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1. 发明申请

US20060086945A1 Package structure for optical-electrical semiconductor 审中-公开
标题翻译：光电半导体封装结构
公开(公告)号：US20060086945A1
公开(公告)日：2006-04-27
申请号：US10973408
申请日：2004-10-27
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu , Ching-Hung Ko , Chun-Cheng Weng
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu , Ching-Hung Ko , Chun-Cheng Weng
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L25/0753 , H01L31/0203 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014
摘要： A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.
摘要翻译：描述了一种用于光电半导体的封装结构。封装结构具有用于传热的导热结构，并且整体形成为一体以提高其结构强度，而导热结构防止LED器件的过热延长寿命。封装结构降低了生产中的故障率，并提高了质量。当本发明应用于发光二极管封装中时，可以达到特殊要求并具有比现有技术更好的性能。

2. 发明申请

US20060082994A1 LED lamp 审中-公开
标题翻译：点灯
公开(公告)号：US20060082994A1
公开(公告)日：2006-04-20
申请号：US10965852
申请日：2004-10-18
申请人： Bily Wang , Jonnie Chuang , Ching-Hung Ko , Chun-Cheng Weng
发明人： Bily Wang , Jonnie Chuang , Ching-Hung Ko , Chun-Cheng Weng
IPC分类号： B60Q1/26
CPC分类号： F21V29/83 , F21K9/00 , F21V29/70 , F21Y2103/33 , F21Y2115/10 , H05K1/0206 , H05K3/0058
摘要： An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.
摘要翻译： LED灯使用多个LED作为光源。 LED灯具有壳体，导电层，PCB，多个LED和驱动电子器件。导电层被放置在壳体的内部。导电层是金属，铜或铝，或非金属，硅胶或云母，用于传导由当前的加热效应引起的PCB的热量。放置在导电层上表面的PCB用于安装LED。每个LED通过并联绕组或串联电连接到PCB，以提供光源。驱动电路与PCB电连接，用于驱动显色。

3. 发明申请

US20060034071A1 Light-emitting diode lamp 审中-公开
标题翻译：发光二极管灯
公开(公告)号：US20060034071A1
公开(公告)日：2006-02-16
申请号：US10915537
申请日：2004-08-11
申请人： Bily Wang , Jonnie Chuang , Ching-Hung Ko , Chun-Cheng Weng
发明人： Bily Wang , Jonnie Chuang , Ching-Hung Ko , Chun-Cheng Weng
IPC分类号： F21L4/00
CPC分类号： F21S8/00 , F21W2111/02 , F21Y2115/10
摘要： An LED lamp is enabled to evenly emit lights, and is provided with a single set of indicators to provide different colors of light, and as least comprises a tubular case, a circuit board and at least an LED. The inner wall of the tubular case has a rough, light-homogenizing layer disposed thereon. The circuit board is provided together with a control unit on the bottom of the tubular case. The color mixing LED is provided on the circuit board.
摘要翻译： LED灯能够均匀地发光，并且设置有单组指示器以提供不同颜色的光，并且至少包括管状外壳，电路板和至少LED。管状壳体的内壁具有设置在其上的粗糙的轻质均质层。电路板与管状外壳底部的控制单元一起提供。混色LED设在电路板上。

4. 发明申请

US20120135201A1 Semiconductor Structures and Method for Fabricating the Same 有权
标题翻译：半导体结构及其制造方法
公开(公告)号：US20120135201A1
公开(公告)日：2012-05-31
申请号：US12956209
申请日：2010-11-30
申请人： Tsung-Chieh Chang , Ching-Hung Ko , Mu-Jia Liu
发明人： Tsung-Chieh Chang , Ching-Hung Ko , Mu-Jia Liu
IPC分类号： B32B3/22 , B32B37/02
CPC分类号： B32B7/14 , B32B17/06 , B32B37/12 , B32B2313/00 , B32B2457/14 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2224/10135 , H01L2224/11436 , H01L2224/1163 , H01L2224/13082 , H01L2224/13099 , H01L2224/1319 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/81139 , H01L2224/81191 , H01L2224/81201 , H01L2224/8134 , H01L2224/94 , Y10T156/10 , Y10T428/24562 , Y10T428/24744 , Y10T428/24826 , H01L2224/81 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor structure is provided. The semiconductor structure includes a first substrate, a second substrate opposite to the first substrate, a plurality of spacers disposed between the first substrate and the second substrate, and an adhesive material bonded with the first substrate and the second substrate within the two adjacent spacers. The invention also provides a method for fabricating the semiconductor structure.
摘要翻译：提供半导体结构。半导体结构包括第一基板，与第一基板相对的第二基板，设置在第一基板和第二基板之间的多个间隔件，以及在两个相邻间隔件内与第一基板和第二基板结合的粘合材料。本发明还提供了一种制造半导体结构的方法。

5. 发明授权

US08810721B2 Camera module 有权
标题翻译：相机模块
公开(公告)号：US08810721B2
公开(公告)日：2014-08-19
申请号：US13224512
申请日：2011-09-02
申请人： Chi-Kuen Hou , Ching-Hung Ko
发明人： Chi-Kuen Hou , Ching-Hung Ko
IPC分类号： H04N5/225
CPC分类号： H04N5/2257
摘要： A camera module includes a lens module, an image sensor, at least one first spacer, and a bump element. The lens module includes a lens unit and a supporting unit connected to the lens unit. The image sensor is disposed corresponding in position to the lens unit for sensing light from the lens unit. The first spacer is disposed between the supporting unit of the lens module and the image sensor for separating the lens module and the image sensor. The bump element is disposed on the supporting unit. The bump element is located between the first spacer and the lens unit for preventing the first spacer from contacting the lens unit.
摘要翻译：相机模块包括透镜模块，图像传感器，至少一个第一间隔件和凸块元件。透镜模块包括透镜单元和连接到透镜单元的支撑单元。图像传感器相对于透镜单元的位置对应地设置，用于感测来自透镜单元的光。第一间隔件设置在透镜模块的支撑单元和用于分离透镜模块和图像传感器的图像传感器之间。凸起元件设置在支撑单元上。凸起元件位于第一间隔件和透镜单元之间，用于防止第一间隔件接触透镜单元。

6. 发明授权

US08877323B2 Semiconductor structures and method for fabricating the same 有权
标题翻译：半导体结构及其制造方法
公开(公告)号：US08877323B2
公开(公告)日：2014-11-04
申请号：US12956209
申请日：2010-11-30
申请人： Tsung-Chieh Chang , Ching-Hung Ko , Mu-Jia Liu
发明人： Tsung-Chieh Chang , Ching-Hung Ko , Mu-Jia Liu
IPC分类号： B32B3/20 , B32B3/00 , B32B27/14 , H01L23/00 , B32B7/14 , B32B17/06 , B32B37/12
CPC分类号： B32B7/14 , B32B17/06 , B32B37/12 , B32B2313/00 , B32B2457/14 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2224/10135 , H01L2224/11436 , H01L2224/1163 , H01L2224/13082 , H01L2224/13099 , H01L2224/1319 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/81139 , H01L2224/81191 , H01L2224/81201 , H01L2224/8134 , H01L2224/94 , Y10T156/10 , Y10T428/24562 , Y10T428/24744 , Y10T428/24826 , H01L2224/81 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor structure is provided. The semiconductor structure includes a first substrate, a second substrate opposite to the first substrate, a plurality of spacers disposed between the first substrate and the second substrate, and an adhesive material bonded with the first substrate and the second substrate within the two adjacent spacers. The invention also provides a method for fabricating the semiconductor structure.
摘要翻译：提供半导体结构。半导体结构包括第一基板，与第一基板相对的第二基板，设置在第一基板和第二基板之间的多个间隔件，以及在两个相邻间隔件内与第一基板和第二基板结合的粘合材料。本发明还提供了一种制造半导体结构的方法。

7. 发明申请

US20130057755A1 Camera Module 有权
标题翻译：相机模块
公开(公告)号：US20130057755A1
公开(公告)日：2013-03-07
申请号：US13224512
申请日：2011-09-02
申请人： Chi-Kuen Hou , Ching-Hung Ko
发明人： Chi-Kuen Hou , Ching-Hung Ko
IPC分类号： H04N5/225
CPC分类号： H04N5/2257
摘要： A camera module includes a lens module, an image sensor, at least one first spacer, and a bump element. The lens module includes a lens unit and a supporting unit connected to the lens unit. The image sensor is disposed corresponding in position to the lens unit for sensing light from the lens unit. The first spacer is disposed between the supporting unit of the lens module and the image sensor for separating the lens module and the image sensor. The bump element is disposed on the supporting unit. The bump element is located between the first spacer and the lens unit for preventing the first spacer from contacting the lens unit.
摘要翻译：相机模块包括透镜模块，图像传感器，至少一个第一间隔件和凸块元件。透镜模块包括透镜单元和连接到透镜单元的支撑单元。图像传感器相对于透镜单元的位置对应地设置，用于感测来自透镜单元的光。第一间隔件设置在透镜模块的支撑单元和用于分离透镜模块和图像传感器的图像传感器之间。凸起元件设置在支撑单元上。凸起元件位于第一间隔件和透镜单元之间，用于防止第一间隔件接触透镜单元。

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