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1. 发明授权

US07094966B2 Packaging integrated circuits with adhesive posts 有权
标题翻译：封装集成电路与粘接柱
公开(公告)号：US07094966B2
公开(公告)日：2006-08-22
申请号：US10278687
申请日：2002-10-22
申请人： Barry A. Bonitz , Eric A. Johnson , Michael B. Vincent
发明人： Barry A. Bonitz , Eric A. Johnson , Michael B. Vincent
IPC分类号： H01L23/12
CPC分类号： H01L21/563 , H01L23/36 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/16195 , Y10T29/49126 , Y10T29/49128 , H01L2924/00
摘要： A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.
摘要翻译：用于通过倒装芯片方法附接到刚性基板的集成电路的封装具有散热器，该散热器通过导热柔顺的粘合剂附接到IC，并且通过一组刚性柱附接到封装基板的粘合剂，其结果是散热器比通过在大面积上延伸的薄膜结合到基板的加强件的情况更紧密地平行于基板。

2. 发明授权

US06545869B2 Adjusting fillet geometry to couple a heat spreader to a chip carrier 有权
标题翻译：调整圆角几何以将散热器连接到芯片载体
公开(公告)号：US06545869B2
公开(公告)日：2003-04-08
申请号：US09764048
申请日：2001-01-17
申请人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
发明人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
IPC分类号： H05K720
CPC分类号： H01L23/4334 , H01L21/4882 , H01L21/563 , H01L23/3735 , H01L24/32 , H01L2224/73203 , H01L2224/83951 , H01L2924/01006 , H01L2924/01033 , H01L2924/351 , Y10T29/4913 , H01L2924/3512 , H01L2924/00
摘要： An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
摘要翻译：一种用于将芯片上方的散热器与芯片下方的芯片载体耦合的电子结构及其制造方法。最初提供的是衬底，衬底的表面上的芯片并且耦合到衬底和散热器。然后在芯片上和芯片的周围形成至少一种粘合剂材料的圆角。此外，散热器放置在圆角的一部分上并且在芯片的顶表面上。圆角将散热器耦合到基板。圆角的外表面与衬底的表面形成约25度的接触角。小的接触角不超过约25度可以防止由于热循环而导致的基体的破裂。

3. 发明授权

US06984286B2 Adjusting fillet geometry to couple a heat spreader to a chip carrier 失效
公开(公告)号：US06984286B2
公开(公告)日：2006-01-10
申请号：US10338963
申请日：2003-01-08
申请人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
发明人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
IPC分类号： B32B31/20
CPC分类号： H01L23/4334 , H01L21/4882 , H01L21/563 , H01L23/3735 , H01L24/32 , H01L2224/73203 , H01L2224/83951 , H01L2924/01006 , H01L2924/01033 , H01L2924/351 , Y10T29/4913 , H01L2924/3512 , H01L2924/00
摘要： An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

4. 发明申请

US20140255376A1 Regulation of Specific Spinal Neurons Regulating Pain Transmission 有权
标题翻译：调节特定脊髓神经元调节疼痛传播
公开(公告)号：US20140255376A1
公开(公告)日：2014-09-11
申请号：US14181241
申请日：2014-02-14
申请人： Eric A. Johnson , Sabine Pellett , William H. Tepp , Tony L. Yaksh , Marc Marino , Qinghao Xu
发明人： Eric A. Johnson , Sabine Pellett , William H. Tepp , Tony L. Yaksh , Marc Marino , Qinghao Xu
IPC分类号： A61K47/48 , C12N9/96
CPC分类号： A61K47/62 , A61K9/0085 , A61K38/164 , A61K38/4893 , C07K7/22 , C07K14/33 , C07K14/57545 , C07K14/70 , C07K14/72 , C07K2319/01 , C07K2319/33 , C07K2319/55 , C12N9/96 , C12Y304/24069
摘要： A chimeric toxin is disclosed comprising a peptide ligand specifically targeting neurons involved in pain processing; and a clostridial neurotoxin light chain, wherein the ligand is linked to the light chain. The methods of preparing such chimeric toxin and the method of using the chimeric toxin to regulate pain transmission are also disclosed.
摘要翻译：公开了一种嵌合毒素，其包含特异性靶向涉及疼痛加工的神经元的肽配体; 和梭菌神经毒素轻链，其中所述配体与轻链连接。还公开了制备这种嵌合毒素的方法和使用嵌合毒素调节疼痛传递的方法。

5. 发明授权

US08435759B2 Plasmid-encoded neurotoxin genes in Clostridium botulinum serotype A subtypes 有权
标题翻译：肉毒毒素肉毒杆菌血清型A亚型中的质粒编码的神经毒素基因
公开(公告)号：US08435759B2
公开(公告)日：2013-05-07
申请号：US12664800
申请日：2008-06-27
申请人： Eric A. Johnson , Kristin M. Marshall , Sabine Pellett , Marite Bradshaw
发明人： Eric A. Johnson , Kristin M. Marshall , Sabine Pellett , Marite Bradshaw
IPC分类号： C12P21/00 , C12N15/74
CPC分类号： C12N9/52 , C07K14/33 , C12N15/74 , C12Y304/24069
摘要： The present invention provides a novel isolated plasmid, wherein the plasmid is a native plasmid found in unique C. botulinum type A strains and encode either BoNT/A3 or BoNT/A4 and BoNT/B. The present invention also provides a method of obtaining a plasmid-encoded botulinum neurotoxin and botulinum neurotoxin complex comprising the step of isolating a plasmid encoding the cntA/A or cntA/B neurotoxin gene and genes encoding protein components of the toxin complex from a C. botulinum type A strain. The inventors performed comparative analyzes of representative BoNT/A subtype strains by pulsed-field gel electrophoresis (PFGE) and Southern hybridizations with probes specific for the BoNT/A and B genes, cntA/A and cntA/B. Unexpectedly, the inventors determined that the genes encoding BoNT/A3 in the A3 strain, and BoNT/A4 and BoNT/B in the A4 strain, are on plasmids.
摘要翻译：本发明提供了一种新的分离质粒，其中质粒是在独特的A型肉毒杆菌中发现的天然质粒，并且编码BoNT / A3或BoNT / A4和BoNT / B。本发明还提供了获得质粒编码的肉毒杆菌神经毒素和肉毒杆菌神经毒素复合物的方法，包括分离编码cntA / A或cntA / B神经毒素基因的质粒和编码来自C的毒素复合物的蛋白质组分的基因的步骤。 A型肉毒杆菌。本发明人通过脉冲场凝胶电泳（PFGE）和针对BoNT / A和B基因cntA / A和cntA / B特异性探针的Southern杂交进行了代表性的BoNT / A亚型菌株的比较分析。出人意料的是，本发明人确定了A3菌株中编码BoNT / A3的基因以及A4菌株中的BoNT / A4和BoNT / B在质粒上。

6. 发明授权

US07499614B2 Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards 失效
标题翻译：将VCSELs无源对准到光电卡和印刷电路板中的波导
公开(公告)号：US07499614B2
公开(公告)日：2009-03-03
申请号：US10692921
申请日：2003-10-24
申请人： Eric A. Johnson , David V. Caletka
发明人： Eric A. Johnson , David V. Caletka
IPC分类号： G02B6/26
CPC分类号： G02B6/1221 , G02B6/12004 , G02B6/42 , G02B6/4232 , G02B2006/12104 , G02B2006/12176
摘要： A method of producing opto-electronic cards and printed circuit boards which are adapted to provide for passive alignment of VCSELs to waveguides. Also provided are opto-electronic cards and printed circuit boards which incorporate structure providing for the passive alignment of VCSELs to waveguides.
摘要翻译：一种制造光电卡和印刷电路板的方法，其适于提供VCSEL与波导的无源对准。还提供了光电卡和印刷电路板，其结合提供VCSEL到波导的被动对准的结构。

7. 发明申请

US20090017495A1 ESCHERICHIA COLI-DERIVED VACCINE AND THERAPY AGAINST BOTULISM 有权
标题翻译： ESCHERICHIA派生的疫苗和治疗效果
公开(公告)号：US20090017495A1
公开(公告)日：2009-01-15
申请号：US12040542
申请日：2008-02-29
申请人： Michael Baldwin , Eric A. Johnson , Joseph T. Barbieri , Marite Bradshaw , William H. Tepp , Christina L. Pier
发明人： Michael Baldwin , Eric A. Johnson , Joseph T. Barbieri , Marite Bradshaw , William H. Tepp , Christina L. Pier
IPC分类号： C12N15/09 , C07K14/33
CPC分类号： C12N9/52 , A61K39/0258 , A61K39/08 , A61K2039/523 , C12Y304/24069 , Y02A50/469 , Y02A50/474
摘要： A method of producing botulinum toxin C-terminal receptor binding domain (HCR) is disclosed. The one embodiment, the method comprises the steps of (a) preparing E. coli transformed with an expression vector comprising DNA encoding HCR protein, (b) inducing expression of the HCR protein at a reduced temperature in a culture media, and (c) purifying the HCR protein via extraction, wherein the extraction comprises a clarification by centrifugation and a filtration, wherein the purified HCR protein is at least 10 mg/L of culture medium.
摘要翻译：公开了产生肉毒杆菌毒素C末端受体结合结构域（HCR）的方法。该方法包括以下步骤：（a）用包含编码HCR蛋白的DNA的表达载体转化大肠杆菌，（b）在培养基中降低温度诱导HCR蛋白的表达，和（c）通过提取纯化HCR蛋白质，其中提取物通过离心和过滤进行澄清，其中纯化的HCR蛋白质为至少10mg / L的培养基。

8. 发明授权

US07433674B2 Apparatus and method for credit based management of telecommunication activity 有权
标题翻译：电信活动信用管理的设备和方法
公开(公告)号：US07433674B2
公开(公告)日：2008-10-07
申请号：US11559918
申请日：2006-11-15
申请人： Eric A. Johnson , Mark J. Handzel
发明人： Eric A. Johnson , Mark J. Handzel
IPC分类号： H04M11/00
CPC分类号： H04W12/12 , H04L63/1416 , H04L63/1425 , H04M3/38 , H04M15/00 , H04M15/41 , H04M15/47 , H04M15/88 , H04M15/887 , H04M17/00 , H04M2203/6027 , H04M2215/0116 , H04M2215/014 , H04M2215/0148 , H04M2215/0164 , H04M2215/32 , H04W4/24 , H04W12/06 , H04W60/00
摘要： The present invention provides an apparatus for credit based management of a telecommunication system. One embodiment of the apparatus includes an interface for communicating credit information on a particular subscriber and for receiving call records for the particular subscriber that are derived from a switch which establishes connections between telecommunication devices. A credit limit device then utilizes the credit information to establish a credit limit for the subscriber. The apparatus also includes a device for comparing the particular subscriber's call usage to a credit limit established for the subscriber based on information obtained from the credit bureau. An output device is used to provide an indication that the subscriber has exceeded their credit limit. Another embodiment of the apparatus, includes a device for, upon expiration of a predetermined time period, contacting the credit bureau to obtain a new credit score for a subscriber and use this score to update the subscriber's credit limit.
摘要翻译：本发明提供了一种用于电信系统的信用管理的装置。该装置的一个实施例包括用于在特定订户上传送信用信息的接口，以及用于接收从建立电信设备之间的连接的交换机导出的特定用户的呼叫记录。信用限额设备然后利用信用信息为用户建立信用限额。该装置还包括一个装置，用于根据从信用局获得的信息将特定用户的呼叫使用量与为用户建立的信用限额进行比较。输出设备用于提供用户已经超过其信用限额的指示。该装置的另一实施例包括一种装置，用于在预定时间段期满后，联系信用局以获得用户的新信用评分，并使用该分数来更新用户的信用限额。

9. 发明申请

US20080194418A1 Methods of Mapping Polymorphisms and Polymorphism Microarrays 有权
标题翻译：多态性和多态性微阵列的映射方法
公开(公告)号：US20080194418A1
公开(公告)日：2008-08-14
申请号：US11914099
申请日：2006-05-10
申请人： Eric A. Johnson , Guowen Liu , Michael R. Miller
发明人： Eric A. Johnson , Guowen Liu , Michael R. Miller
IPC分类号： C40B30/04 , C12Q1/68 , C40B40/08 , C40B50/06
CPC分类号： C12Q1/683 , C12Q2563/131 , C12Q2533/101 , C12Q2525/191 , C12Q2565/501
摘要： Described herein are methods for the high-throughput discovery and genotyping of nucleotide polymorphisms in DNA, including single nucleotide polymorphism (SNPs) and short deletions and insertions. These methods take advantage of the fact that differences in DNA sequence result in the differential presence of restriction endonuclease digestion sites. Differences can be detected between individuals, or the relative presence detected in a population. Provided approaches involve isolation of short DNA fragments (“tags) near restriction endonuclease sites. The presence of one (or two) of these tags indicates that a site was present. Distinguishable labeling of tags from two individual or populations allows comparative presence of these sites to be assayed on a platform that employs a collection of nucleic acids. Other approaches depend on the differential presence of restriction endonuclease sites, but involve mixing genomic DNA from the two individuals. Regions of DNA with a restriction site in only one individual create an opportunity for primer extension to produce labeled material, which can be assayed on a platform that employs a collection of nucleic acids. Any of a variety of detection platforms can be use with the described approaches. By way of example, highly efficient variant detection microarrays and bead libraries are provided that contain genomic tags with different representations between two populations, so that most elements in the collection of nucleic acids contain an informative SNP between the populations of interest.
摘要翻译：本文描述了DNA的核苷酸多态性的高通量发现和基因分型的方法，包括单核苷酸多态性（SNPs）和短缺失和插入。这些方法利用DNA序列的差异导致限制性内切核酸酶消化位点的差异存在的事实。可以在个体之间检测差异，或在群体中检测到相对存在。提供的方法包括在限制性内切核酸酶位点附近分离短DNA片段（“标签”），一个（或两个）这些标签的存在表明存在一个位点。来自两个个体或群体的标签的区分标签允许这些位点的比较存在在采用核酸集合的平台上进行检测其他方法取决于限制性内切核酸酶位点的差异存在，但涉及混合来自两个个体的基因组DNA。仅在一个个体中具有限制性位点的DNA区域产生机会用于引物延伸以产生标记的物质，其可以在采用核酸集合的平台上进行测定。多种检测平台中的任何一种可以与所述方法一起使用。作为示例，高效变体检测微阵列和珠粒提供了包含两个群体之间具有不同表征的基因组标签的文库，因此大多数核酸集合中的元素包含感兴趣的群体之间的信息性SNP。

10. 发明授权

US07067916B2 Extension of fatigue life for C4 solder ball to chip connection 有权
公开(公告)号：US07067916B2
公开(公告)日：2006-06-27
申请号：US09885853
申请日：2001-06-20
申请人： William E. Bernier , Charles F. Carey , Eberhard B. Gramatzki , Thomas R. Homa , Eric A. Johnson , Pierre Langevin , Irving Memis , Son K. Tran , Robert F. White
发明人： William E. Bernier , Charles F. Carey , Eberhard B. Gramatzki , Thomas R. Homa , Eric A. Johnson , Pierre Langevin , Irving Memis , Son K. Tran , Robert F. White
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H05K3/3436 , H01L2924/00
摘要： A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

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