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1. 发明申请

US20130041088A1 ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM PREPARED USING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE FILM 有权
标题翻译：用于半导体的粘合组合物，使用其的粘合膜和包括膜的半导体器件
公开(公告)号：US20130041088A1
公开(公告)日：2013-02-14
申请号：US13571574
申请日：2012-08-10
申请人： Baek Soung PARK , Ki Tae SONG , In Hwan KIM
发明人： Baek Soung PARK , Ki Tae SONG , In Hwan KIM
IPC分类号： C09J163/00
CPC分类号： C09J9/00 , C08G59/50 , C08G59/621 , C08G59/688 , C08L33/00 , C09J163/00 , H01L23/293 , H01L24/29 , H01L24/32 , H01L25/0657 , H01L2224/2929 , H01L2224/29298 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/83191 , H01L2224/92247 , H01L2924/01012 , H01L2924/01029 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2924/00014 , H01L2924/05432 , H01L2924/0532 , H01L2924/05032 , H01L2924/05042 , H01L2924/0503
摘要： An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.
摘要翻译：一种用于半导体的粘合剂组合物，使用该粘合剂组合物制备的粘合剂膜和包含该粘合剂膜的半导体器件，该粘合剂组合物在65℃至350℃的温度范围内显示两个放热峰，其中第一放热峰出现在比第二放热峰低的温度下，并且粘合剂组合物在第一放热峰区域中具有约70％至100％的固化速率，如由等式1计算的：固化速率= [（[0循环时的加热值] 1循环后的加热值）/ 0循环的加热值×100。

2. 发明申请

US20130281559A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME 有权
标题翻译：用于半导体和粘合膜的粘合组合物
公开(公告)号：US20130281559A1
公开(公告)日：2013-10-24
申请号：US13924877
申请日：2013-06-24
申请人： Baek Soung Park , Ki Tae SONG , Dong Seon UH , In Hwan KIM
发明人： Baek Soung Park , Ki Tae SONG , Dong Seon UH , In Hwan KIM
IPC分类号： C09J163/00
CPC分类号： C09J163/00 , C08L63/00 , C09J7/00 , C09J7/10 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/27436 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/73215 , H01L2224/83191 , H01L2224/83862 , H01L2224/92165 , H01L2224/94 , H01L2225/06506 , H01L2924/00014 , H01L2924/181 , H01L2224/27 , H01L2924/05442 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C.
摘要翻译：用于半导体的粘合剂组合物在65℃和350℃之间具有两个放热峰，并且在150℃下固化10分钟然后在150℃下测量的空隙面积比小于10％ 30分钟，然后在175℃下成型60秒。第一个放热峰出现在65°C和185°C之间，第二个放热峰出现在155°C和350°C之间。

3. 发明申请

US20130273355A1 DICING DIE BONDING FILM 审中-公开
标题翻译：定制电影胶片
公开(公告)号：US20130273355A1
公开(公告)日：2013-10-17
申请号：US13919149
申请日：2013-06-17
申请人： Dong Seon UH , Ji Ho KIM , Min Kyu HWANG , Kyung Rae CHO , Ki Tae SONG
发明人： Dong Seon UH , Ji Ho KIM , Min Kyu HWANG , Kyung Rae CHO , Ki Tae SONG
IPC分类号： C09J7/02
CPC分类号： C09J7/20 , C08K5/0025 , C08K5/54 , C08L2312/08 , C09J133/04 , C09J133/14 , C09J143/04 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2224/27003 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/8385 , H01L2224/83862 , H01L2224/94 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01077 , H01L2924/0665 , Y10T428/264 , Y10T428/2848 , Y10T428/2852 , H01L2924/3512 , H01L2924/00 , H01L2224/27 , H01L2924/00012 , H01L2924/0635
摘要： A pressure sensitive dicing die bonding film includes a base film, a pressure sensitive adhesive layer formed on the base film, and a bonding layer formed on the pressure sensitive adhesive layer. An adhesive strength between the pressure sensitive adhesive layer and the bonding layer and an adhesive strength between the pressure sensitive adhesive layer and a ring frame may satisfy the following relation: B/A≧1.1 where A is the adhesive strength between the pressure sensitive adhesive layer and the bonding layer, and B is the adhesive strength between the pressure sensitive adhesive layer and the ring frame.
摘要翻译：压敏切割芯片接合膜包括基膜，形成在基膜上的压敏粘合剂层和形成在压敏粘合剂层上的接合层。压敏粘合剂层和粘合层之间的粘合强度以及压敏粘合剂层和环形框架之间的粘合强度可以满足以下关系：B / A> = 1.1其中A是压敏粘合剂层和结合层，B是压敏粘合剂层和环形框架之间的粘合强度。

4. 发明申请

US20120141786A1 ADHESIVE FILM FOR SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于半导体器件的粘合膜
公开(公告)号：US20120141786A1
公开(公告)日：2012-06-07
申请号：US13272550
申请日：2011-10-13
申请人： Dong Seon UH , Gyu Seok SONG , Min Kyu HWANG , Ki Tae SONG , Dae Ho SEO
发明人： Dong Seon UH , Gyu Seok SONG , Min Kyu HWANG , Ki Tae SONG , Dae Ho SEO
IPC分类号： B32B27/38 , C08G69/00 , C08G18/00 , B32B7/12 , C08F210/00
CPC分类号： B32B7/06 , B32B27/08 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/30 , B32B2405/00 , C08G18/6254 , C08G59/08 , C08G2170/40 , C08L2312/08 , C09J7/22 , C09J7/385 , C09J163/00 , C09J175/04 , C09J2201/606 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/29084 , H01L2224/2919 , H01L2224/2929 , H01L2224/29388 , H01L2224/32145 , H01L2224/83191 , H01L2224/94 , H01L2924/00013 , H01L2924/061 , H01L2924/0615 , H01L2924/0635 , H01L2924/0665 , H01L2924/0675 , H01L2924/068 , H01L2924/07025 , H01L2924/0705 , Y10T428/28 , Y10T428/31515 , H01L2224/27 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00
摘要： An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 μm/m·° C. at 0 to 5° C.
摘要翻译：一种用于半导体器件的粘合膜，该粘合膜包括在0至5℃下具有约50至约150μm/ m·℃的线性膨胀系数的基膜。

5. 发明申请

US20110142188A1 APPARATUS FOR REMOVING THERMAL SLEEVE FROM COLD LEG OF REACTOR COOLANT SYSTEM 有权
标题翻译：从反应釜冷却系统冷却液中取出热套管的装置
公开(公告)号：US20110142188A1
公开(公告)日：2011-06-16
申请号：US12760060
申请日：2010-04-14
申请人： Won Jong BAEK , Sung Ho JANG , Bum Suk LEE , Ki Tae SONG
发明人： Won Jong BAEK , Sung Ho JANG , Bum Suk LEE , Ki Tae SONG
IPC分类号： G21C19/00
CPC分类号： G21C17/017 , G21C13/032 , G21C19/16 , G21C19/207 , Y02E30/40
摘要： Disclosed is an apparatus for removing a thermal sleeve from a cold leg of a reactor coolant system, which removes an unintentionally separated thermal sleeve without pipe cutting, preventing invasion of impurities into pipes and achieving reliable pipe re-welding. The apparatus includes a sleeve removal tool including a corn head formed at a shaft, a pressure plate below the corn head to maximize hydraulic pressure inside a safety injection pipe, a spring connected to the pressure plate to keep the pressure plate unfolded, and a guide wheel to guide the sleeve removal tool into the safety injection pipe, a horizontal movement carrier including bodies connected to each other by a link, a seating rod for seating of the sleeve removal tool, and moving wheels for movement of the horizontal movement carrier, and a vertical movement carrier including first and second anti-separation bars to prevent separation of the horizontal movement carrier.
摘要翻译：公开了一种用于从反应堆冷却剂系统的冷腿除去热套筒的装置，其在没有管切割的情况下移除无意分离的热套筒，防止杂质入管并实现可靠的管道再焊接。该装置包括套筒拆除工具，其包括形成在轴上的玉米头，在玉米头下方的压力板，以使安全注入管内的液压最大化，连接到压力板以保持压力板展开的弹簧和引导件用于将套筒拆卸工具引导到安全注射管中，水平运动载体包括通过连杆彼此连接的主体，用于安置套筒拆卸工具的安放杆和用于水平运动托架运动的移动轮;以及包括第一和第二防分离杆的垂直运动载体，以防止水平运动载体的分离。

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