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1. 发明授权

US4908695A Cooling apparatus and semiconductor device employing the same 失效
标题翻译：冷却装置及采用该装置的半导体装置
公开(公告)号：US4908695A
公开(公告)日：1990-03-13
申请号：US178650
申请日：1988-04-07
申请人： Atsushi Morihara , Yoshio Naganuma , Shuntaro Koyama , Kazuji Yamada , Tasao Soga , Hideo Arakawa , Shunsuke Nogita , Yukio Hishinuma
发明人： Atsushi Morihara , Yoshio Naganuma , Shuntaro Koyama , Kazuji Yamada , Tasao Soga , Hideo Arakawa , Shunsuke Nogita , Yukio Hishinuma
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.

2. 发明授权

US5095359A Semiconductor package and computer using the package 失效
标题翻译：使用封装的半导体封装和计算机
公开(公告)号：US5095359A
公开(公告)日：1992-03-10
申请号：US413622
申请日：1989-09-28
申请人： Akira Tanaka , Hirokazu Inoue , Kazuji Yamada , Kunio Miyazaki , Osamu Miura , Hideo Arakawa , Hiroshi Yokoyama , Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi
发明人： Akira Tanaka , Hirokazu Inoue , Kazuji Yamada , Kunio Miyazaki , Osamu Miura , Hideo Arakawa , Hiroshi Yokoyama , Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi
IPC分类号： G06F1/18 , H01L21/60 , H01L23/057 , H01L23/467 , H01L23/498 , H01L23/50 , H01L25/065
CPC分类号： H01L23/467 , H01L23/057 , H01L23/49822 , H01L23/50 , H01L24/32 , H01L25/0655 , H01L2224/16225 , H01L2224/32188 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/73253 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107
摘要： A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

3. 发明授权

US5028989A Semiconductor cooling module 失效
标题翻译：半导体冷却模块
公开(公告)号：US5028989A
公开(公告)日：1991-07-02
申请号：US526990
申请日：1990-05-22
申请人： Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi , Koji Sato , Hiroshi Yokoyama
发明人： Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi , Koji Sato , Hiroshi Yokoyama
IPC分类号： H01L23/473 , H01L23/433
CPC分类号： H01L23/4338 , H01L2924/0002
摘要： A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of the semiconductor elements to the cooling medium is provided near the cooling elements and between the thermal conductor and a channel plate mounted on the thermal conductor.
摘要翻译：多个半导体元件安装在基板上。多个冷却元件插入在用于将从半导体元件产生的热量传导到冷却介质和半导体元件的热导体之间。在冷却元件附近以及热导体和安装在导热体上的通道板之间设置用于将半导体元件产生的热量导向冷却介质的通道。

4. 发明授权

US5331510A Electronic equipment and computer with heat pipe 失效
标题翻译：电子设备和电脑配热管
公开(公告)号：US5331510A
公开(公告)日：1994-07-19
申请号：US936299
申请日：1992-08-28
申请人： Katsunori Ouchi , Atsushi Morihara , Yoshio Naganuma , Koji Sato , Ryuichi Kaji
发明人： Katsunori Ouchi , Atsushi Morihara , Yoshio Naganuma , Koji Sato , Ryuichi Kaji
IPC分类号： F28D15/02 , G06F1/20 , H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , G06F1/20 , G06F2200/201 , H01L2224/48091 , H01L2224/49109 , H01L2224/73265
摘要： An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.
摘要翻译：电子设备具有用于散热由发热电子部件产生的热量的热管。电子部件被布置成使得产生更多热量的电子部件布置成更靠近每个热管的散热部分，以防止干燥现象和有效地辐射热量，从而可以有效地从诸如LSI芯片的电子部件产生的热量并且可以抑制电子部件的温度过度上升。当将本发明应用于计算机时，可以减少整个计算机的尺寸。

5. 发明授权

US5537339A Method of operating a plurality of utilities, a utilities network system for carrying out the method and a control device for such a network 失效
标题翻译：操作多个实用程序的方法，用于执行该方法的公用事业网络系统和用于这种网络的控制装置
公开(公告)号：US5537339A
公开(公告)日：1996-07-16
申请号：US197278
申请日：1994-02-16
申请人： Yoshio Naganuma , Akihiro Yamada , Ichiro Enbutsu , Kenji Baba
发明人： Yoshio Naganuma , Akihiro Yamada , Ichiro Enbutsu , Kenji Baba
IPC分类号： B65G61/00 , H02J3/14 , H02J13/00 , G06F19/00
CPC分类号： H02J13/0062 , H02J3/14 , Y02B70/3225 , Y02B90/2638 , Y04S20/222 , Y04S40/124
摘要： In order to operate a plurality of utilities, the utilities are interconnected via a communication path. Each utility has a control device for controlling the utility and a memory for storing information factors which are used by the corresponding control device. The information factors corresponding to all the utilities are investigated by an extraction device to determine which are common to the utilities and which are related. Where the common information factors are identified, they are passed by the communication path to the memories of all the utilities. Similarly, when related information factors are found, a calculating device calculates common information which is also passed via the communication path to the memories of all the utilities. In this way, the utilities may operate more efficiently than when they are operated on a stand-alone basis. The investigation of the information factors, and the calculating of common information from related information factors may be distributed among the utilities or carried out by a common control device. The utilities may be electric power supply systems, district heating and cooling systems, sewage disposal systems, waste recovery systems, etc.
摘要翻译：为了操作多个实用程序，实用程序通过通信路径相互连接。每个实用程序具有用于控制效用的控制装置和用于存储由相应控制装置使用的信息因子的存储器。所有实用程序对应的信息因素由提取装置进行调查，以确定哪些是公用事业公用的，哪些是相关的。在识别公共信息因素的地方，它们被通信路径传递给所有公用设施的记忆。类似地，当找到相关信息因子时，计算装置计算也通过通信路径传递给所有公用设施的存储器的公共信息。以这种方式，公用事业可以比在独立的基础上运行时更有效地运行。信息因素的调查以及相关信息因素的共同信息的计算可以在公用事业中分配，也可以由公共控制装置进行。公用事业可以是电力供应系统，区域供热和制冷系统，污水处理系统，废物回收系统等。

6. 发明授权

US5435380A Heat storage apparatus and method 失效
标题翻译：蓄热装置及方法
公开(公告)号：US5435380A
公开(公告)日：1995-07-25
申请号：US179683
申请日：1994-01-11
申请人： Akihiro Yamada , Makoto Shimoda , Akira Yamada , Yasuo Koseki , Yoshio Naganuma , Hideo Fukutake , Toshihiro Fukuda
发明人： Akihiro Yamada , Makoto Shimoda , Akira Yamada , Yasuo Koseki , Yoshio Naganuma , Hideo Fukutake , Toshihiro Fukuda
IPC分类号： F24F5/00 , F28D15/00
CPC分类号： F24F5/0017 , Y02E60/147
摘要： A heat storage apparatus includes a tank containing a heat storage medium and having an upper region and a lower region for holding the heat storage medium at respective temperatures above and below atmospheric temperature. To reduce heat losses and increase flexibility of use, an intermediate region having heat storage medium is maintained in the tank between the upper and lower regions at a temperature between the upper and lower temperatures. The desired temperature of the intermediate region is maintained by heating or cooling its heat storage medium, for example by use of an otherwise unused low-grade heat source.
摘要翻译：储热装置包括容纳储热介质并具有用于将蓄热介质保持在高于和低于大气温度的相应温度的上部区域和下部区域的罐。为了减少热损失并增加使用的灵活性，在上部和下部温度之间的温度下，在上部和下部区域之间的罐中保持具有储热介质的中间区域。通过加热或冷却其储热介质来维持中间区域的期望温度，例如通过使用另外未使用的低等级热源。

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