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1. 发明授权

US08309957B2 Replacement of scribeline padframe with saw-friendly design 有权
标题翻译：用锯切友好的设计更换模板衬垫
公开(公告)号：US08309957B2
公开(公告)日：2012-11-13
申请号：US12759005
申请日：2010-04-13
申请人： Basab Chatterjee , Jeffrey Alan West , Gregory Boyd Shinn
发明人： Basab Chatterjee , Jeffrey Alan West , Gregory Boyd Shinn
IPC分类号： H01L23/50
CPC分类号： H01L22/34 , G01R31/2884 , H01L2224/05093
摘要： An integrated circuit substrate containing an electrical probe pad structure over, and on both sides of, a dicing kerf lane. The electrical probe pad structure includes metal crack arresting strips adjacent to the dicing kerf lane. A metal density between the crack arresting strips is less than 70 percent. An electrical probe pad structure containing metal crack arresting strips, with a metal density between the crack arresting strips less than 70 percent. A process of forming an integrated circuit by forming an electrical probe pad structure over a dicing kerf lane adjacent to the integrated circuit, such that the electrical probe pad structure has metal crack arresting strips adjacent to the dicing kerf lane, and performing a dicing operation through the electrical probe pad structure.
摘要翻译：一种集成电路基板，其包含在切割切割车道上方并且在其两侧的电探针焊盘结构。电探针焊盘结构包括与切割切口通道相邻的金属裂纹阻止条。断裂条之间的金属密度小于70％。包含金属裂纹阻挡带的电探针垫结构，裂纹阻挡带之间的金属密度小于70％。通过在与集成电路相邻的切割切口通道上形成电探针焊盘结构来形成集成电路的工艺，使得电探针焊盘结构具有与切割锯缝通道相邻的金属裂纹阻挡条，并且通过电探针垫结构。

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