专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07429210B2 Materials for chemical mechanical polishing 有权
标题翻译：化学机械抛光材料
公开(公告)号：US07429210B2
公开(公告)日：2008-09-30
申请号：US11626014
申请日：2007-01-23
申请人： Benjamin A. Bonner , Peter McReynolds , Gregory E. Menk , Anand N. Iyer , Gopalakrishna B. Prabhu , Erik S. Rondum , Robert L. Jackson , Garlen Leung
发明人： Benjamin A. Bonner , Peter McReynolds , Gregory E. Menk , Anand N. Iyer , Gopalakrishna B. Prabhu , Erik S. Rondum , Robert L. Jackson , Garlen Leung
IPC分类号： B24D11/00
CPC分类号： B24D11/00 , B24B7/228 , B24D2203/00
摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
摘要翻译：公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。

2. 发明授权

US07179159B2 Materials for chemical mechanical polishing 有权
标题翻译：化学机械抛光材料
公开(公告)号：US07179159B2
公开(公告)日：2007-02-20
申请号：US11119682
申请日：2005-05-02
申请人： Benjamin A. Bonner , Peter McReynolds , Gregory E. Menk , Anand N. Iyer , Gopalakrishna B. Prabhu , Erik S. Rondum , Robert L. Jackson , Garlen Leung
发明人： Benjamin A. Bonner , Peter McReynolds , Gregory E. Menk , Anand N. Iyer , Gopalakrishna B. Prabhu , Erik S. Rondum , Robert L. Jackson , Garlen Leung
IPC分类号： B24D11/00
CPC分类号： B24D11/00 , B24B7/228 , B24D2203/00
摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
摘要翻译：公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。

3. 发明授权

US07601050B2 Polishing apparatus with grooved subpad 有权
标题翻译：抛光装置带有凹槽的底垫
公开(公告)号：US07601050B2
公开(公告)日：2009-10-13
申请号：US11707651
申请日：2007-02-15
申请人： Steven M. Zuniga , Peter McReynolds , Erik S. Rondum , Benjamin A. Bonner , Henry H. Au , Gregory E. Menk , Gopalakrishna B. Prabhu , Anand N. Iyer , Garlen C. Leung
发明人： Steven M. Zuniga , Peter McReynolds , Erik S. Rondum , Benjamin A. Bonner , Henry H. Au , Gregory E. Menk , Gopalakrishna B. Prabhu , Anand N. Iyer , Garlen C. Leung
IPC分类号： B24B7/22
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.
摘要翻译：描述了抛光装置。抛光装置包括可旋转压板，驱动机构，用于逐渐推进具有沿着线性方向的研磨表面的抛光片横过压板，压板上的子垫以支撑抛光片，子板具有形成在其中的凹槽，以及真空源连接到子垫的凹槽，并被配置为施加足以将抛光片的一部分拉入到子垫的凹槽中以在抛光表面中引起凹槽的真空。

4. 发明申请

US20100112919A1 MONOLITHIC LINEAR POLISHING SHEET 审中-公开
标题翻译：单片线性抛光片
公开(公告)号：US20100112919A1
公开(公告)日：2010-05-06
申请号：US12263908
申请日：2008-11-03
申请人： Benjamin A. Bonner , Gopalakrishna B. Prabhu , Erik S. Rondum , Gregory E. Menk , Anand N. Iyer , Peter McReynolds , Garlen C. Leung
发明人： Benjamin A. Bonner , Gopalakrishna B. Prabhu , Erik S. Rondum , Gregory E. Menk , Anand N. Iyer , Peter McReynolds , Garlen C. Leung
IPC分类号： B24D11/00
CPC分类号： B24D11/003 , B24B21/004 , B24B37/205
摘要： A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.
摘要翻译：化学机械抛光制品可以是具有抛光表面的单个邻接层，该层是具有宽度和长度至少比宽度大至少四倍的长度的基本上矩形的片材。形成抛光制品可以包括在移动的带上沉积液体前体，在移动的带上至少部分地固化液体前体以形成抛光层，并且将抛光层与带分离。

5. 发明申请

US20090088051A1 LEADER AND TRAILER FOR LINEAR POLISHING SHEET 审中-公开
标题翻译：线性抛光片的领导者和追踪者
公开(公告)号：US20090088051A1
公开(公告)日：2009-04-02
申请号：US12239572
申请日：2008-09-26
申请人： Gregory E. Menk , Peter McReynolds , Benjamin A. Bonner , Erik S. Rondum , Gopalakrishna B. Prabhu
发明人： Gregory E. Menk , Peter McReynolds , Benjamin A. Bonner , Erik S. Rondum , Gopalakrishna B. Prabhu
IPC分类号： B24B21/00
CPC分类号： B24B37/042 , B24B21/004
摘要： A polishing article includes an elongated substantially rectangular central portion and a substantially rectangular edge portion. The central portion includes a polishing layer with a polishing surface. The central portion has a width, a length greater than the width and defining a longitudinal axis, and an edge. The edge portion extends from the edge of the central portion, the edge portion is thinner than the central portion, and the polishing layer does not extend onto the edge portion.
摘要翻译：抛光制品包括细长的大致矩形的中心部分和大致矩形的边缘部分。中心部分包括具有抛光表面的抛光层。中心部分具有宽度，长度大于宽度并限定纵向轴线和边缘。边缘部分从中心部分的边缘延伸，边缘部分比中心部分薄，并且抛光层不延伸到边缘部分上。

6. 发明授权

US06220941B1 Method of post CMP defect stability improvement 有权
公开(公告)号：US06220941B1
公开(公告)日：2001-04-24
申请号：US09164860
申请日：1998-10-01
申请人： Boris Fishkin , Charles C. Garretson , Peter McKeever , Thomas H. Osterheld , Gopalakrishna B. Prabhu , Doyle E. Bennett , Benjamin A. Bonner , Sidney Huey
发明人： Boris Fishkin , Charles C. Garretson , Peter McKeever , Thomas H. Osterheld , Gopalakrishna B. Prabhu , Doyle E. Bennett , Benjamin A. Bonner , Sidney Huey
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/04 , B24B57/02
摘要： The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

7. 发明授权

US06811470B2 Methods and compositions for chemical mechanical polishing shallow trench isolation substrates 有权
标题翻译：化学机械抛光浅沟槽隔离衬底的方法和组成
公开(公告)号：US06811470B2
公开(公告)日：2004-11-02
申请号：US10194560
申请日：2002-07-12
申请人： Benjamin A. Bonner , Anand N. Iyer , Deepak N. Kumar , Thomas H. Osterheld , Wei-Yung Hsu , Yong-Sik R. Kim , Christopher W. Smith , Huanbo Zhang
发明人： Benjamin A. Bonner , Anand N. Iyer , Deepak N. Kumar , Thomas H. Osterheld , Wei-Yung Hsu , Yong-Sik R. Kim , Christopher W. Smith , Huanbo Zhang
IPC分类号： B24B100
CPC分类号： H01L21/31053 , C09G1/02 , H01L21/76229
摘要： Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
摘要翻译：提供的方法和组合物用于在表面形貌中具有减少或最小缺陷的平面化基板表面。在一个方面，提供一种用于处理衬底的方法，包括将包括至少第一介电材料的衬底和设置在其上的第二电介质材料定位在抛光设备中，用具有第一选择性的第一抛光组合物抛光衬底，以及抛光衬底其具有比第一选择性更大的第二选择性的第二抛光组合物。

8. 发明授权

US06251001B1 Substrate polishing with reduced contamination 有权
标题翻译：底物抛光，污染减少
公开(公告)号：US06251001B1
公开(公告)日：2001-06-26
申请号：US09307674
申请日：1999-05-10
申请人： Jay D. Pinson , Brian J. Brown , Thomas H. Osterheld , Benjamin A. Bonner , Doyle E. Bennett , Nitin Shah , Paul Flores
发明人： Jay D. Pinson , Brian J. Brown , Thomas H. Osterheld , Benjamin A. Bonner , Doyle E. Bennett , Nitin Shah , Paul Flores
IPC分类号： B24B5502
CPC分类号： B24B37/04 , B24B55/02
摘要： Systems and methods for polishing a substrate with reduced contamination are described. Moist air is directed to one or more surfaces in proximity to the polishing surface and exposed to airborne slurry particles generated during polishing. By maintaining the atmosphere in the vicinity of the exposed surfaces at an elevated relative humidity level, airborne slurry particles adhering to the exposed surfaces remain in suspension and, therefore, may be easily cleaned, e.g., during a high pressure rinse cycle. This feature reduces the likelihood that slurry particles will accumulate on exposed surfaces of the polishing apparatus and flake off while a substrate is being polished, reducing the likelihood of substrate defects caused by such slurry contamination.
摘要翻译：描述了用于抛光具有降低的污染物的基底的系统和方法。潮湿空气被引导到靠近抛光表面的一个或多个表面，并暴露于在抛光期间产生的空气中的浆料颗粒。通过在升高的相对湿度水平下保持暴露表面附近的气氛，附着在暴露表面上的气载浆料颗粒保持悬浮状态，因此可以容易地例如在高压冲洗循环中清洁。该特征降低了浆料颗粒在抛光装置的暴露表面上积聚的可能性，并且在抛光衬底时剥落，从而降低了由这种浆料污染引起的衬底缺陷的可能性。

9. 发明授权

US06561381B1 Closed loop control over delivery of liquid material to semiconductor processing tool 失效
标题翻译：将液体材料输送到半导体加工工具的闭环控制
公开(公告)号：US06561381B1
公开(公告)日：2003-05-13
申请号：US09717720
申请日：2000-11-20
申请人： Thomas H. Osterheld , Benjamin A. Bonner , Michael W. Richter
发明人： Thomas H. Osterheld , Benjamin A. Bonner , Michael W. Richter
IPC分类号： B67B700
CPC分类号： H01L21/67253
摘要： Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen. This second signal causes the gas supply valve to vary the flow of inert gas to the dispense module in order to control changes in the flow rate of the slurry.
摘要翻译：利用闭环控制将液体材料精确地分配到半导体加工工具中。在一个实施例中，已知密度的CMP浆料材料从储存器/混合容器供应到分配模块。分配模块还通过气体供给阀接收惰性气体流。在分配模块中由于惰性气体流动引起的正压力导致浆料从分配模块流出到CMP压板。通过监测填充的分配模块的重量变化（下降）来确定浆料在一段时间内流向CMP压板的速率。以类似的方式，可以通过监测填充的分配模块的重量变化随时间的变化来检测浆料随着时间的流动速率的变化。与分配模块和供气阀电子通信的调节器结构在不同的时间点接收指示分配模块的重量变化的第一信号。作为响应，调节器结构将第二信号传递到气体供应阀，反映了CMP浆料材料流向压板的适当变化。该第二信号使气体供应阀改变与分配模块的惰性气体的流量，以便控制浆料流速的变化。

10. 发明申请

US20100120335A1 Partial Contact Wafer Retaining Ring Apparatus 审中-公开
标题翻译：局部接触片保持环设备
公开(公告)号：US20100120335A1
公开(公告)日：2010-05-13
申请号：US12267389
申请日：2008-11-07
申请人： Haoquan Fang , Ivelin Angelov , Brian Severson , Benjamin A. Bonner , Serge Kosche , Patrick J. Lord , Brian J. Brown
发明人： Haoquan Fang , Ivelin Angelov , Brian Severson , Benjamin A. Bonner , Serge Kosche , Patrick J. Lord , Brian J. Brown
IPC分类号： B24B41/06 , B24B1/00 , B24B7/04
CPC分类号： B24B37/32
摘要： The partial contact wafer retaining ring apparatus is disclosed. For example, one disclosed embodiment provides a wafer retaining ring comprising a ring for retaining the wafer, the ring having an inner diameter surface configured to restrict lateral wafer motion, and at least one interface surface configured to interface with a polishing surface. The interface surface comprises a recessed section adjacent to the ring inner diameter, configured to preclude contact between the recessed section and the polishing surface.
摘要翻译：公开了部分接触晶片保持环装置。例如，一个公开的实施例提供了一种晶片保持环，其包括用于保持晶片的环，该环具有被配置为限制横向晶片运动的内径表面以及被配置为与抛光表面相接合的至少一个界面。界面表面包括与环内径相邻的凹陷部分，其构造成防止凹部与抛光表面之间的接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式