201/0394 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T156/10 , Y10T156/1052 , Y10T156/1062 , Y10T428/24917 , Y10T428/2804
摘要： A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
摘要翻译：一种形成用于接合的构件以形成复合布线板的方法。该构件包括电介质基片。将胶带施加到所述基底的至少一个面上。至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。在每个开口中分配导电材料并部分固化。去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

6. 发明授权

US06465084B1 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 有权
公开(公告)号：US06465084B1
公开(公告)日：2002-10-15
申请号：US09834281
申请日：2001-04-12
申请人： Brian E. Curcio , Donald S. Farquhar , Konstantinos I. Papathomas , Mark D. Poliks
发明人： Brian E. Curcio , Donald S. Farquhar , Konstantinos I. Papathomas , Mark D. Poliks
IPC分类号： B32B300
CPC分类号： H05K3/462 , H05K3/386 , H05K3/4069 , H05K3/4623 , H05K3/4641 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , H05K2203/0353 , H05K2203/0384 , H05K2203/0554 , H05K2203/063 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T428/24917
摘要： A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

7. 发明授权

US08356878B2 Method of printing images 有权
标题翻译：打印图像的方法
公开(公告)号：US08356878B2
公开(公告)日：2013-01-22
申请号：US13112943
申请日：2011-05-20
申请人： Kai-Kong Iu , Brian E. Curcio , Ryan Tung Vu
发明人： Kai-Kong Iu , Brian E. Curcio , Ryan Tung Vu
IPC分类号： B41J29/393
CPC分类号： B41J2/2114 , C09D11/40 , C09D11/54
摘要： A method of printing an image includes co-dispensing a compensation vehicle and an ink from an ink set to sites on a printing medium to form a printed image. A combined amount of the ink and the compensation vehicle dispensed to each site is at least substantially equal to a minimum site value that is predetermined for the ink set and the printing medium. The method further includes applying an amount of an overcoat liquid to the printed image to obtain a predetermined ratio of gloss to haze.
摘要翻译：打印图像的方法包括将补偿车辆和油墨从油墨组共同分配到打印介质上的位置以形成打印图像。分配到每个位置的油墨和补偿车辆的组合量至少基本上等于对于油墨组和打印介质预定的最小位置值。该方法还包括向印刷图像施加一定量的外涂层液体以获得预定的光泽度与雾度的比率。

8. 发明授权

US07914110B2 Purging fluid from fluid-ejection nozzles by performing spit-wipe operations 有权
标题翻译：通过执行吐痰操作从流体喷嘴喷射流体
公开(公告)号：US07914110B2
公开(公告)日：2011-03-29
申请号：US11669585
申请日：2007-01-31
申请人： Brian E. Curcio , Jeffrey Anderson , Cynthia Jarom , Jeffrey D. Rutland
发明人： Brian E. Curcio , Jeffrey Anderson , Cynthia Jarom , Jeffrey D. Rutland
IPC分类号： B41J2/165
CPC分类号： B41J2/16526 , B41J2/16535 , B41J2/2142
摘要： Fluid is purged from a plurality of fluid-ejection nozzles of a fluid-ejection mechanism. A first series of spit-wipe operations is performed. A second series of spit-wipe operations is then performed.
摘要翻译：从流体喷射机构的多个流体喷射喷嘴清除流体。执行第一系列的吐痰操作。然后执行第二系列的吐痰操作。

9. 发明授权

US06776852B2 Process of removing holefill residue from a metallic surface of an electronic substrate 失效
标题翻译：从电子基板的金属表面去除孔填充残渣的方法
公开(公告)号：US06776852B2
公开(公告)日：2004-08-17
申请号：US10046621
申请日：2002-01-14
申请人： Christina M. Boyko , Brian E. Curcio , Donald S. Farquhar , Michael Wozniak
发明人： Christina M. Boyko , Brian E. Curcio , Donald S. Farquhar , Michael Wozniak
IPC分类号： B08B300
CPC分类号： H05K3/0094 , H05K2201/0209 , H05K2201/0959 , H05K2203/025 , H05K2203/0746 , H05K2203/0783 , H05K2203/0796 , Y10S438/906
摘要： A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.
摘要翻译：从电子基板的表面去除多余的孔填充材料的过程，其中孔填充残余物与溶胀剂接触，然后在不比pH大约6至大约6的液体的试剂存在下平坦化表面 8。

10. 发明授权

US06504111B2 Solid via layer to layer interconnect 失效
标题翻译：实体通过层间互连
公开(公告)号：US06504111B2
公开(公告)日：2003-01-07
申请号：US09867312
申请日：2001-05-29
申请人： Brian E. Curcio , Donald S. Farquhar , Voya R. Markovich , Konstantinos I. Papathomas
发明人： Brian E. Curcio , Donald S. Farquhar , Voya R. Markovich , Konstantinos I. Papathomas
IPC分类号： H05K111
CPC分类号： H05K3/462 , H05K3/321 , H05K3/423 , H05K3/4623 , H05K2201/09536 , H05K2201/09563 , H05K2201/096 , H05K2203/0733 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： The present invention relates to a structure for providing an interconnect between layers of a multilayer circuit board. The structure comprises a stack that includes at least one layer and a via opening that extends through at least one layer of the stack. Each individual via opening is filled with a solid conductive plug and each solid conductive plug has a first contact pad and a second contact pad.
摘要翻译：本发明涉及一种用于在多层电路板的层之间提供互连的结构。该结构包括堆叠，其包括延伸穿过堆叠的至少一个层的至少一个层和通孔开口。每个单独的通孔开口填充有固体导电塞，并且每个固体导电塞具有第一接触垫和第二接触垫。

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