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    • 4. 发明授权
    • Enclosure assembly housing at least one electronic board assembly and systems using same
    • 外壳组件容纳至少一个电子板组件和使用其的系统
    • US08773864B2
    • 2014-07-08
    • US12141799
    • 2008-06-18
    • John W. RappNicholas J. NagurnyBrent I. GouldeyMark JonesWendy S. Normark
    • John W. RappNicholas J. NagurnyBrent I. GouldeyMark JonesWendy S. Normark
    • H05K5/00
    • H05K7/1434
    • Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface defining an interior space and an inner diameter. At least one electronic board assembly is positioned within the interior space and includes a first peripheral edge region and an opposing second peripheral edge region. The electronic board assembly extends diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface. In another embodiment, a plurality of electronic board assemblies are positioned within the interior space and each extends generally along a respective non-diametric chord defined by the interior surface.
    • 本发明的各种实施例涉及容纳至少一个电子板组件和可以采用这种外壳组件的系统(例如,导弹或无人驾驶车辆)的外壳组件。 在一个实施例中,外壳组件包括具有限定内部空间和内径的内表面的外壳。 至少一个电子板组件位于内部空间内,并且包括第一周边边缘区域和相对的第二周边边缘区域。 电子板组件沿径向延伸,使得第一和第二周边边缘区域至少靠近内表面。 在另一个实施例中,多个电子板组件定位在内部空间内,并且每个电子板组件大致沿着由内表面限定的相应的非直径弦延伸。