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    • 1. 发明授权
    • System for applying recipe of semiconductor manufacturing apparatus
    • 应用半导体制造装置配方的系统
    • US06000830A
    • 1999-12-14
    • US840453
    • 1997-04-18
    • Atsushi AsanoYoshikatsu Miura
    • Atsushi AsanoYoshikatsu Miura
    • G06F19/00
    • G05B19/41855G05B2219/31088G05B2219/45031H01L21/67276Y02P90/185Y02P90/20
    • A system for applying recipes of semiconductor manufacturing apparatuses includes a plurality of apparatus controllers respectively arranged for semiconductor manufacturing apparatus, a host computer commonly connected to the apparatus controllers to store process recipes, and a group controller which is commonly connected to the apparatus controllers through a channel different from channels which connect the apparatus controllers to the host computer, and is connected to the host computer through a dedicated channel to directly exchange information with the host computer. The host computer sends process recipes to the respective apparatus controllers, writes/reads out a recipe in/from the group controller through the dedicated channel, and reads out a recipe history therefrom through the dedicated channel. The apparatus controllers respectively operate the semiconductor manufacturing apparatuses on the basis of the process recipes sent from the host computer. The group controller stores a history of a process recipe used by the semiconductor manufacturing apparatus.
    • 用于应用半导体制造装置的配方的系统包括分别布置用于半导体制造装置的多个装置控制器,与设备控制器共同连接以存储处理配方的主计算机,以及通过连接到装置控制器的组控制器 通道不同于将设备控制器连接到主机的通道,并且通过专用通道连接到主计算机,以直接与主机交换信息。 主计算机将处理配方发送到相应的装置控制器,通过专用信道在组控制器中/从组控制器读出配方,并通过专用信道读出配方历史。 设备控制器基于从主计算机发送的处理配方分别操作半导体制造设备。 组控制器存储半导体制造装置使用的处理配方的历史。
    • 5. 发明授权
    • Device for controlling treating station
    • 控制处理站装置
    • US06282457B1
    • 2001-08-28
    • US09202040
    • 1998-12-07
    • Yoshikatsu MiuraMasaya NagataJunji Harada
    • Yoshikatsu MiuraMasaya NagataJunji Harada
    • G06F1900
    • H01L21/67276H01L21/67173H01L21/67184H01L22/20H01L2924/0002H01L2924/00
    • A control section 20 incorporated in a coating/developing unit 2 is connected to a host computer 4, while a control section 30 incorporated in an exposure unit 3 is connected to the control section 30 of the coating/developing unit 2. Communication with the host computer 4 is performed by the coating/developing unit 2. The control of transfer of a wafer between the coating/developing unit and the exposure unit is executed using a timing signal which is independent of a process instruction output from the host computer 4. The host computer controls the coating/developing unit and the exposure unit using the control section of the coating/developing unit. Supply of instructions to the exposure unit 3 or collection of information therefrom is centrally controlled on the coating/developing unit 2 side.
    • 并入在涂布/显影单元2中的控制部分20连接到主计算机4,而包含在曝光单元3中的控制部分30连接到涂布/显影单元2的控制部分30。与主机通信 计算机4由涂覆/显影单元2执行。使用与从主计算机4输出的处理指令无关的定时信号来执行在涂覆/显影单元和曝光单元之间转印晶片的控制。 主机使用涂布/显影单元的控制部分控制涂布/显影单元和曝光单元。 向涂布/显影单元2侧集中控制对曝光单元3的指示或信息的收集。