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    • 3. 发明申请
    • High voltage FET gate structure
    • 高压FET栅极结构
    • US20060001050A1
    • 2006-01-05
    • US11138888
    • 2005-05-26
    • Bin WangChih-Hsin Wang
    • Bin WangChih-Hsin Wang
    • H01L29/745H01L21/335
    • H01L29/4983H01L29/0653H01L29/4916H01L29/7833H01L29/7835H01L29/7836
    • A FET device for operation at high voltages includes a substrate, a first well and a second well within the substrate that are doped with implants of a first type and second type, respectively. The first and second wells define a p-n junction. A field oxide layer within the second well defines a first surface region to receive a drain contact. A third well is located at least partially in the first well, includes doped implants of the second type, and is adapted to receive a source contact. As such, the third well defines a channel between itself and the second well within the first well. A gate is disposed over the channel. At least a first portion of the gate is disposed over the p-n junction, and includes doped implants of the first type. A number of permutations are allowed for doping the remainder of the gate.
    • 用于在高电压下操作的FET器件包括分别掺杂有第一类型和第二类型的植入物的衬底,衬底内的第一阱和第二阱。 第一和第二阱限定p-n结。 第二阱内的场氧化物层限定了接收漏极接触的第一表面区域。 第三阱至少部分地位于第一阱中,包括第二类型的掺杂植入物,并且适于接收源极接触。 这样,第三井在第一井内定义了自身与第二井之间的通道。 通道上设置一个门。 栅极的至少第一部分设置在p-n结上方,并且包括第一类型的掺杂植入物。 许多排列允许掺杂栅极的其余部分。
    • 5. 发明授权
    • High voltage FET gate structure
    • 高压FET栅极结构
    • US07375398B2
    • 2008-05-20
    • US11138888
    • 2005-05-26
    • Bin WangChih-Hsin Wang
    • Bin WangChih-Hsin Wang
    • H01L23/62
    • H01L29/4983H01L29/0653H01L29/4916H01L29/7833H01L29/7835H01L29/7836
    • A FET device for operation at high voltages includes a substrate, a first well and a second well within the substrate that are doped with implants of a first type and second type, respectively. The first and second wells define a p-n junction. A field oxide layer within the second well defines a first surface region to receive a drain contact. A third well is located at least partially in the first well, includes doped implants of the second type, and is adapted to receive a source contact. As such, the third well defines a channel between itself and the second well within the first well. A gate is disposed over the channel. At least a first portion of the gate is disposed over the p-n junction, and includes doped implants of the first type. A number of permutations are allowed for doping the remainder of the gate.
    • 用于在高电压下操作的FET器件包括分别掺杂有第一类型和第二类型的植入物的衬底,衬底内的第一阱和第二阱。 第一和第二阱限定p-n结。 第二阱内的场氧化物层限定了接收漏极接触的第一表面区域。 第三阱至少部分地位于第一阱中,包括第二类型的掺杂植入物,并且适于接收源极接触。 这样,第三井在第一井内定义了自身与第二井之间的通道。 通道上设置一个门。 栅极的至少第一部分设置在p-n结上方,并且包括第一类型的掺杂植入物。 许多排列允许掺杂栅极的其余部分。
    • 8. 发明授权
    • Positive and negative voltage level shifter circuit
    • 正,负电压电平转换电路
    • US08270234B1
    • 2012-09-18
    • US13113303
    • 2011-05-23
    • Qiang TangBo WangChih-Hsin Wang
    • Qiang TangBo WangChih-Hsin Wang
    • G11C7/00
    • G11C7/1078G11C7/1084H03K3/356052H03K3/356113
    • A level shifter including a level shifter module configured to i) receive an input signal, wherein the input signal varies between a first level and a second level, ii) receive a first voltage supply signal and a second voltage supply signal, and iii) generate a latch control signal based on the input signal and one of the first voltage supply signal and the second voltage supply signal. The level shifter further includes a latch module configured to i) receive the latch control signal, ii) receive the second voltage supply signal and a third voltage supply signal, and iii) generate an output signal based on the latch control signal and one of the second voltage supply signal and the third voltage supply signal.
    • 一种电平移位器,包括电平移位器模块,其配置为i)接收输入信号,其中所述输入信号在第一电平和第二电平之间变化,ii)接收第一电压供应信号和第二电压供应信号,以及iii)产生 基于输入信号和第一电压供给信号和第二电压供给信号中的一个的锁存器控制信号。 电平移位器还包括锁存模块,其被配置为i)接收锁存控制信号,ii)接收第二电压供应信号和第三电压供应信号,以及iii)基于锁存控制信号产生输出信号,并且 第二电压供给信号和第三电压供给信号。
    • 10. 发明申请
    • ELECTRICALLY ALTERABLE NON-VOLATILE MEMORY CELLS AND ARRAYS
    • 电可更换的非易失性记忆细胞和阵列
    • US20070253257A1
    • 2007-11-01
    • US11380418
    • 2006-04-26
    • Chih-Hsin Wang
    • Chih-Hsin Wang
    • G11C16/04
    • H01L29/7885G11C16/0416G11C16/0433H01L27/115H01L27/11521H01L27/11558H01L29/42324
    • Nonvolatile memory cells and array are provided. The memory cell comprises a body, a source, a drain, and a charge storage region. The body comprises an n-type conductivity and is formed in a well of the n-type conductivity. The source and the drain have p-type conductivity and are formed in the well with a channel of the body defined therebetween. The charge storage region is disposed over and insulated from the channel by a channel insulator. Each cell further comprises a bias setting having a source voltage applied to the source, a well voltage applied to the well, and a drain voltage applied to the drain. A bias configuration for an erase operation of the memory cell is further provided, wherein the source voltage is sufficiently more negative with respect to the well voltage and is sufficiently more positive with respect to the drain voltage to inject hot holes onto the charge storage region. The cells can be arranged in row and column to form memory arrays and memory device.
    • 提供了非易失性存储单元和阵列。 存储单元包括主体,源极,漏极和电荷存储区域。 该主体包括n型导电性并形成在n型导电性的阱中。 源极和漏极具有p型导电性,并且在阱中形成有在其间限定的主体的沟道。 电荷存储区域通过沟道绝缘体设置在通道上并与通道绝缘。 每个单元还包括具有施加到源极的源极电压,施加到阱的阱电压和施加到漏极的漏极电压的偏置设置。 还提供了用于存储单元的擦除操作的偏置配置,其中源极电压相对于阱电压足够多地为负,并且相对于漏极电压而言足够地为正向,以将热空穴注入电荷存储区域。 单元格可以以行和列排列以形成存储器阵列和存储器件。