专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130075065A1 SCULPTED FAN HOUSING 有权
标题翻译：雕刻扇房
公开(公告)号：US20130075065A1
公开(公告)日：2013-03-28
申请号：US13243779
申请日：2011-09-23
申请人： Brett W. DEGNER , Jay S. Nigen , Jesse T. Dybenko
发明人： Brett W. DEGNER , Jay S. Nigen , Jesse T. Dybenko
IPC分类号： F28F13/00
CPC分类号： F04D25/0613 , F04D17/16 , F04D29/4226 , F04D29/4266 , F04D29/441 , F04D29/445 , F04D29/582 , G06F1/203 , Y10T29/49329 , Y10T29/5191
摘要： The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.
摘要翻译：所描述的实施例一般涉及优化计算机系统中的气流。通过改变离心冷却风扇外壳的外表面，可以减少与围绕外壳移动的气流相关联的压降。这通常通过从冷却风扇外壳的外部四舍五入硬边缘以及形成盖表面而不是简单地使用平的盖表面来实现。在某些情况下，这也可能涉及修改风扇入口的形状，或者甚至使冷却风扇叶片的形状成形，以使空气更容易流过计算机外壳。

2. 发明授权

US08888450B2 Sculpted fan housing 有权
标题翻译：雕刻风扇外壳
公开(公告)号：US08888450B2
公开(公告)日：2014-11-18
申请号：US13243779
申请日：2011-09-23
申请人： Brett W. Degner , Jay S. Nigen , Jesse T. Dybenko
发明人： Brett W. Degner , Jay S. Nigen , Jesse T. Dybenko
IPC分类号： F04D29/42 , F04D29/44 , F04D29/58 , F04D25/06
CPC分类号： F04D25/0613 , F04D17/16 , F04D29/4226 , F04D29/4266 , F04D29/441 , F04D29/445 , F04D29/582 , G06F1/203 , Y10T29/49329 , Y10T29/5191
摘要： The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.
摘要翻译：所描述的实施例一般涉及优化计算机系统中的气流。通过改变离心冷却风扇外壳的外表面，可以减少与围绕外壳移动的气流相关联的压降。这通常通过从冷却风扇外壳的外部四舍五入硬边缘以及形成盖表面而不是简单地使用平的盖表面来实现。在某些情况下，这也可能涉及修改风扇入口的形状，或者甚至使冷却风扇叶片的形状成形，以使空气更容易流过计算机外壳。

3. 发明申请

US20080128119A1 Enhanced vent for outlet for a cooling system 有权
标题翻译：增强冷却系统出口通风口
公开(公告)号：US20080128119A1
公开(公告)日：2008-06-05
申请号：US11607571
申请日：2006-11-30
申请人： Ihab A. Ali , Jay S. Nigen
发明人： Ihab A. Ali , Jay S. Nigen
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A cooling mechanism includes a first heat exchanger, a first fluid-flow port, and a second fluid-flow port. The first heat exchanger includes a forced-fluid driver and is configured to pump heat from inside an enclosed area to outside of the enclosed area. Furthermore, the first fluid-flow port is configured to accommodate a first fluid flow into the enclosed area and the second fluid-flow port is configured to accommodate a second fluid flow from the enclosed area. Note that the first fluid-flow port and the second fluid-flow port are approximately coplanar. In addition, a given fluid-flow port, which may be either or both of the fluid-flow ports, is tapered to have an associated cross-sectional area which is smaller at an edge of the given fluid-flow port that is proximate to the outside of the enclosed area than at an edge of the given fluid-flow port that is proximate to the inside of the enclosed area.
摘要翻译：冷却机构包括第一热交换器，第一流体流通口和第二流体流动端口。第一热交换器包括强制流体驱动器，并且构造成将热量从封闭区域内部泵送到封闭区域的外部。此外，第一流体流动端口构造成容纳第一流体流入封闭区域，并且第二流体流动端口构造成容纳来自封闭区域的第二流体流。注意，第一流体流动端口和第二流体流动端口近似共面。此外，可以是流体流动端口中的一个或两个的给定流体流动端口是锥形的，以具有在给定的流体流动端口的边缘处更接近的相关联的横截面面积封闭区域的外侧比在靠近封闭区域内部的给定流体流动端口的边缘处。

4. 发明申请

US20110301778A1 THERMAL ZONE MONITORING IN AN ELECTRONIC DEVICE 有权
标题翻译：电子设备中的热区监测
公开(公告)号：US20110301778A1
公开(公告)日：2011-12-08
申请号：US12861770
申请日：2010-08-23
申请人： Frank Faqiu Liang , Jay S. Nigen , Amaury J. Heresztyn , Keith Cox
发明人： Frank Faqiu Liang , Jay S. Nigen , Amaury J. Heresztyn , Keith Cox
IPC分类号： G05D23/19
CPC分类号： G05D23/1932 , G06F1/206 , Y02D10/16
摘要： A predefined mathematical relationship that is stored in the memory of a computing system is accessed, wherein the relationship refers to temperatures of a number of points in the system, wherein the points together define a zone. The mathematical relationship yields a representative temperature for the zone. Temperature data from sensors in the system is obtained and applied to thermal models, to estimate the temperatures of at least some of the points that define the zone. The representative temperature for the zone is computed using the estimated temperatures as input to the mathematical relationship. A decision is then made on whether or not to change a power consuming activity limit in the system, based on the computed representative temperature. Other embodiments are also described and claimed.
摘要翻译：访问存储在计算系统的存储器中的预定义的数学关系，其中所述关系是指系统中多个点的温度，其中所述点一起限定区域。数学关系产生了该区域的代表性温度。获得系统中传感器的温度数据，并应用于热模型，以估计定义区域的至少一些点的温度。使用估计的温度作为数学关系的输入来计算区域的代表性温度。然后，基于计算出的代表温度来决定是否改变系统中的功耗活动极限。还描述和要求保护其他实施例。

5. 发明申请

US20110228482A1 METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL 有权
标题翻译：用于分配热界面材料的方法和装置
公开(公告)号：US20110228482A1
公开(公告)日：2011-09-22
申请号：US13151144
申请日：2011-06-01
申请人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
发明人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
IPC分类号： H05K7/20 , F28F7/00 , B23P19/00
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译：本发明的实施例提供一种用于分配热界面材料的系统。该系统包括：集成电路芯片; 散热器以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布集成电路芯片。

6. 发明申请

US20100246133A1 METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL 有权
标题翻译：用于分配热界面材料的方法和装置
公开(公告)号：US20100246133A1
公开(公告)日：2010-09-30
申请号：US12415760
申请日：2009-03-31
申请人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
发明人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
IPC分类号： H05K7/20 , H01L23/40 , H01L21/50 , F28F7/00
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译：本发明的实施例提供一种用于分配热界面材料的系统。该系统包括：集成电路芯片; 散热器以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布集成电路芯片。

7. 发明授权

US08768530B2 Thermal zone monitoring in an electronic device 有权
标题翻译：电子设备中的热区监控
公开(公告)号：US08768530B2
公开(公告)日：2014-07-01
申请号：US12861770
申请日：2010-08-23
申请人： Frank Faqiu Liang , Jay S. Nigen , Amaury J. Heresztyn , Keith Cox
发明人： Frank Faqiu Liang , Jay S. Nigen , Amaury J. Heresztyn , Keith Cox
IPC分类号： G05D11/00
CPC分类号： G05D23/1932 , G06F1/206 , Y02D10/16
摘要： A predefined mathematical relationship that is stored in the memory of a computing system is accessed, wherein the relationship refers to temperatures of a number of points in the system, wherein the points together define a zone. The mathematical relationship yields a representative temperature for the zone. Temperature data from sensors in the system is obtained and applied to thermal models, to estimate the temperatures of at least some of the points that define the zone. The representative temperature for the zone is computed using the estimated temperatures as input to the mathematical relationship. A decision is then made on whether or not to change a power consuming activity limit in the system, based on the computed representative temperature. Other embodiments are also described and claimed.
摘要翻译：访问存储在计算系统的存储器中的预定义的数学关系，其中所述关系是指系统中多个点的温度，其中所述点一起限定区域。数学关系产生了该区域的代表性温度。获得系统中传感器的温度数据，并应用于热模型，以估计定义区域的至少一些点的温度。使用估计的温度作为数学关系的输入来计算区域的代表性温度。然后，基于计算出的代表温度来决定是否改变系统中的功耗活动极限。还描述和要求保护其他实施例。

8. 发明授权

US08347952B2 Enhanced vent for outlet for a cooling system 有权
标题翻译：增强冷却系统出口通风口
公开(公告)号：US08347952B2
公开(公告)日：2013-01-08
申请号：US11607571
申请日：2006-11-30
申请人： Ihab A. Ali , Jay S. Nigen
发明人： Ihab A. Ali , Jay S. Nigen
IPC分类号： H05K7/20 , F28F13/12
CPC分类号： G06F1/203
摘要： A cooling mechanism includes a first heat exchanger, a first fluid-flow port, and a second fluid-flow port. The first heat exchanger includes a forced-fluid driver and is configured to pump heat from inside an enclosed area to outside of the enclosed area. Furthermore, the first fluid-flow port is configured to accommodate a first fluid flow into the enclosed area and the second fluid-flow port is configured to accommodate a second fluid flow from the enclosed area. Note that the first fluid-flow port and the second fluid-flow port are approximately coplanar. In addition, a given fluid-flow port, which may be either or both of the fluid-flow ports, is tapered to have an associated cross-sectional area which is smaller at an edge of the given fluid-flow port that is proximate to the outside of the enclosed area than at an edge of the given fluid-flow port that is proximate to the inside of the enclosed area.
摘要翻译：冷却机构包括第一热交换器，第一流体流通口和第二流体流动端口。第一热交换器包括强制流体驱动器，并且构造成将热量从封闭区域内部泵送到封闭区域的外部。此外，第一流体流动端口构造成容纳第一流体流入封闭区域，并且第二流体流动端口构造成容纳来自封闭区域的第二流体流。注意，第一流体流动端口和第二流体流动端口近似共面。此外，可以是流体流动端口中的一个或两个的给定流体流动端口是锥形的，以具有在给定的流体流动端口的边缘处更接近的相关联的横截面面积封闭区域的外侧比在靠近封闭区域内部的给定流体流动端口的边缘处。

9. 发明申请

US20120162751A1 OPTICAL COATING FOR ELECTRONIC DEVICE DISPLAY 审中-公开
标题翻译：用于电子设备显示的光学涂层
公开(公告)号：US20120162751A1
公开(公告)日：2012-06-28
申请号：US12977879
申请日：2010-12-23
申请人： Frank F. Liang , Phillip L. Mort , Amaury J. Heresztyn , Jay S. Nigen , Simon Prakash , John P. Ternus
发明人： Frank F. Liang , Phillip L. Mort , Amaury J. Heresztyn , Jay S. Nigen , Simon Prakash , John P. Ternus
IPC分类号： G02B5/26 , B05D5/06
CPC分类号： G02B1/10 , G02B5/26 , G06F1/20 , G06F1/203
摘要： An optical coating includes multiple layers of different materials and thicknesses and is disposed proximate a transparent display cover for an electronic device display. The optical coating transmits most visible light, reflects most non-visible light and substantially absorbs blackbody radiation generated from within the electronic device. The optical coating can be readily removable from the electronic device display either alone or in combination with a removable transparent display cover. The multiple layers comprise two or more materials having alternating low and high indices of refraction, and can include 36 or more layers, each having a thickness ranging from 10 to 400 nanometers. The arrangement and thicknesses of the layers are designed based upon the thickness and optical properties of the transparent display cover.
摘要翻译：光学涂层包括多层不同的材料和厚度，并且靠近用于电子设备显示器的透明显示器盖布置。光学涂层透射最可见的光，反射大多数不可见光并且基本上吸收从电子设备内产生的黑体辐射。光学涂层可以容易地从电子设备显示器单独地或与可移除的透明显示器盖组合地移除。多层包括具有交替的低折射率和高折射率的两种或更多种材料，并且可以包括36层或更多层，每层具有10至400纳米的厚度。基于透明显示器盖的厚度和光学特性来设计层的布置和厚度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式