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    • 4. 发明申请
    • Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cell
    • 具有堆叠存储单元的半导体存储器件和制造堆叠存储单元的方法
    • US20060120148A1
    • 2006-06-08
    • US11238381
    • 2005-09-29
    • Sung-Min KimEun-Jung YunJong-Soo SeoDu-Eung KimBeak-Hyung ChoByung-Seo Kim
    • Sung-Min KimEun-Jung YunJong-Soo SeoDu-Eung KimBeak-Hyung ChoByung-Seo Kim
    • G11C11/00
    • H01L27/2436G11C13/0004G11C13/003G11C2213/74G11C2213/79
    • In a semiconductor memory device and method, phase-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices formed of a phase-change material. Each phase-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a phase-change material. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of phase-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the phase-change memory cells of each of the phase-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a phase-change material. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the phase-change memory cells.
    • 在半导体存储器件和方法中,提供了相变存储单元,每个都包括形成在不同层上的多个控制晶体管和由相变材料形成的可变电阻器件。 每个相变存储单元包括形成在不同层上的多个控制晶体管和由相变材料形成的可变电阻器件。 在一个示例中,控制晶体管的数量是两个。 半导体存储器件包括全局位线; 通过分别对应于本地位线的本地位线选择电路分别连接到全局位线或与全局位线断开的多个局部位线; 以及分别在连接到本地位线时存储数据的多个相变存储单元组。 每个相变存储单元组的每个相变存储单元包括形成在不同层上的多个控制晶体管和由相变材料形成的可变电阻器件。 此外,半导体存储器件具有使用全局位线和局部位线的分层位线结构。 因此,可以增加半导体存储器件的集成密度和流过每个相变存储单元的电流量。
    • 9. 发明授权
    • Phase-changeable memory device and read method thereof
    • 相变存储器件及其读取方法
    • US07391644B2
    • 2008-06-24
    • US11605212
    • 2006-11-29
    • Woo-Yeong ChoByung-Gil ChoiDu-Eung KimHyung-Rok OhBeak-Hyung ChoYu-Hwan Ro
    • Woo-Yeong ChoByung-Gil ChoiDu-Eung KimHyung-Rok OhBeak-Hyung ChoYu-Hwan Ro
    • G11C11/00
    • G11C8/10G11C13/0004G11C13/004G11C2013/0054G11C2213/72
    • Disclosed is a phase-changeable memory device and a related method of reading data. The memory device is comprised of memory cells, a high voltage circuit, a precharging circuit, a bias circuit, and a sense amplifier. Each memory cell includes a phase-changeable material and a diode connected to a bitline. The high voltage circuit provides a high voltage from a power source. The precharging circuit raises the bitline up to the high voltage after charging the bitline up to the power source voltage. The bias circuit supplies a read current to the bitline by means of the high voltage. The sense amplifier compares a voltage of the bitline with a reference voltage by means of the high voltage, and reads data from the memory cell. The memory device is able to reduce the burden on the high voltage circuit during the precharging operation, thus assuring a sufficient sensing margin during the sensing operation.
    • 公开了一种可变相存储器件和读取数据的相关方法。 存储器件包括存储器单元,高压电路,预充电电路,偏置电路和读出放大器。 每个存储单元包括相位可变材料和连接到位线的二极管。 高压电路从电源提供高电压。 预充电电路将位线充电至电源电压后,将位线升高至高电压。 偏置电路通过高电压向位线提供读取电流。 读出放大器通过高电压将位线的电压与参考电压进行比较,并从存储单元读取数据。 存储器件能够减少在预充电操作期间对高压电路的负担,从而在感测操作期间确保足够的感测余量。