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    • 3. 发明授权
    • Electroluminescent laminate with thick film dielectric
    • 具有厚膜电介质的电致发光层压板
    • US5432015A
    • 1995-07-11
    • US52702
    • 1993-04-30
    • Xingwei WuJames A. R. StilesKen K. FooPhillip Bailey
    • Xingwei WuJames A. R. StilesKen K. FooPhillip Bailey
    • H05B33/10H05B33/12H05B33/22H05B33/26H05B33/28
    • H05B33/28H05B33/10H05B33/12H05B33/22H05B33/26Y10S117/904Y10S428/917Y10S438/94
    • An improved dielectric layer of an electroluminescent laminate, and method of preparation are provided. The dielectric layer is formed as a thick layer from a ceramic material to provide:a dielectric strength greater than about 1.0.times.10.sup.6 V/m;a dielectric constant such that the ratio of the dielectric constant of the dielectric material to that of the phosphor layer is greater than about 50:1;a thickness such that the ratio of the thickness of the dielectric layer to that of the phosphor layer is in the range of about 20:1 to 500:1; anda surface adjacent the phosphor layer which is compatible with the phosphor layer and sufficiently smooth that the phosphor layer illuminates generally uniformly at a given excitation voltage.The invention also provides for electrical connection of an electroluminescent laminate to voltage driving circuity with through hole technology. The invention also extends to laser scribing the transparent conductor lines of an electroluminescent laminate.
    • 提供了电致发光层压板的改进的介电层及其制备方法。 介电层由陶瓷材料形成为厚层,以提供:大于约1.0×10 6 V / m 2的介电强度; 介电常数使得介电材料的介电常数与荧光体层的介电常数之比大于约50:1; 使得电介质层的厚度与荧光体层的厚度的比率在约20:1至500:1的范围内的厚度; 以及与荧光体层相容并且足够光滑的磷光体层的表面,使得荧光体层在给定的激发电压下大致均匀地照射。 本发明还提供电致发光层压板与通孔技术的电压驱动电路的电连接。 本发明还延伸到激光刻划电致发光层压板的透明导体线。
    • 4. 发明授权
    • Encapsulation of polymer based solid state devices with inorganic materials
    • 用无机材料封装聚合物基固态器件
    • US06873101B2
    • 2005-03-29
    • US10404323
    • 2003-04-01
    • Boo NilssonPhillip Bailey
    • Boo NilssonPhillip Bailey
    • H01L51/50H01L51/52H05B33/04H05B33/00
    • H05B33/04H01L51/5246H01L51/5253
    • Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.
    • 与受保护的装置一起公开了用于产生适于保护基于聚合物的电子装置(包括发光二极管和聚合物发射显示器)的保护性密封件的方法。 保护密封件包括在低温下施加的一个或多个氮化硅(SiN)或其它无机电介质的薄膜。 一个或多个非反应性金属层也可以存在于保护层中。 公开了包括保护层上的保护盖的其它实施例。 这些保护层提供具有足够的大气保护的封装,以使得足够用于商业应用的聚合物电子器件的保质期和应力寿命。
    • 6. 发明授权
    • Encapsulation of polymer-based solid state devices with inorganic materials
    • 用无机材料封装聚合物基固态器件
    • US06635989B1
    • 2003-10-21
    • US09368324
    • 1999-08-03
    • Boo NilssonPhillip Bailey
    • Boo NilssonPhillip Bailey
    • H05B3300
    • H05B33/04H01L51/5246H01L51/5253
    • Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.
    • 与受保护的装置一起公开了用于产生适于保护基于聚合物的电子装置(包括发光二极管和聚合物发射显示器)的保护性密封件的方法。 保护密封件包括在低温下施加的一个或多个氮化硅(SiN)或其它无机电介质的薄膜。 一个或多个非反应性金属层也可以存在于保护层中。 公开了包括保护层上的保护盖的其它实施例。 这些保护层提供具有足够的大气保护的封装,以使得足够用于商业应用的聚合物电子器件的保质期和应力寿命。
    • 7. 发明授权
    • Mechanical scribing methods of forming a patterned metal layer in an electronic device
    • 在电子设备中形成图案化金属层的机械划线方法
    • US06430810B1
    • 2002-08-13
    • US09163715
    • 1998-09-30
    • Phillip Bailey
    • Phillip Bailey
    • H05K302
    • H05K3/043H01L51/0021H01L51/0038H01L51/5203Y10T29/49117Y10T29/49124Y10T29/49128Y10T29/49135Y10T29/49155Y10T29/49156Y10T83/0304Y10T83/0341Y10T83/0385
    • This invention pertains to methods of forming a patterned metal layer in an electronic device, wherein the metal layer is in contact with an underlying organic polymeric layer (e.g., a conductive or semiconductive organic polymeric layer), which methods comprise mechanically scribing the metal layer with a mechanical scribing instrument to form the patterned metal electrode. More specifically, this invention pertains to methods of forming a patterned metal layer in an electronic device, which device comprises, in contact sequence, a support layer, an organic polymeric layer, and said metal layer, said method comprising the step of mechanically scribing said metal layer with a mechanical scribing instrument to form said patterned metal layer; wherein said mechanical scribing instrument scribes through the entire thickness of said metal layer; wherein said mechanical scribing instrument scribes through none, some, or all of the thickness of said organic polymeric layer; wherein said mechanical scribing instrument scribes through none or some, but not all, of the thickness of said support layer.
    • 本发明涉及在电子器件中形成图案化金属层的方法,其中金属层与下面的有机聚合物层(例如,导电或半导体有机聚合物层)接触,该方法包括用金属层机械刻划金属层 用于形成图案化的金属电极的机械划线仪器。 更具体地,本发明涉及在电子器件中形成图案化金属层的方法,该器件以接触的顺序包括支撑层,有机聚合物层和所述金属层,所述方法包括以下步骤:机械地刻划所述 金属层,其具有机械划线仪器以形成所述图案化的金属层; 其中所述机械划线仪器穿过所述金属层的整个厚度; 其中所述机械划线仪器不穿过所述有机聚合物层的厚度,部分或全部; 其中所述机械划线仪器通过所述支撑层的厚度的任何一个而不是全部划线。
    • 9. 发明授权
    • Electroluminescent display panel
    • 电致发光显示面板
    • US5634835A
    • 1997-06-03
    • US447404
    • 1995-05-23
    • Xingwei WuJames A. R. StilesKen K. FooPhillip Bailey
    • Xingwei WuJames A. R. StilesKen K. FooPhillip Bailey
    • H05B33/10H05B33/12H05B33/22H05B33/26H05B33/28
    • H05B33/28H05B33/10H05B33/12H05B33/22H05B33/26Y10S117/904Y10S428/917Y10S438/94
    • An improved dielectric layer of an electroluminescent laminate, and method of preparation are provided. The dielectric layer is formed as a thick layer from a ceramic material to provide:a dielectric strength greater than about 1.0.times.10.sup.6 V/m;a dielectric constant such that the ratio of the dielectric constant of the dielectric material to that of the phosphor layer is greater than about 50:1;a thickness such that the ratio of the thickness of the dielectric layer to that of the phosphor layer is in the range of about 20:1 to 500:1; anda surface adjacent the phosphor layer which is compatible with the phosphor layer and sufficiently smooth that the phosphor layer illuminates generally uniformly at a given excitation voltage.The invention also provides for electrical connection of an electroluminescent laminate to voltage driving circuity with through-hole technology. The invention also extends to laser scribing the transparent conductor lines of an electroluminescent laminate.
    • 提供了电致发光层压板的改进的介电层及其制备方法。 介电层由陶瓷材料形成为厚层,以提供:大于约1.0×10 6 V / m 2的介电强度; 介电常数使得介电材料的介电常数与荧光体层的介电常数之比大于约50:1; 使得电介质层的厚度与荧光体层的厚度的比率在约20:1至500:1的范围内的厚度; 以及与荧光体层相容并且足够光滑的磷光体层的表面,使得荧光体层在给定的激发电压下大致均匀地照射。 本发明还提供电致发光层压板与通孔技术的电压驱动电路的电连接。 本发明还延伸到激光刻划电致发光层压板的透明导体线。