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    • 1. 发明申请
    • Target apparatus
    • 目标装置
    • US20060291607A1
    • 2006-12-28
    • US11471263
    • 2006-06-20
    • Bong HongJong ChaiMin LeeWon HwangMin HurSang KimDong AnIn JungHong ChangJoon KangSeong HongYu KimTae YangJung Kim
    • Bong HongJong ChaiMin LeeWon HwangMin HurSang KimDong AnIn JungHong ChangJoon KangSeong HongYu KimTae YangJung Kim
    • G21G1/06
    • H05H6/00G21G4/06
    • Provided is a target apparatus of high durability so that a thin film is not deformed or damaged under an environment of high temperature and high pressure generated during a nuclear reaction between proton and H218O concentrate, and a productivity of 18F can be increased. The target apparatus includes a cavity member having a cavity, in which H218O concentrate is received, for producing 18F using a nuclear reaction between proton irradiated onto the H218O concentrate in the cavity and the H218O concentrate. The cavity member includes: a front opening and a rear opening facing opposite directions to each other on the irradiation path of the proton, and connected to the cavity so that the cavity can be communicated with the outside; a front thin film and a rear thin film disposed to block the front opening and the rear opening, respectively; and a front reinforcing member and a rear reinforcing member coupled to the cavity member so as to support the front thin film and the rear thin film in order to prevent the front and rear thin films from being swelled due to a pressure rising in the cavity during the nuclear reaction, wherein the front reinforcing member includes a plurality of penetration holes penetrating the front reinforcing member in the irradiation direction of the proton.
    • 提供了一种高耐久性的目标装置,使得在质子与H 2 O之间的核反应中产生的高温高压环境下,薄膜不变形或损坏, SUP浓缩物,并且可提高 18F的生产率。 目标装置包括具有空腔的空腔构件,其中容纳有H 2 O 18 O 2浓缩物,用于使用核反应产生“18” 在质子辐射到空腔中的H 2 H 2 O 20浓缩物和H 2 O 18 O 2浓缩物之间。 空腔构件包括:在质子的照射路径上彼此相对的前开口和后开口,并且连接到空腔,使得空腔能够与外部连通; 设置成分别阻挡前开口和后开口的前薄膜和后薄膜; 以及连接到空腔构件的前部加强构件和后部加强构件,以便支撑前部薄膜和后部薄膜,以防止前后薄膜由于空腔中的压力升高而膨胀 核反应,其中前加强构件包括在质子的照射方向上穿透前加强构件的多个穿透孔。
    • 3. 发明申请
    • Detachable dustproof filtering device
    • 可拆卸防尘过滤装置
    • US20080016834A1
    • 2008-01-24
    • US11488658
    • 2006-07-19
    • Min Lee
    • Min Lee
    • B01D50/00
    • B01D46/10B01D2279/45
    • A detachable dustproof filtering device for network chassis is disclosed. The detachable dustproof filtering device includes a detachable filter cover and a filter. The filter cover is a sheet that breaths and its shape is designed according to the shape of the air inlet of the network chassis. By a connecting member, the filter cover is covered on outside of the air inlet while the filter is disposed on inner surface of the detachable filter cover, covering the air inlet completely. Air drawn by a fan passes through the filter first and then enters inner space of the chassis so that space inside the chassis keeps clean even being used for quite a long time.
    • 公开了一种用于网络机箱的可拆卸防尘过滤装置。 可拆卸的防尘过滤装置包括可拆卸的过滤器盖和过滤器。 过滤器盖是呼吸的片材,其形状根据网络底盘的进气口的形状设计。 通过连接构件,过滤器盖被覆盖在进气口的外侧,同时过滤器设置在可拆卸过滤器盖的内表面上,完全覆盖进气口。 由风扇抽出的空气首先通过过滤器,然后进入机箱的内部空间,使得机箱内的空间即使长时间使用也保持干净。
    • 5. 发明申请
    • Flexible printed circuit connector, flexible printed circuit inserted into the same, and display device having the same, and method thereof
    • 柔性印刷电路连接器,插入其中的柔性印刷电路,以及具有该柔性印刷电路连接器的显示装置及其方法
    • US20070128922A1
    • 2007-06-07
    • US11485211
    • 2006-07-12
    • Min Lee
    • Min Lee
    • H01R12/24
    • H01R12/79H01R12/57H01R12/7076H05K1/118H05K2203/1572
    • Disclosed is a flexible printed circuit connector capable of increasing the number of connecting terminals, a flexible printed circuit capable of increasing the width of a pad terminal connected to each of the connecting terminals, a display device having the flexible printed circuit connector, and a method thereof. The display device includes a display panel displaying an image, a driving circuit driving the display panel, a printed circuit board on which a plurality of signal generators generating a driving signal supplied to the driving circuit is mounted, a connector mounted on the printed circuit board, and a flexible printed circuit inserted into the connector. The connector includes a connector housing providing a connecting port, and at least two connecting terminal groups formed separately on different surfaces within the connector housing.
    • 公开了能够增加连接端子数量的柔性印刷电路连接器,能够增加连接到每个连接端子的焊盘端子的宽度的柔性印刷电路,具有柔性印刷电路连接器的显示装置和方法 其中。 显示装置包括显示图像的显示面板,驱动显示面板的驱动电路,安装了供给驱动电路的驱动信号的多个信号发生器的印刷电路基板,安装在印刷电路板上的连接器 以及插入连接器中的柔性印刷电路。 连接器包括提供连接端口的连接器壳体和在连接器壳体内的不同表面上分别形成的至少两个连接端子组。
    • 10. 发明申请
    • Method for forming polysilicon plug of semiconductor device
    • 用于形成半导体器件的多晶硅插塞的方法
    • US20050142867A1
    • 2005-06-30
    • US10879220
    • 2004-06-30
    • Hyung ParkMin LeeSang LeeHyun Sohn
    • Hyung ParkMin LeeSang LeeHyun Sohn
    • H01L21/28H01L21/3205H01L21/336H01L21/44H01L21/4763H01L21/60H01L21/768
    • H01L21/76897H01L21/7684
    • Disclosed is a method for forming a polysilicon plug of a semiconductor device. The method comprises the steps of: forming a stacked pattern of a wordline and a hard mask film on a semiconductor substrate comprising a cell region and a peripheral circuit region; forming a spacer on a sidewall of the stacked pattern; forming an interlayer insulating film on the semiconductor substrate; polishing the interlayer insulating film via a CMP process using the hard mask film as a polishing barrier film; forming a barrier film on the semiconductor substrate including the interlayer insulating film; selectively etching the barrier film and the interlayer insulating film to form a landing plug contact hole; depositing a polysilicon film filling the landing plug contact hole on the semiconductor substrate; blanket-etching the polysilicon film using the barrier film as an etching barrier film; and polishing the polysilicon film and the barrier film using the hard mask film as a polishing barrier film to form a polysilicon plug.
    • 公开了一种用于形成半导体器件的多晶硅插塞的方法。 该方法包括以下步骤:在包括单元区域和外围电路区域的半导体衬底上形成字线和硬掩模膜的堆叠图案; 在所述堆叠图案的侧壁上形成间隔物; 在半导体衬底上形成层间绝缘膜; 通过使用硬掩模膜作为抛光阻挡膜的CMP工艺来研磨层间绝缘膜; 在包括层间绝缘膜的半导体衬底上形成阻挡膜; 选择性地蚀刻阻挡膜和层间绝缘膜以形成着陆塞接触孔; 在所述半导体衬底上沉积填充所述着地插头接触孔的多晶硅膜; 使用阻挡膜作为蚀刻阻挡膜对多晶硅膜进行绝缘蚀刻; 并使用硬掩模膜作为抛光阻挡膜研磨多晶硅膜和阻挡膜以形成多晶硅插塞。