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1. 发明授权

US07462317B2 Method of manufacturing an encapsulated package for a magnetic device 失效
标题翻译：制造用于磁性装置的封装包装的方法
公开(公告)号：US07462317B2
公开(公告)日：2008-12-09
申请号：US10985825
申请日：2004-11-10
申请人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
发明人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
IPC分类号： B29C45/14 , H01F27/02
CPC分类号： H01F41/005 , H05K3/284 , Y10T29/4902 , Y10T29/49146 , Y10T29/49155
摘要： A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.
摘要翻译：一种制造用于衬底上的磁性器件的封装封装的方法。在一个实施例中，该方法包括在衬底上提供磁芯并将屏蔽结构放置在磁芯上方以在其周围形成腔室。该方法还包括在腔室内围绕磁芯的一部分沉积密封剂。屏蔽结构限制了进入腔室的密封剂。

2. 发明授权

US5925827A System and method for empirically determining shrinkage stresses in a molded package and power module employing the same 失效
标题翻译：用于经验地确定模制包装中的收缩应力的系统和方法以及使用该收缩应力的功率模块
公开(公告)号：US5925827A
公开(公告)日：1999-07-20
申请号：US938619
申请日：1997-09-25
申请人： Ashraf W. Lotfi , John D. Weld
发明人： Ashraf W. Lotfi , John D. Weld
IPC分类号： G01B7/24 , G01B7/16
CPC分类号： G01B7/24
摘要： A system for, and method of, empirically determining stress in a molded package and a power module embodying the system or the method. In one embodiment, the system includes: (1) a sensor, having a magnetic core exhibiting a known complex permeability in a control environment, that is embedded within the molded package and therefore subject to the stress and (2) a measurement circuit, coupled to the sensor, that applies a drive signal to the sensor, measures a response signal received from the sensor and uses the drive signal and the response signal to determine a complex permeability under stress of the core. The magnitude of the stress can then be determined from the core's complex permeability under stress.
摘要翻译：经验地确定模制包装中的应力的系统和方法以及体现该系统或方法的功率模块。在一个实施例中，系统包括：（1）传感器，其具有在控制环境中呈现已知复合磁导率的磁芯，其嵌入在模制封装内并因此受到应力的影响，以及（2）测量电路对传感器施加驱动信号给传感器，测量从传感器接收到的响应信号，并使用驱动信号和响应信号来确定芯的应力下的复数磁导率。然后可以从应力下的核心复合渗透率确定应力的大小。

3. 发明授权

US08139362B2 Power module with a magnetic device having a conductive clip 有权
标题翻译：具有具有导电夹子的磁性装置的电源模块
公开(公告)号：US08139362B2
公开(公告)日：2012-03-20
申请号：US11243778
申请日：2005-10-05
申请人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
发明人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
IPC分类号： H05K7/00
CPC分类号： H01F17/04 , H01F2027/2814 , H01L25/16 , H01L2224/37147 , H01L2224/40245 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/181 , H01L2924/19105 , H02M3/00 , Y10T29/49076 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01033
摘要： A power module located on a conductive substrate including power conversion circuitry. The power conversion circuitry includes a magnetic device and at least one switch. The magnetic device includes a magnetic core having a surface facing the conductive substrate and a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The power module also includes an encapsulant about the power conversion circuitry.
摘要翻译：位于导电基板上的功率模块，包括功率转换电路。电力转换电路包括磁性装置和至少一个开关。磁性装置包括具有面向导电衬底的表面的磁芯和面向磁芯的表面的导电夹，导电夹的端部电耦合到导电衬底，以协同地形成围绕磁芯的绕组。功率模块还包括关于功率转换电路的密封剂。

4. 发明授权

US08043544B2 Method of manufacturing an encapsulated package for a magnetic device 有权
标题翻译：制造用于磁性装置的封装包装的方法
公开(公告)号：US08043544B2
公开(公告)日：2011-10-25
申请号：US12269651
申请日：2008-11-12
申请人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
发明人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
IPC分类号： B29C45/14
CPC分类号： H01F41/005 , H05K3/284 , Y10T29/4902 , Y10T29/49146 , Y10T29/49155
摘要： A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.
摘要翻译：一种制造用于衬底上的磁性器件的封装封装的方法。在一个实施例中，该方法包括在衬底上提供磁芯并将屏蔽结构放置在磁芯上方以在其周围形成腔室。该方法还包括在腔室内围绕磁芯的一部分沉积密封剂。屏蔽结构限制了进入腔室的密封剂。

5. 发明申请

US20090065964A1 Method of Manufacturing an Encapsulated Package for a Magnetic Device 有权
标题翻译：制造用于磁性装置的封装包装的方法
公开(公告)号：US20090065964A1
公开(公告)日：2009-03-12
申请号：US12269651
申请日：2008-11-12
申请人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
发明人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
IPC分类号： B29C45/14 , H01F27/02
CPC分类号： H01F41/005 , H05K3/284 , Y10T29/4902 , Y10T29/49146 , Y10T29/49155
摘要： A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.
摘要翻译：一种制造用于衬底上的磁性器件的封装封装的方法。在一个实施例中，该方法包括在衬底上提供磁芯并将屏蔽结构放置在磁芯上方以在其周围形成腔室。该方法还包括在腔室内围绕磁芯的一部分沉积密封剂。屏蔽结构限制了进入腔室的密封剂。

6. 发明授权

US5939641A System and method for empirically determining shrinkage stresses in a molded package and power module employing the same 失效
公开(公告)号：US5939641A
公开(公告)日：1999-08-17
申请号：US127707
申请日：1998-07-31
申请人： Ashraf W. Lotfi , John D. Weld
发明人： Ashraf W. Lotfi , John D. Weld
IPC分类号： G01B7/24 , G01B7/16
CPC分类号： G01B7/24
摘要： A system for, and method of, empirically determining stress in a molded package and a power module embodying the system or the method. In one embodiment, the system includes: (1) a sensor, having a magnetic core exhibiting a known complex permeability in a control environment, that is embedded within the molded package and therefore subject to the stress and (2) a measurement circuit, coupled to the sensor, that applies a drive signal to the sensor, measures a response signal received from the sensor and uses the drive signal and the response signal to determine a complex permeability under stress of the core. The magnitude of the stress can then be determined from the core's complex permeability under stress.

7. 发明授权

US08528190B2 Method of manufacturing a power module 有权
标题翻译：电源模块的制造方法
公开(公告)号：US08528190B2
公开(公告)日：2013-09-10
申请号：US12196062
申请日：2008-08-21
申请人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
发明人： Ashraf W. Lotfi , Mathew Wilkowski , John D. Weld
IPC分类号： H01F7/128
CPC分类号： H01F41/005 , H01F17/043 , H01F27/027 , H01F27/255 , H01F27/365 , H05K3/284 , Y10T29/49002 , Y10T29/4902 , Y10T29/49069 , Y10T29/49073 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49171
摘要： A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.
摘要翻译：一种在基板上制造功率模块的方法。在一个实施例中，该方法包括提供功率转换电路，包括提供具有磁芯和至少一个开关的磁性装置。该方法还包括将具有挡板的屏蔽结构放置在磁芯上以在其周围形成腔室。该方法还包括在功率转换电路周围沉积密封剂。屏蔽结构限制了进入腔室的密封剂，并且挡板将密封剂引导离开磁芯，从而限制了在腔室内接触磁芯的密封剂的量。

8. 发明申请

US20100176905A1 Magnetic Device Having a Conductive Clip 有权
标题翻译：具有导电夹的磁性装置
公开(公告)号：US20100176905A1
公开(公告)日：2010-07-15
申请号：US12731921
申请日：2010-03-25
申请人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
发明人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
IPC分类号： H01F5/00
CPC分类号： H01F17/04 , H01F2027/2814 , H01L25/16 , H01L2224/37147 , H01L2224/40245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/181 , H01L2924/19105 , H02M3/00 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01033
摘要： A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.
摘要翻译：一种磁性装置，其包括具有面向导电基板的表面的磁芯。磁性装置还包括面向磁芯的表面的导电夹，导电夹的端部电耦合到导电衬底，以协同地形成围绕磁芯的绕组。

9. 发明授权

US07688172B2 Magnetic device having a conductive clip 有权
标题翻译：具有导电夹的磁性装置
公开(公告)号：US07688172B2
公开(公告)日：2010-03-30
申请号：US11244127
申请日：2005-10-05
申请人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
发明人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
IPC分类号： H01F5/00
CPC分类号： H01F17/04 , H01F2027/2814 , H01L25/16 , H01L2224/37147 , H01L2224/40245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/181 , H01L2924/19105 , H02M3/00 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01033
摘要： A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.
摘要翻译：一种磁性装置，其包括具有面向导电基板的表面的磁芯。磁性装置还包括面向磁芯的表面的导电夹，导电夹的端部电耦合到导电衬底，以协同地形成围绕磁芯的绕组。

10. 发明授权

US08631560B2 Method of forming a magnetic device having a conductive clip 有权
标题翻译：形成具有导电夹子的磁性装置的方法
公开(公告)号：US08631560B2
公开(公告)日：2014-01-21
申请号：US11243537
申请日：2005-10-05
申请人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
发明人： Ashraf W. Lotfi , Mathew A. Wilkowski , Trifon M. Liakopoulos , John D. Weld
IPC分类号： H01F17/04 , H01F27/30
CPC分类号： H01F17/04 , H01F2027/2814 , H01L23/495 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/37147 , H01L2224/40245 , H01L2224/45144 , H01L2224/48247 , H01L2224/49096 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H02M3/00 , Y10T29/4902 , Y10T29/49073 , Y10T29/49121 , H01L2924/00 , H01L2224/45147 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.
摘要翻译：一种形成磁性器件的方法，该方法是通过提供导电衬底并将磁芯放置在导电衬底附近，其表面面向导电衬底。该方法还包括将导电夹子放置在靠近磁芯的表面并将导电夹子的端部电耦合到导电衬底上以协同地形成围绕磁芯的绕组。

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