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1. 发明申请

US20060086945A1 Package structure for optical-electrical semiconductor 审中-公开
标题翻译：光电半导体封装结构
公开(公告)号：US20060086945A1
公开(公告)日：2006-04-27
申请号：US10973408
申请日：2004-10-27
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu , Ching-Hung Ko , Chun-Cheng Weng
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu , Ching-Hung Ko , Chun-Cheng Weng
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L25/0753 , H01L31/0203 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014
摘要： A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.
摘要翻译：描述了一种用于光电半导体的封装结构。封装结构具有用于传热的导热结构，并且整体形成为一体以提高其结构强度，而导热结构防止LED器件的过热延长寿命。封装结构降低了生产中的故障率，并提高了质量。当本发明应用于发光二极管封装中时，可以达到特殊要求并具有比现有技术更好的性能。

2. 发明申请

US20050135113A1 Optical projection device of a colored lighting module 审中-公开
标题翻译：彩色照明模块的光学投影装置
公开(公告)号：US20050135113A1
公开(公告)日：2005-06-23
申请号：US10737904
申请日：2003-12-18
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： F21K99/00 , H01L33/58 , H01L33/60 , F21V7/04
CPC分类号： H01L33/60 , F21K9/69 , F21Y2115/10 , H01L33/58
摘要： An optical projection device with a colored lighting module has a mask, a lighting module and a lens. The mask has a receiving cavity formed therein, a first opening and a second opening relating to the first opening, the first opening and the second opening both communicating with the receiving cavity and respectively formed on two opposing sides of the mask, and the mask has a reflection layer disposed in an interior surface thereof. The lighting module and the lens are respectively disposed by the first and second openings of the mask.
摘要翻译：具有彩色照明模块的光学投影装置具有掩模，照明模块和透镜。掩模具有形成在其中的接收腔，与第一开口相关的第一开口和第二开口，第一开口和第二开口都与接收腔连通并分别形成在掩模的两个相对侧上，并且掩模具有设置在其内表面中的反射层。照明模块和透镜分别由掩模的第一和第二开口设置。

3. 发明授权

US07485480B2 Method of manufacturing high power light-emitting device package and structure thereof 失效
标题翻译：制造大功率发光器件封装的方法及其结构
公开(公告)号：US07485480B2
公开(公告)日：2009-02-03
申请号：US11524462
申请日：2006-09-21
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48247 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.
摘要翻译：一种制造大功率发光器件封装的方法及其结构，其方法包括以下步骤：（a）形成多个引线框架，每个引线框架包括散热元件和多个引线 ; （b）电镀每个引线框架的外表面; （c）在散热表面上涂覆导电凝胶; （d）在所述导电性凝胶上配置至少一个发光芯片; （e）在每个引线框架上形成密封剂; （f）将所述发光芯片的至少一个顶部电极与所述引线中的一个连接; （g）涂覆硅胶以覆盖一个发光芯片，并且在硅凝胶的顶表面上一体地形成聚焦光凸面; 和（h）切断连接杆以将引线框架彼此分离，从而形成多个高功率发光器件封装。

4. 发明申请

US20090014745A1 Method of manufacturing high power light-emitting device package and structure thereof 审中-公开
公开(公告)号：US20090014745A1
公开(公告)日：2009-01-15
申请号：US12232114
申请日：2008-09-11
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48247 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.

5. 发明申请

US20090009999A1 LED lamp structure and system with high-efficiency heat-dissipating function 有权
标题翻译： LED灯具结构和系统具有高效散热功能
公开(公告)号：US20090009999A1
公开(公告)日：2009-01-08
申请号：US11984447
申请日：2007-11-19
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： F21V29/00 , F21V21/00
CPC分类号： F21V29/83 , F21K9/00 , F21V29/70 , F21V29/71 , F21V29/773
摘要： An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.
摘要翻译：具有高效散热功能的LED灯具结构包括散热模块，发光模块，电力传输模块和壳体模块。散热模块具有多个散热翅片，并且散热翅片组合在一起形成径向形状和容纳空间。发光模块被接收在散热模块的接收空间中。电力传输模块与发光模块电连接。套管模块具有顶板主体，与顶板主体配合的底板体，以及设置在顶板主体和散热翅片之间的接合板体。顶板主体和联合板体均具有用于使发光模块曝光的开口。每个散热翅片具有与接合板体接触的顶面和与底板主体分离预定距离的底侧。

6. 发明授权

US07828464B2 LED lamp structure and system with high-efficiency heat-dissipating function 有权
标题翻译： LED灯具结构和系统具有高效散热功能
公开(公告)号：US07828464B2
公开(公告)日：2010-11-09
申请号：US11984447
申请日：2007-11-19
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： F21V29/00
CPC分类号： F21V29/83 , F21K9/00 , F21V29/70 , F21V29/71 , F21V29/773
摘要： An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.
摘要翻译：具有高效散热功能的LED灯具结构包括散热模块，发光模块，电力传输模块和壳体模块。散热模块具有多个散热翅片，并且散热翅片组合在一起形成径向形状和容纳空间。发光模块被接收在散热模块的接收空间中。电力传输模块与发光模块电连接。套管模块具有顶板主体，与顶板主体配合的底板体，以及设置在顶板主体和散热翅片之间的接合板体。顶板主体和联合板体均具有用于使发光模块曝光的开口。每个散热翅片具有与接合板体接触的顶面和与底板主体分离预定距离的底侧。

7. 发明申请

US20070133209A1 Electrical lamp apparatus 审中-公开
标题翻译：电灯装置
公开(公告)号：US20070133209A1
公开(公告)日：2007-06-14
申请号：US11297403
申请日：2005-12-09
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： F21V29/00 , F21V5/00
CPC分类号： F21V23/007 , F21K9/233 , F21V29/70 , F21V29/89 , F21Y2115/10
摘要： An electrical lamp apparatus includes a shade, a light-emitting unit and a light-focusing unit. After a power plug on the shade is connected to a power socket of the electrical lamp apparatus, the power plug supplies electrical power to light the light-emitting unit. The light from the light-emitting unit passes to a convex lens through a second channel of a second end face of the light-focusing unit, and then the light is projected through a first channel of the first end face of the light-focusing unit, whereby the light can be projected to a farther place.
摘要翻译：电灯装置包括遮光罩，发光单元和光聚焦单元。在灯罩上的电源插头连接到电灯装置的电源插座之后，电源插头提供电力来点亮发光单元。来自发光单元的光通过光聚焦单元的第二端面的第二通道传递到凸透镜，然后光通过聚光单元的第一端面的第一通道突出由此可以将光投射到更远的地方。

8. 发明申请

US20060071328A1 Semiconductor substrate structure 审中-公开
标题翻译：半导体衬底结构
公开(公告)号：US20060071328A1
公开(公告)日：2006-04-06
申请号：US11240405
申请日：2005-10-03
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L23/13 , H01L33/641 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A semiconductor substrate structure with a highly heat-conductive advantage increases packaging good rate and quality. Using semiconductor chip packaging, an electronic chip is easily made highly heat-conductive, and compared with the prior art, the present invention has superior good rate for substrate structure. The improved heat-conductive structure avoids the semiconductor chip overheating and affects the life of electronic device by directly connecting the chip to the heat-conductive base plate.
摘要翻译：具有高导热性的半导体衬底结构增加了封装的良好率和质量。使用半导体芯片封装，电子芯片容易制成高导热性，与现有技术相比，本发明具有优异的基板结构优良率。改进的导热结构避免了半导体芯片过热，并通过将芯片直接连接到导热基板来影响电子器件的使用寿命。

9. 发明申请

US20080073662A1 Method of manufacturing high power light-emitting device package and structure thereof 失效
标题翻译：制造大功率发光器件封装的方法及其结构
公开(公告)号：US20080073662A1
公开(公告)日：2008-03-27
申请号：US11524462
申请日：2006-09-21
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： H01L33/00 , H01L21/50
CPC分类号： H01L33/642 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48247 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.
摘要翻译：一种制造大功率发光器件封装的方法及其结构，其方法包括以下步骤：（a）形成多个引线框架，每个引线框架包括散热元件和多个引线 ; （b）电镀每个引线框架的外表面; （c）在散热表面上涂覆导电凝胶; （d）在所述导电性凝胶上配置至少一个发光芯片; （e）在每个引线框架上形成密封剂; （f）将所述发光芯片的至少一个顶部电极与所述引线中的一个连接; （g）涂覆硅胶以覆盖一个发光芯片，并且在硅凝胶的顶表面上一体地形成聚焦光凸面; 和（h）切断连接杆以将引线框架彼此分离，从而形成多个高功率发光器件封装。

10. 发明申请

US20070297177A1 Modular lamp structure 审中-公开
标题翻译：模块化灯泡结构
公开(公告)号：US20070297177A1
公开(公告)日：2007-12-27
申请号：US11475146
申请日：2006-06-27
申请人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
发明人： Bily Wang , Jonnie Chuang , Shih-Yu Wu
IPC分类号： F21V29/00
CPC分类号： F21V23/02 , F21V14/02 , F21V29/773 , F21Y2115/10
摘要： A modular lamp structure includes a housing, a base, an illumination module, and a control module. The housing has a receiving space. The base is disposed in the receiving space, the base including one end and other end. The illumination module is disposed on the one end of the base, and the control module is disposed on the other end of the base, the control module is connected electrically to the illumination module; Thereby the housing is dissipated heat from the lamp module.
摘要翻译：模块化灯结构包括壳体，基座，照明模块和控制模块。外壳有接收空间。基座设置在接收空间中，底座包括一端和另一端。照明模块设置在基座的一端，并且控制模块设置在基座的另一端，控制模块电连接到照明模块; 从而壳体从灯模块散热。

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