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1. 发明授权

US06546796B2 Liquid level sensor 有权
公开(公告)号：US06546796B2
公开(公告)日：2003-04-15
申请号：US09809480
申请日：2001-03-15
申请人： Bernd Zimmermann , David W. Reynolds , Richard E. Welch , Hank E. Millet
发明人： Bernd Zimmermann , David W. Reynolds , Richard E. Welch , Hank E. Millet
IPC分类号： G01F2327
CPC分类号： G01F15/022 , G01F23/246
摘要： An improved liquid level sensor is disclosed which provides a reliable and simple device for accurately determining the level of a liquid within a vessel. The sensor of the present invention utilizes a plurality of thermocouples grouped in pairs with the pairs being spaced along a line extending generally in the direction in which the liquid level may vary. A first thermocouple of each pair is located in relatively close thermal proximity to an electrically powered heater and the second of each pair of thermocouples is spaced away from the heater. The thermocouples are connected in series and produce a signal directly indicative of the level of the liquid along the sensor. Additionally, a pressure sensing circuit may also be incorporated with the liquid level sensor.

2. 发明授权

US08097955B2 Interconnect structures and methods 有权
标题翻译：互连结构和方法
公开(公告)号：US08097955B2
公开(公告)日：2012-01-17
申请号：US12252236
申请日：2008-10-15
申请人： Bernd Zimmermann , Volker Berghof , Stefan Ruckmich , Thorsten Schedel
发明人： Bernd Zimmermann , Volker Berghof , Stefan Ruckmich , Thorsten Schedel
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76898 , H01L23/481 , H01L25/0657 , H01L25/50 , H01L2224/05001 , H01L2224/05009 , H01L2224/051 , H01L2224/05568 , H01L2224/0557 , H01L2224/05647 , H01L2224/16147 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/013
摘要： Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material and has sidewalls. The interconnect structure includes a contact coupled to the conductive material in the via proximate the first side of the workpiece. The conductive material in the via comprises a recessed region comprising a landing zone proximate the second side of the workpiece.
摘要翻译：公开了互连结构和方法。在一个实施例中，互连结构包括通过工件从工件的第一侧延伸到工件的第二侧的通孔。通孔部分地填充有导电材料并具有侧壁。互连结构包括接近工件的第一侧的通孔中的导电材料的接触。通孔中的导电材料包括凹陷区域，该凹陷区域包括靠近工件第二侧的着陆区域。

3. 外观设计

USD637145S1 Tire tread of a vehicle tire 有权
标题翻译：轮胎轮胎胎面
公开(公告)号：USD637145S1
公开(公告)日：2011-05-03
申请号：US29338500
申请日：2009-06-12
申请人： Frank Lippert , Ralf Krieger , Bernd Zimmermann
设计人： Frank Lippert , Ralf Krieger , Bernd Zimmermann

4. 发明申请

US20100090317A1 Interconnect Structures and Methods 有权
标题翻译：互连结构和方法
公开(公告)号：US20100090317A1
公开(公告)日：2010-04-15
申请号：US12252236
申请日：2008-10-15
申请人： Bernd Zimmermann , Volker Berghof , Stefan Ruckmich , Thorsten Schedel
发明人： Bernd Zimmermann , Volker Berghof , Stefan Ruckmich , Thorsten Schedel
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L21/76898 , H01L23/481 , H01L25/0657 , H01L25/50 , H01L2224/05001 , H01L2224/05009 , H01L2224/051 , H01L2224/05568 , H01L2224/0557 , H01L2224/05647 , H01L2224/16147 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/013
摘要： Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material and has sidewalls. The interconnect structure includes a contact coupled to the conductive material in the via proximate the first side of the workpiece. The conductive material in the via comprises a recessed region comprising a landing zone proximate the second side of the workpiece.
摘要翻译：公开了互连结构和方法。在一个实施例中，互连结构包括通过工件从工件的第一侧延伸到工件的第二侧的通孔。通孔部分地填充有导电材料并具有侧壁。互连结构包括接近工件的第一侧的通孔中的导电材料的接触。通孔中的导电材料包括凹陷区域，该凹陷区域包括靠近工件第二侧的着陆区域。

5. 发明授权

US07579831B2 Test device for tubular specimens 有权
标题翻译：管状试样的试验装置
公开(公告)号：US07579831B2
公开(公告)日：2009-08-25
申请号：US11862356
申请日：2007-09-27
申请人： Bernd Zimmermann
发明人： Bernd Zimmermann
IPC分类号： G01N27/82
CPC分类号： G01N27/83 , G01N27/9013 , G01N27/902 , G01N27/904
摘要： A test device for testing of tubular specimens has a plurality of individual, radially movable, finger-shaped test probes which are placed from all sides on the outside of the specimen to be tested. In this way, the test specimen is surrounded by test probes and can be pushed under them. Each test probe has a first test coil with a surface which faces essentially parallel to the lengthwise axis of the specimen and a second test coil which is oriented essentially perpendicular to the lengthwise axis of the specimen. The test probes can be elastically deflectable, pivotably movable, or movable by a screw mechanism.
摘要翻译：用于测试管状试样的测试装置具有多个单独的，可径向移动的手指形状的测试探针，其从待测试样品的外侧的所有侧面放置。以这种方式，测试样本被测试探针包围并可以被推到它们下方。每个测试探针具有第一测试线圈，其具有基本上平行于试样的纵向轴线的表面和基本上垂直于试样的纵向轴线定向的第二测试线圈。测试探针可以通过螺旋机构弹性偏转，可枢转地移动或移动。

6. 发明申请

US20060265151A1 Fluid flow rate sensor 失效
标题翻译：流体流量传感器
公开(公告)号：US20060265151A1
公开(公告)日：2006-11-23
申请号：US11485562
申请日：2006-07-11
申请人： Michael DuHack , Bernd Zimmermann , Tung-Sheng Yang
发明人： Michael DuHack , Bernd Zimmermann , Tung-Sheng Yang
IPC分类号： G01F17/00 , G01F23/00
CPC分类号： G01F1/696 , G01F1/698 , G01F15/005
摘要： A valve body defines an inlet, an outlet, a valving cavity disposed between the inlet and outlet and a valving surface between the inlet and the outlet. A valve is moveable to a position away from the valving surface for permitting flow from the inlet through the valving cavity to the outlet. The fluid flow rate sensor comprises a probe having a detection module adapted to change condition in response to the presence of the flow of the fluid, a control module that is electrically connected to the probe that monitors the condition of the detection module over time (e.g., a temperature), determines a rate of change of that condition over time, and generates an output that is indicative of the rate of flow of the fluid, and a I/O module connected to the control module and communicating the output of the control module to another device or a user.
摘要翻译：阀体限定入口，出口，设置在入口和出口之间的阀腔以及入口和出口之间的阀表面。阀可移动到远离阀表面的位置，以允许从入口通过阀腔流到出口。流体流速传感器包括具有检测模块的探针，所述检测模块适于响应于流体流的存在而改变状态;控制模块，其电连接到探针，所述控制模块随时间监测检测模块的状态（例如，，温度）确定该条件随时间变化的速率，并且产生指示流体流量的输出和连接到控制模块的I / O模块并且传送控制的输出模块到另一个设备或用户。

7. 发明授权

US07906421B2 Method for applying solder to redistribution lines 有权
标题翻译：将焊料应用于再分配线的方法
公开(公告)号：US07906421B2
公开(公告)日：2011-03-15
申请号：US11766326
申请日：2007-06-21
申请人： Octavio Trovarelli , Martin Reiss , Bernd Zimmermann
发明人： Octavio Trovarelli , Martin Reiss , Bernd Zimmermann
IPC分类号： H01L21/00 , H01L21/44 , H01L21/4763
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05548 , H01L2224/05647 , H01L2224/1147 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/00014
摘要： In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.
摘要翻译：在制造电子元件的方法中，在半导体芯片的表面上形成导电再分配线。再分配线包括焊盘。覆盖材料形成在焊盘上方，再分配线的未覆盖部分被钝化。覆盖材料防止焊盘的钝化。然后在焊料焊盘上形成焊料，使得再分配线的未覆盖部分由于钝化而具有阻焊性能。

8. 发明授权

US07486068B2 Rotating head for nondestructive tests 有权
标题翻译：旋转头用于无损检测
公开(公告)号：US07486068B2
公开(公告)日：2009-02-03
申请号：US11613361
申请日：2006-12-20
申请人： Bernd Zimmermann
发明人： Bernd Zimmermann
IPC分类号： G01N27/72 , G01N27/90 , G01R33/12 , G01R15/00 , G01B7/30
CPC分类号： G01N27/9013 , G01N27/82 , G01N27/87 , G01N27/904
摘要： A rotating head for a device for the nondestructive testing of metallic test specimens has probe carriers, stray flux or eddy current sensors, a coupling ring and elastic coupling elements. In this way, tandem-like, roughly forced coupling of the pivoting motions of the probe carriers is produced.
摘要翻译：用于金属试样的非破坏性试验的装置的旋转头具有探针载体，杂散磁通或涡流传感器，耦合环和弹性耦合元件。以这种方式，产生了探针载体的枢转运动的串联状，大致强制的耦合。

9. 发明申请

US20070131021A1 Capacitive vapor sensor 有权
标题翻译：电容式蒸气传感器
公开(公告)号：US20070131021A1
公开(公告)日：2007-06-14
申请号：US11297752
申请日：2005-12-08
申请人： Prasad Khadkikar , Praveen Ramamurthy , Bernd Zimmermann
发明人： Prasad Khadkikar , Praveen Ramamurthy , Bernd Zimmermann
IPC分类号： G01N19/10
CPC分类号： G01N27/227
摘要： A sensor system for detecting the presence of a target analyte. The system comprises a first conductor, a second conductor, and a sensor film. The sensor film is positioned between the first conductor and the second conductor. The sensor film includes a crosslinked siloxane polymer comprising a monomer having a hydrocarbon side group. The sensor film has an absorptive affinity for the target analyte. The electrical capacitance of the sensor system changes upon absorption of the target analyte by the sensor film.
摘要翻译：用于检测目标分析物的存在的传感器系统。该系统包括第一导体，第二导体和传感器膜。传感器膜位于第一导体和第二导体之间。传感器膜包括交联硅氧烷聚合物，其包含具有烃侧基的单体。传感器膜对目标分析物具有吸收亲和力。当传感器膜吸收目标分析物时，传感器系统的电容发生变化。

10. 发明申请

US20050109103A1 Liquid level sensor 失效
公开(公告)号：US20050109103A1
公开(公告)日：2005-05-26
申请号：US11016514
申请日：2004-12-17
申请人： Bernd Zimmermann , David Reynolds , Richard Gerich
发明人： Bernd Zimmermann , David Reynolds , Richard Gerich
IPC分类号： G01F15/02 , G01F23/24 , G01F23/00
CPC分类号： G01F15/022 , G01F23/246
摘要： An improved liquid level sensor is disclosed which provides a reliable and simple device for accurately determining the level of a liquid within a vessel. The sensor utilizes a plurality of thermocouple junctions grouped in pairs with the pairs being spaced along a line extending generally in the direction in which the liquid level may vary. A first thermocouple junction of each pair is located in relatively close thermal proximity to an electrically powered heater and the second of each pair of thermocouple junctions is spaced away from the heater. The thermocouple junctions are connected in series and produce a signal indicative of the level of liquid along the sensor. Alternatively, a single threshold liquid level sensor is provided for use with a hermetic interface to provide a signal to indicate a level of liquid within a container. Additionally, a pressure sensing circuit may also be incorporated with either liquid level sensor.

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