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1. 发明申请

US20130043764A1 ULTRASONIC SENSOR 审中-公开
标题翻译：超声波传感器
公开(公告)号：US20130043764A1
公开(公告)日：2013-02-21
申请号：US13568635
申请日：2012-08-07
申请人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
发明人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
IPC分类号： G01H11/08
CPC分类号： G01H11/08
摘要： Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof.
摘要翻译：本文公开了一种超声波传感器，包括：导电壳体; 通过导电粘合剂固定到壳体的底表面的压电元件; 位于所述压电元件上的温度补偿电容器; 第一引线并且电连接到温度补偿电容器的一个表面; 将温度补偿电容器的一个表面和壳体彼此电连接的第一线; 第二引线并且电连接到温度补偿电容器的另一个表面; 将所述温度补偿电容器的另一表面与所述压电元件的上表面彼此电连接的第二线; 以及固定部件，其将所述第一引线和所述第一引线固定到所述温度补偿电容器的一个表面，并将所述第二引线和所述第二引线固定到所述温度补偿电容器的另一个表面。

2. 发明申请

US20120313484A1 ULTRASONIC SENSOR 审中-公开
标题翻译：超声波传感器
公开(公告)号：US20120313484A1
公开(公告)日：2012-12-13
申请号：US13464498
申请日：2012-05-04
申请人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
发明人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
IPC分类号： H01L41/04
CPC分类号： H01L41/313 , B06B1/0651
摘要： Disclosed herein is an ultrasonic sensor, including: a conductive case having at least one groove disposed on a bottom surface thereof; a piezoelectric element fixed to the bottom surface of the case through a non-conductive adhesive; a conductive adhesive injected into the groove to electrically connect the case to the piezoelectric element; a temperature compensation capacitor disposed on an upper portion of the piezoelectric element; a first lead wire led-in from the outside of the case and being electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; and a second lead wire led-in from the outside of the case and being electrically connected to the other surface of the temperature compensation capacitor and the case.
摘要翻译：本文公开了一种超声波传感器，包括：导电壳体，其具有设置在其底表面上的至少一个凹槽; 通过非导电粘合剂固定到壳体的底表面的压电元件; 注入到所述槽中以将所述壳体电连接到所述压电元件的导电粘合剂; 设置在所述压电元件的上部的温度补偿电容器; 第一引线从壳体的外部引入并且与温度补偿电容器和压电元件的一个表面电连接; 以及从壳体的外部引入并与温度补偿电容器和壳体的另一个表面电连接的第二引线。

3. 发明申请

US20120326563A1 ULTRASONIC SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：超声波传感器及其制造方法
公开(公告)号：US20120326563A1
公开(公告)日：2012-12-27
申请号：US13462756
申请日：2012-05-02
申请人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
发明人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
IPC分类号： H01L41/04 , B29C45/14
CPC分类号： B29C45/1671 , B06B1/06 , B29C45/14639 , G01H11/08 , H01L41/042 , H01L41/1132 , H01L41/25
摘要： Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a conductive case; a piezoelectric element fixed to a bottom. surface of the case through a conductive adhesive; a temperature compensation capacitor positioned over the piezoelectric element; a first lead wire lead from the outside of the case and electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; a second lead wire lead from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor and the case; and a first molding part closely adhered to outer portions of the temperature compensation capacitor and the first and second lead wires.
摘要翻译：这里公开了一种超声波传感器及其制造方法。超声波传感器包括：导电壳体; 固定在底部的压电元件。表壳通过导电胶粘剂; 位于所述压电元件上方的温度补偿电容器; 第一引线从壳体的外部引出并且电连接到温度补偿电容器和压电元件的一个表面; 第二引线从壳体的外部引出并且电连接到温度补偿电容器和壳体的另一个表面; 以及与温度补偿电容器和第一和第二引线的外部紧密粘合的第一模制部件。

4. 发明申请

US20130020842A1 PIEZOELECTRIC MODULE AND SEAT FOR VEHICLE INCLUDING THE SAME 审中-公开
标题翻译：用于车辆的压电模块和座椅包括它们
公开(公告)号：US20130020842A1
公开(公告)日：2013-01-24
申请号：US13489787
申请日：2012-06-06
申请人： Ju Hwan Yang , Dong Hyeok Choi , Boum Seock Kim , Sung Kwon Wi , Sung Ho Lee
发明人： Ju Hwan Yang , Dong Hyeok Choi , Boum Seock Kim , Sung Kwon Wi , Sung Ho Lee
IPC分类号： B60H1/22 , B60N2/56
CPC分类号： B60N2/5692
摘要： Disclosed herein are a piezoelectric module and a sheet for a vehicle including the same. The sheet includes: a seat board part supporting a passenger's lower body; a backplate part formed to be extended in a direction perpendicular to one side of the seat board part and supporting the passenger's upper body; and a piezoelectric module formed in the seat board part and generating warm air or cold air using a flow of a current generated by vehicle vibration to thereby transfer the generated warm air or cold air to the passenger's body.
摘要翻译：这里公开了一种压电模块和一种包括该模块的车辆用片材。该片材包括：支撑乘客下身的座椅板部分; 形成为沿垂直于所述座椅板部的一侧的方向延伸并支撑乘客的上身的背板部; 以及形成在座椅基板部分中的压电模块，并且使用由车辆振动产生的电流流产生暖空气或冷空气，从而将产生的暖空气或冷空气转移到乘客身体。

5. 发明申请

US20130112000A1 ULTRASONIC SENSOR 审中-公开
标题翻译：超声波传感器
公开(公告)号：US20130112000A1
公开(公告)日：2013-05-09
申请号：US13350882
申请日：2012-01-16
申请人： Boum Seock Kim , Jung Min Park , Eun Tae Park
发明人： Boum Seock Kim , Jung Min Park , Eun Tae Park
IPC分类号： G01N29/04
CPC分类号： G01S7/521 , G01S7/52006 , G01S15/931
摘要： Disclosed herein is an ultrasonic sensor, including: a case partitioning an inner space; a temperature-compensation ceramic maintaining a temperature of a sensor to be constant; sockets accommodating the temperature-compensation ceramic; a negative (−) terminal and a positive (+) terminal connected to the sockets, respectively; a piezoelectric ceramic connected to the positive (+) terminal and vibrating when power is supplied thereto; and an acoustic absorbent absorbing vibration of the piezoelectric ceramic.
摘要翻译：这里公开了一种超声波传感器，包括：分隔内部空间的壳体; 将传感器的温度保持为恒定的温度补偿陶瓷; 容纳温度补偿陶瓷的插座; 分别连接到插座的负极（ - ）端子和正极（+）端子; 连接到正极（+）端子并在供电时振动的压电陶瓷; 以及吸收吸收振动的吸音体。

6. 发明申请

US20120038471A1 Haptic feedback actuator, haptic feedback device and electronic device 审中-公开
标题翻译：触觉反馈致动器，触觉反馈装置和电子装置
公开(公告)号：US20120038471A1
公开(公告)日：2012-02-16
申请号：US12926800
申请日：2010-12-09
申请人： Boum Seock Kim , Seung Gyo Jeong , Eun Tae Park
发明人： Boum Seock Kim , Seung Gyo Jeong , Eun Tae Park
IPC分类号： G08B6/00
CPC分类号： H04N1/00411 , G06F3/016 , G06F3/041
摘要： There is provided a haptic feedback actuator, a haptic feedback device and an electronic device. The haptic feedback actuator includes a support plate disposed in a lower portion of a haptic device; one or more actuators disposed on the support plate, each having one end towards a central portion of the support plate and the other end towards a corner of the support plate, and generating vibrations so as to give different types of haptic feedback according to a change in contact pressure applied to the haptic device; and one or more dividing portions, each penetrating the support plate in a thickness direction thereof and dividing the support plate into vibration areas corresponding to the respective actuators.
摘要翻译：提供了触觉反馈致动器，触觉反馈装置和电子装置。触觉反馈致动器包括设置在触觉装置的下部的支撑板; 一个或多个致动器，其设置在支撑板上，每个具有朝向支撑板的中心部分的一端，另一端朝向支撑板的角部，并且产生振动，以便根据变化产生不同类型的触觉反馈施加到触觉装置的接触压力; 以及一个或多个分割部分，每个分割部分在其厚度方向上穿过支撑板并将支撑板分成与各个致动器相对应的振动区域。

7. 发明申请

US20130042690A1 ULTRASONIC SENSOR 审中-公开
标题翻译：超声波传感器
公开(公告)号：US20130042690A1
公开(公告)日：2013-02-21
申请号：US13326127
申请日：2011-12-14
申请人： Boum Seock Kim , Eun Tae Park
发明人： Boum Seock Kim , Eun Tae Park
IPC分类号： G01N29/22
CPC分类号： G01N29/2437 , G01N29/32 , G10K9/12 , G10K11/002
摘要： Disclosed herein is an ultrasonic sensor including: a case; a piezoelectric element mounted on an inner side bottom surface of the case; a first sound absorbing material having a through-hole formed at an area thereof corresponding to a mounting area of the piezoelectric element and including the piezoelectric element disposed at a portion thereof based on a thickness of the through-hole; and a second sound absorbing material formed on the first sound absorbing material so as to cover the entire surface of the first sound absorbing material including the through-hole, wherein the through-hole formed has a thickness thicker than that of the piezoelectric element.
摘要翻译：本文公开了一种超声波传感器，包括：壳体; 安装在壳体的内侧底面上的压电元件; 第一吸音材料，其具有形成在与压电元件的安装面积相对应的区域的通孔，并且包括基于通孔的厚度设置在其一部分的压电元件; 以及形成在第一吸声材料上以覆盖包括通孔的第一吸声材料的整个表面的第二吸声材料，其中形成的通孔具有比压电元件的厚度更厚的厚度。

8. 发明申请

US20120037588A1 Piezoelectric sealing cap and assembly including the same 审中-公开
标题翻译：压电密封盖和组件包括相同
公开(公告)号：US20120037588A1
公开(公告)日：2012-02-16
申请号：US12926745
申请日：2010-12-07
申请人： Boum Seock Kim , Seung Gyo Jeong , Eun Tae Park
发明人： Boum Seock Kim , Seung Gyo Jeong , Eun Tae Park
IPC分类号： B65D1/02
CPC分类号： B65D39/00 , B65D2539/001
摘要： Disclosed herein is a piezoelectric sealing cap, including: a piezoelectric element generating displacement by a driving voltage; and a sealing part formed to surround the piezoelectric element and sealing a bottle neck when the piezoelectric element is inserted into the bottle neck.
摘要翻译：本发明公开了一种压电密封盖，包括：通过驱动电压产生位移的压电元件; 以及当所述压电元件插入所述瓶颈时，形成为围绕所述压电元件并密封瓶颈的密封部。

9. 发明申请

US20130134833A1 ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：超声波传感器及其制造方法
公开(公告)号：US20130134833A1
公开(公告)日：2013-05-30
申请号：US13360680
申请日：2012-01-28
申请人： Boum Seock Kim , Jung Min Park , Eun Tae Park
发明人： Boum Seock Kim , Jung Min Park , Eun Tae Park
IPC分类号： G10K9/122 , H05K13/00
CPC分类号： G01H11/08 , Y10T29/42
摘要： Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a case having one end closed and the other end opened; a piezoelectric element fixedly coupled to one end of an inner portion of the case; a sound absorbing member coupled to an upper surface of the piezoelectric element so as to cover a portion of the piezoelectric element; a conductive member having one end connected to the piezoelectric element and the other end connected to the sound absorbing member; and a lead wire electrically coupled to the conductive member and the case.
摘要翻译：这里公开了一种超声波传感器及其制造方法。超声波传感器包括：一端封闭而另一端打开的壳体; 固定地连接到所述壳体的内部的一端的压电元件; 耦合到所述压电元件的上表面以便覆盖所述压电元件的一部分的吸音构件; 导电构件，其一端连接到压电元件，另一端连接到吸音构件; 以及与导电构件和壳体电耦合的引线。

10. 发明申请

US20130081470A1 ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：超声波传感器及其制造方法
公开(公告)号：US20130081470A1
公开(公告)日：2013-04-04
申请号：US13328187
申请日：2011-12-16
申请人： Boum Seock Kim , Jung Min Park , Eun Tae Park
发明人： Boum Seock Kim , Jung Min Park , Eun Tae Park
IPC分类号： G01N29/22 , H04R17/00
CPC分类号： G01N29/2437 , H04R17/00 , Y10T29/42
摘要： Disclosed herein are an ultrasonic sensor including: a cylindrical case; a piezoelectric element; a sound absorbing material; a temperature compensation capacitor inserted into and fixed to the groove; a first pin terminal connected to one electrode of the temperature compensation capacitor and an exposed electrode of the piezoelectric element while penetrating through the groove of the sound absorbing material; a second pin terminal inserted into and fixed to the groove of the sound absorbing material and connected to the other electrode of the temperature compensation capacitor; and a lead wire inserted into and fixed to the groove of the sound absorbing material and having one terminal connected to the second pin terminal and the other terminal connected to an inner wall of the case, and a method for manufacturing the same.
摘要翻译：本文公开了一种超声波传感器，包括：圆筒形壳体; 压电元件; 吸音材料; 插入并固定到凹槽的温度补偿电容器; 连接到温度补偿电容器的一个电极的第一引脚端子和穿过吸声材料的凹槽的压电元件的暴露电极; 第二引脚端子插入并固定到吸声材料的凹槽并连接到温度补偿电容器的另一个电极; 以及插入固定到吸声材料的槽的引线，并且具有连接到第二引脚端子的一个端子和连接到壳体的内壁的另一端子的引线及其制造方法。

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