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1. 发明授权

US07905580B2 Multi-layer monolithic fluid ejectors using piezoelectric actuation 有权
标题翻译：使用压电驱动的多层单片液体喷射器
公开(公告)号：US07905580B2
公开(公告)日：2011-03-15
申请号：US12273575
申请日：2008-11-19
申请人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
发明人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A fluid ejector including a silicon wafer having a first side and a second side. A multi-layer monolithic structure is formed on the first side of the silicon wafer. The multi-layer monolithic structure includes a first structure layer formed on the first side of the silicon wafer, and the first structure layer has an aperture. A second structure layer has a horizontal portion and closed, filled trenches or vertical sidewalls. The first structure layer, horizontal portion and the closed, filled trenches or vertical sidewalls of the second structure layer define a fluid cavity. An actuator is associated with the horizontal portion of the second structure layer, and an etched portion of the silicon wafer defines an open area which exposes the aperture in the first structure layer.
摘要翻译：一种流体喷射器，包括具有第一侧和第二侧的硅晶片。在硅晶片的第一侧上形成多层整体结构。多层单片结构包括形成在硅晶片的第一侧上的第一结构层，第一结构层具有孔。第二结构层具有水平部分和闭合的填充沟槽或垂直侧壁。第二结构层的第一结构层，水平部分和闭合填充的沟槽或垂直侧壁限定流体腔。致动器与第二结构层的水平部分相关联，并且硅晶片的蚀刻部分限定露出第一结构层中的孔的开放区域。

2. 发明授权

US07401403B2 Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios 有权
标题翻译：用于形成具有精细特征尺寸，高精度定义和/或高纵横比的陶瓷厚膜元件阵列的方法
公开(公告)号：US07401403B2
公开(公告)日：2008-07-22
申请号：US11017569
申请日：2004-12-20
申请人： Baomin Xu , Stephen D. White , Steven A. Buhler
发明人： Baomin Xu , Stephen D. White , Steven A. Buhler
IPC分类号： H05K3/02 , B28B3/06
CPC分类号： H01L27/20 , H01L41/1876 , H01L41/313 , H01L41/331 , Y10T29/42 , Y10T29/435 , Y10T29/49155 , Y10T29/49163
摘要： A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.
摘要翻译：提供了一种方法，其包括在临时衬底（例如，蓝宝石衬底）上提供模具。接下来，将诸如PZT糊料的材料沉积到模具中。然后，去除模具以获得由模具形成的元件。然后将所形成的元件烧结。烧结后，任选地进行电极沉积。然后将烧结元件结合到最终目标衬底，并通过激光剥离从临时衬底释放。此外，电极也可以任选地沉积在这一点上。

3. 发明申请

US20090070975A1 METHOD OF FORMING MICROMACHINED FLUID EJECTORS USING PIEZOELECTRIC ACTUATION 有权
标题翻译：使用压电致动法形成微流体流化床的方法
公开(公告)号：US20090070975A1
公开(公告)日：2009-03-19
申请号：US12273573
申请日：2008-11-19
申请人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
发明人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
IPC分类号： H01L41/22 , B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A method of forming a fluid ejector includes forming a recess well into a silicon wafer on a first side of the silicon wafer, and filling the recess well with a sacrificial material. A thin layer structure is deposited onto the first side of a silicon wafer covering the filled recess well. Then a thin film piezoelectric is bonded or deposited to the thin layer structure, and a hole is formed in the thin layer structure exposing at least a portion of the sacrificial material. The sacrificial material is removed from the recess well, wherein the hole in the thin layer in the recess well with the sacrificial material removed, form a fluid inlet. An opening area in the silicon wafer is formed on a second side of the silicon wafer. Then a nozzle plate is formed having a recess portion and an aperture within the recess portion. The nozzle plate is attached to the second side of the silicon wafer, with the recess portion positioned within the open area. The thin layer structure and the recess portion of the nozzle plate define a depth of a fluid cavity defined by the thin layer structure, the recess portion of the nozzle plate and the sidewalls of the silicon wafer.
摘要翻译：形成流体喷射器的方法包括在硅晶片的第一侧上将凹槽形成凹槽，并用牺牲材料填充凹槽。在覆盖填充的凹槽的硅晶片的第一侧上沉积薄层结构。然后，薄膜压电体被结合或沉积到薄层结构上，并且在该薄层结构中形成一个露出至少一部分牺牲材料的孔。牺牲材料从凹槽中移除，其中凹槽中的薄层中的孔与除去牺牲材料的孔形成流体入口。硅晶片的开口区域形成在硅晶片的第二侧上。然后形成在凹部内具有凹部和孔的喷嘴板。喷嘴板附接到硅晶片的第二侧，凹部位于开放区域内。喷嘴板的薄层结构和凹部限定由薄层结构，喷嘴板的凹部和硅晶片的侧壁限定的流体腔的深度。

4. 发明授权

US07467857B2 Micromachined fluid ejectors using piezoelectric actuation 有权
标题翻译：使用压电驱动的微加工液体喷射器
公开(公告)号：US07467857B2
公开(公告)日：2008-12-23
申请号：US11312305
申请日：2005-12-20
申请人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
发明人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
IPC分类号： B41J2/05 , B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A micromachined fluid ejector includes an ejector body having a fluid cavity for holding fluid to be ejected and a piezoelectric actuator for ejecting the fluid. A nozzle plate is placed in operable association with the ejector body. The configuration of the nozzle plate is selected to adjust a volume of the fluid cavity to obtain a desired mechanical impedance matching between the fluid and the actuator.
摘要翻译：微机械流体喷射器包括具有用于保持要喷射的流体的流体腔的喷射器主体和用于喷射流体的压电致动器。喷嘴板被放置成与喷射器主体可操作地相关联。选择喷嘴板的构造以调节流体腔的体积以获得流体和致动器之间的期望的机械阻抗匹配。

5. 发明申请

US20080244884A1 Method for Forming Ceramic Thick Film Element Arrays with Fine Feature Size, High-Precision Definition, and/or High Aspect Ratios 有权
标题翻译：用于形成具有精细特征尺寸，高精度定义和/或高比例的陶瓷厚膜元件阵列的方法
公开(公告)号：US20080244884A1
公开(公告)日：2008-10-09
申请号：US12139798
申请日：2008-06-16
申请人： Baomin Xu , Stephen D. White , Steven A. Buhler
发明人： Baomin Xu , Stephen D. White , Steven A. Buhler
IPC分类号： H01L41/22
CPC分类号： H01L27/20 , H01L41/1876 , H01L41/313 , H01L41/331 , Y10T29/42 , Y10T29/435 , Y10T29/49155 , Y10T29/49163
摘要： A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.
摘要翻译：提供了一种方法，其包括在临时衬底（例如蓝宝石衬底）上提供模具。接下来，将诸如PZT糊料的材料沉积到模具中。然后，去除模具以获得由模具形成的元件。然后将所形成的元件烧结。烧结后，任选地进行电极沉积。然后将烧结元件结合到最终目标衬底，并通过激光剥离从临时衬底释放。此外，电极也可以任选地沉积在这一点上。

6. 发明授权

US08359748B2 Method of forming micromachined fluid ejectors using piezoelectric actuation 有权
标题翻译：使用压电驱动形成微机械流体喷射器的方法
公开(公告)号：US08359748B2
公开(公告)日：2013-01-29
申请号：US12273573
申请日：2008-11-19
申请人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
发明人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
IPC分类号： B21D53/76 , H04R17/00
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A method of forming a fluid ejector includes forming a recess well into a silicon wafer on a first side of the silicon wafer, and filling the recess well with a sacrificial material. A thin layer structure is deposited onto the first side of a silicon wafer covering the filled recess well. Then a thin film piezoelectric is bonded or deposited to the thin layer structure, and a hole is formed in the thin layer structure exposing at least a portion of the sacrificial material. The sacrificial material is removed from the recess well, wherein the hole in the thin layer in the recess well with the sacrificial material removed, form a fluid inlet. An opening area in the silicon wafer is formed on a second side of the silicon wafer. Then a nozzle plate is formed having a recess portion and an aperture within the recess portion. The nozzle plate is attached to the second side of the silicon wafer, with the recess portion positioned within the open area. The thin layer structure and the recess portion of the nozzle plate define a depth of a fluid cavity defined by the thin layer structure, the recess portion of the nozzle plate and the sidewalls of the silicon wafer.
摘要翻译：形成流体喷射器的方法包括在硅晶片的第一侧上将凹槽形成凹槽，并用牺牲材料填充凹槽。在覆盖填充的凹槽的硅晶片的第一侧上沉积薄层结构。然后，薄膜压电体被结合或沉积到薄层结构上，并且在该薄层结构中形成一个露出至少一部分牺牲材料的孔。牺牲材料从凹槽中移除，其中凹槽中的薄层中的孔与除去牺牲材料的孔形成流体入口。硅晶片的开口区域形成在硅晶片的第二侧上。然后形成在凹部内具有凹部和孔的喷嘴板。喷嘴板附接到硅晶片的第二侧，凹部位于开放区域内。喷嘴板的薄层结构和凹部限定由薄层结构，喷嘴板的凹部和硅晶片的侧壁限定的流体腔的深度。

7. 发明授权

US08001666B2 Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios 有权
标题翻译：用于形成具有精细特征尺寸，高精度定义和/或高纵横比的陶瓷厚膜元件阵列的方法
公开(公告)号：US08001666B2
公开(公告)日：2011-08-23
申请号：US12139798
申请日：2008-06-16
申请人： Baomin Xu , Stephen D. White , Steven A. Buhler
发明人： Baomin Xu , Stephen D. White , Steven A. Buhler
IPC分类号： H01L41/22 , H04R17/00
CPC分类号： H01L27/20 , H01L41/1876 , H01L41/313 , H01L41/331 , Y10T29/42 , Y10T29/435 , Y10T29/49155 , Y10T29/49163
摘要： A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.
摘要翻译：提供了一种方法，其包括在临时衬底（例如，蓝宝石衬底）上提供模具。接下来，将诸如PZT糊料的材料沉积到模具中。然后，去除模具以获得由模具形成的元件。然后将所形成的元件烧结。烧结后，任选地进行电极沉积。然后将烧结元件结合到最终目标衬底，并通过激光剥离从临时衬底释放。此外，电极也可以任选地沉积在这一点上。

8. 发明申请

US20090073242A1 MULTI-LAYER MONOLITHIC FLUID EJECTORS USING PIEZOELECTRIC ACTUATION 有权
标题翻译：使用压电致动器的多层单相流体喷射器
公开(公告)号：US20090073242A1
公开(公告)日：2009-03-19
申请号：US12273575
申请日：2008-11-19
申请人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
发明人： Baomin Xu , Steven A. Buhler , Stephen D. White , Scott Jong Ho Limb
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14475 , Y10T29/42 , Y10T29/49401
摘要： A fluid ejector including a silicon wafer having a first side and a second side. A multi-layer monolithic structure is formed on the first side of the silicon wafer. The multi-layer monolithic structure includes a first structure layer formed on the first side of the silicon wafer, and the first structure layer has an aperture. A second structure layer has a horizontal portion and closed, filled trenches or vertical sidewalls. The first structure layer, horizontal portion and the closed, filled trenches or vertical sidewalls of the second structure layer define a fluid cavity. An actuator is associated with the horizontal portion of the second structure layer, and an etched portion of the silicon wafer defines an open area which exposes the aperture in the first structure layer.
摘要翻译：一种流体喷射器，包括具有第一侧和第二侧的硅晶片。在硅晶片的第一侧上形成多层整体结构。多层单片结构包括形成在硅晶片的第一侧上的第一结构层，第一结构层具有孔。第二结构层具有水平部分和闭合的填充沟槽或垂直侧壁。第二结构层的第一结构层，水平部分和闭合填充的沟槽或垂直侧壁限定流体腔。致动器与第二结构层的水平部分相关联，并且硅晶片的蚀刻部分限定露出第一结构层中的孔的开放区域。

9. 发明授权

US07574787B2 Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure 失效
标题翻译：制造压电陶瓷厚膜阵列和单一元件的方法，具有可重复使用的单层基板结构
公开(公告)号：US07574787B2
公开(公告)日：2009-08-18
申请号：US11363849
申请日：2006-02-28
申请人： Baomin Xu , Steven A. Buhler , Michael C. Welsberg , William S. Wong , Scott E. Solberg , Karl A. Littau , John S. Fitch , Scott A. Elrod
发明人： Baomin Xu , Steven A. Buhler , Michael C. Welsberg , William S. Wong , Scott E. Solberg , Karl A. Littau , John S. Fitch , Scott A. Elrod
IPC分类号： H04R17/00
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2/1634 , B41J2/1637 , B41J2/1646 , H01L41/313 , H01L41/314 , H01L41/331 , H01L2221/68368 , Y10T29/42 , Y10T29/435 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T29/4981
摘要： A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.
摘要翻译：制造至少一个压电元件的方法包括将压电陶瓷材料沉积到第一基板的表面上以形成至少一个压电元件结构。然后在至少一个压电元件结构的表面上沉积电极。接下来，将至少一个压电元件结构接合到第二基板，第二基板是导电的或具有导电层。然后从至少一个压电元件结构去除第一衬底，并且第二侧电极沉积在至少一个压电元件结构的第二表面上。执行极化操作以向至少一个压电元件结构提供压电特性。

10. 发明授权

US06964201B2 Large dimension, flexible piezoelectric ceramic tapes 失效
标题翻译：大尺寸，柔性压电陶瓷带
公开(公告)号：US06964201B2
公开(公告)日：2005-11-15
申请号：US10376527
申请日：2003-02-25
申请人： Baomin Xu , Steven A. Buhler , William S. Wong , Michael C. Weisberg , Scott E. Solberg , Karl A. Littau , Scott A. Elrod
发明人： Baomin Xu , Steven A. Buhler , William S. Wong , Michael C. Weisberg , Scott E. Solberg , Karl A. Littau , Scott A. Elrod
IPC分类号： H01L41/09 , B06B1/06 , G01L1/16 , H01L27/20 , H01L41/08 , H01L41/18 , H01L41/187 , H01L41/24 , H01L41/26 , H03H9/17 , G01N3/00
CPC分类号： G01N29/245 , B06B1/0622 , G01L1/16 , G01N29/2475 , G01N2291/02827 , G01N2291/2694 , H01L27/20 , H01L41/313 , H01L41/314 , H01L41/47
摘要： A flexible detection/test tape includes a first flexible conductive layer, and a second flexible conductive layer positioned opposite the first conductive layer. A plurality of at least one of sensors, actuators or transducers are positioned between and are bonded to the first flexible conductive layer and the second flexible conductive layer. An insulative material is inserted around the plurality of at least one of the sensors, actuators or transducers. An electrical contact network connects to the first flexible conductive layer and the second flexible conductive layer, whereby power and control signals are provided to the flexible detection/test tape.
摘要翻译：柔性检测/测试带包括第一柔性导电层和与第一导电层相对定位的第二柔性导电层。多个传感器，致动器或换能器中的至少一个位于第一柔性导电层和第二柔性导电层之间并且被结合到第一柔性导电层和第二柔性导电层之间。绝缘材料插入到多个传感器，致动器或换能器中的至少一个传感器周围。电接触网络连接到第一柔性导电层和第二柔性导电层，由此向柔性检测/测试带提供电力和控制信号。

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