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    • 2. 发明授权
    • Encapsulation of polymer based solid state devices with inorganic materials
    • 用无机材料封装聚合物基固态器件
    • US06873101B2
    • 2005-03-29
    • US10404323
    • 2003-04-01
    • Boo NilssonPhillip Bailey
    • Boo NilssonPhillip Bailey
    • H01L51/50H01L51/52H05B33/04H05B33/00
    • H05B33/04H01L51/5246H01L51/5253
    • Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.
    • 与受保护的装置一起公开了用于产生适于保护基于聚合物的电子装置(包括发光二极管和聚合物发射显示器)的保护性密封件的方法。 保护密封件包括在低温下施加的一个或多个氮化硅(SiN)或其它无机电介质的薄膜。 一个或多个非反应性金属层也可以存在于保护层中。 公开了包括保护层上的保护盖的其它实施例。 这些保护层提供具有足够的大气保护的封装,以使得足够用于商业应用的聚合物电子器件的保质期和应力寿命。
    • 4. 发明授权
    • Encapsulation of polymer-based solid state devices with inorganic materials
    • 用无机材料封装聚合物基固态器件
    • US06635989B1
    • 2003-10-21
    • US09368324
    • 1999-08-03
    • Boo NilssonPhillip Bailey
    • Boo NilssonPhillip Bailey
    • H05B3300
    • H05B33/04H01L51/5246H01L51/5253
    • Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.
    • 与受保护的装置一起公开了用于产生适于保护基于聚合物的电子装置(包括发光二极管和聚合物发射显示器)的保护性密封件的方法。 保护密封件包括在低温下施加的一个或多个氮化硅(SiN)或其它无机电介质的薄膜。 一个或多个非反应性金属层也可以存在于保护层中。 公开了包括保护层上的保护盖的其它实施例。 这些保护层提供具有足够的大气保护的封装,以使得足够用于商业应用的聚合物电子器件的保质期和应力寿命。