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    • 3. 发明申请
    • METHOD OF MANUFACTURING THIN FILM DEVICE AND THIN FILM DEVICE MANUFACTURED USING THE SAME
    • 制造薄膜装置的方法和使用其制造的薄膜装置
    • US20100255344A1
    • 2010-10-07
    • US12545658
    • 2009-08-21
    • Boum Seock KimYongsoo OhSang Jin KimHwan-Soo Lee
    • Boum Seock KimYongsoo OhSang Jin KimHwan-Soo Lee
    • B32B9/00H01L21/28
    • H01L21/268H01L29/7869
    • There is provided a method of manufacturing a thin film device and a thin film device manufactured using the same. The method includes forming a sacrificial layer using a first oxide having a perovskite structure on a preliminary substrate; forming an electrode layer using a second oxide having a perovskite structure on the sacrificial layer; forming a thin film laminate on the electrode layer; bonding a permanent substrate onto the thin film laminate; decomposing the sacrificial layer by irradiating a laser onto the preliminary substrate; and separating the preliminary substrate from the electrode layer. During a laser lift-off process, degradation of properties caused by oxygen diffusion can be prevented. Since the electrode layer has thermal conductivity lower than an existing metal electrode, heat emission can be considerably reduced and the sacrificial layer can be easily decomposed by heat accumulation. Therefore, a thin film device having excellent properties can be manufactured.
    • 提供一种制造薄膜器件的方法和使用其制造的薄膜器件。 该方法包括使用在初步衬底上具有钙钛矿结构的第一氧化物形成牺牲层; 在牺牲层上使用具有钙钛矿结构的第二氧化物形成电极层; 在所述电极层上形成薄膜层叠体; 将永久性基板粘合到薄膜层压板上; 通过将激光照射到预备衬底上来分解牺牲层; 并将预备衬底与电极层分离。 在激光剥离过程中,可以防止由氧扩散引起的性能的劣化。 由于电极层的热导率低于现有的金属电极,因此能够大幅度地减少发热,并且牺牲层容易被热积聚分解。 因此,可以制造具有优异性能的薄膜器件。
    • 4. 发明申请
    • ULTRASONIC SENSOR
    • 超声波传感器
    • US20130043764A1
    • 2013-02-21
    • US13568635
    • 2012-08-07
    • Boum Seock KimSung Kwon WiEun Tae Park
    • Boum Seock KimSung Kwon WiEun Tae Park
    • G01H11/08
    • G01H11/08
    • Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof.
    • 本文公开了一种超声波传感器,包括:导电壳体; 通过导电粘合剂固定到壳体的底表面的压电元件; 位于所述压电元件上的温度补偿电容器; 第一引线并且电连接到温度补偿电容器的一个表面; 将温度补偿电容器的一个表面和壳体彼此电连接的第一线; 第二引线并且电连接到温度补偿电容器的另一个表面; 将所述温度补偿电容器的另一表面与所述压电元件的上表面彼此电连接的第二线; 以及固定部件,其将所述第一引线和所述第一引线固定到所述温度补偿电容器的一个表面,并将所述第二引线和所述第二引线固定到所述温度补偿电容器的另一个表面。
    • 5. 发明申请
    • ULTRASONIC SENSOR
    • 超声波传感器
    • US20130042690A1
    • 2013-02-21
    • US13326127
    • 2011-12-14
    • Boum Seock KimEun Tae Park
    • Boum Seock KimEun Tae Park
    • G01N29/22
    • G01N29/2437G01N29/32G10K9/12G10K11/002
    • Disclosed herein is an ultrasonic sensor including: a case; a piezoelectric element mounted on an inner side bottom surface of the case; a first sound absorbing material having a through-hole formed at an area thereof corresponding to a mounting area of the piezoelectric element and including the piezoelectric element disposed at a portion thereof based on a thickness of the through-hole; and a second sound absorbing material formed on the first sound absorbing material so as to cover the entire surface of the first sound absorbing material including the through-hole, wherein the through-hole formed has a thickness thicker than that of the piezoelectric element.
    • 本文公开了一种超声波传感器,包括:壳体; 安装在壳体的内侧底面上的压电元件; 第一吸音材料,其具有形成在与压电元件的安装面积相对应的区域的通孔,并且包括基于通孔的厚度设置在其一部分的压电元件; 以及形成在第一吸声材料上以覆盖包括通孔的第一吸声材料的整个表面的第二吸声材料,其中形成的通孔具有比压电元件的厚度更厚的厚度。
    • 6. 发明申请
    • ULTRASONIC SENSOR
    • 超声波传感器
    • US20120313484A1
    • 2012-12-13
    • US13464498
    • 2012-05-04
    • Boum Seock KimSung Kwon WiEun Tae Park
    • Boum Seock KimSung Kwon WiEun Tae Park
    • H01L41/04
    • H01L41/313B06B1/0651
    • Disclosed herein is an ultrasonic sensor, including: a conductive case having at least one groove disposed on a bottom surface thereof; a piezoelectric element fixed to the bottom surface of the case through a non-conductive adhesive; a conductive adhesive injected into the groove to electrically connect the case to the piezoelectric element; a temperature compensation capacitor disposed on an upper portion of the piezoelectric element; a first lead wire led-in from the outside of the case and being electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; and a second lead wire led-in from the outside of the case and being electrically connected to the other surface of the temperature compensation capacitor and the case.
    • 本文公开了一种超声波传感器,包括:导电壳体,其具有设置在其底表面上的至少一个凹槽; 通过非导电粘合剂固定到壳体的底表面的压电元件; 注入到所述槽中以将所述壳体电连接到所述压电元件的导电粘合剂; 设置在所述压电元件的上部的温度补偿电容器; 第一引线从壳体的外部引入并且与温度补偿电容器和压电元件的一个表面电连接; 以及从壳体的外部引入并与温度补偿电容器和壳体的另一个表面电连接的第二引线。
    • 9. 发明申请
    • ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME
    • 超声波传感器及其制造方法
    • US20130081470A1
    • 2013-04-04
    • US13328187
    • 2011-12-16
    • Boum Seock KimJung Min ParkEun Tae Park
    • Boum Seock KimJung Min ParkEun Tae Park
    • G01N29/22H04R17/00
    • G01N29/2437H04R17/00Y10T29/42
    • Disclosed herein are an ultrasonic sensor including: a cylindrical case; a piezoelectric element; a sound absorbing material; a temperature compensation capacitor inserted into and fixed to the groove; a first pin terminal connected to one electrode of the temperature compensation capacitor and an exposed electrode of the piezoelectric element while penetrating through the groove of the sound absorbing material; a second pin terminal inserted into and fixed to the groove of the sound absorbing material and connected to the other electrode of the temperature compensation capacitor; and a lead wire inserted into and fixed to the groove of the sound absorbing material and having one terminal connected to the second pin terminal and the other terminal connected to an inner wall of the case, and a method for manufacturing the same.
    • 本文公开了一种超声波传感器,包括:圆筒形壳体; 压电元件; 吸音材料; 插入并固定到凹槽的温度补偿电容器; 连接到温度补偿电容器的一个电极的第一引脚端子和穿过吸声材料的凹槽的压电元件的暴露电极; 第二引脚端子插入并固定到吸声材料的凹槽并连接到温度补偿电容器的另一个电极; 以及插入固定到吸声材料的槽的引线,并且具有连接到第二引脚端子的一个端子和连接到壳体的内壁的另一端子的引线及其制造方法。
    • 10. 发明申请
    • MULTI-SENSING APPARATUS AND METHOD THEREOF
    • 多感测装置及其方法
    • US20130081469A1
    • 2013-04-04
    • US13328249
    • 2011-12-16
    • Boum Seock Kim
    • Boum Seock Kim
    • G01N29/04
    • G01S15/107G01S7/523G01S2015/932
    • Disclosed herein are a multi-sensing apparatus and a method thereof. The multi-sensing apparatus includes a plurality of ultrasonic sensors including a wave transmission unit transmitting an ultrasonic wave signal of a corresponding transmission frequency, and a wave reception unit receiving and outputting the ultrasonic wave signal transmitted from the wave transmission unit, and an analyzed integrated circuit controlling each of the wave transmission units of the plurality of ultrasonic sensors to transmit the ultrasonic wave signal of the corresponding transmission frequency, receiving an ultrasonic reflected signal received from each of the reception wave units, and computing and outputting a distance of an object sensed by a corresponding ultrasonic sensor using a time difference between a transmission time and a reception time.
    • 这里公开了一种多感测装置及其方法。 多感测装置包括多个超声波传感器,包括发送相应的发送频率的超声波信号的波发送单元和接收并输出从波发送单元发送的超声波信号的波接收单元, 电路,控制多个超声波传感器中的每个波传播单元,以发送对应的传输频率的超声波信号,接收从每个接收波单元接收的超声波反射信号,以及计算和输出被检测物体的距离 通过使用传输时间和接收时间之间的时间差的相应的超声波传感器。