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    • 5. 发明授权
    • Electron confinement inside magnet of ion implanter
    • 离子注入机磁体内的电子约束
    • US07459692B2
    • 2008-12-02
    • US11272193
    • 2005-11-10
    • Anthony RenauJoseph C. OlsonShengwu ChangJames Buff
    • Anthony RenauJoseph C. OlsonShengwu ChangJames Buff
    • H01J1/50
    • H01J37/1475H01J37/026H01J37/3171H01J2237/0041H01J2237/0042H01J2237/055
    • A method and apparatus are disclosed for improving space charge neutralization adjacent a magnet of an ion implanter by confining the electrons inside a magnetic region thereof to reduce electron losses and therefore improve the transport efficiency of a low energy beam. A magnetic pole member for a magnet of an ion implanter is provided that includes an outer surface having a plurality of magnetic field concentration members that form magnetic field concentrations adjacent the magnetic pole member. Electrons that encounter this increased magnetic field are repelled back along the same magnetic field line rather than allowed to escape. An analyzer magnet and ion implanter including the magnet pole are also provided so that a method of improving low energy ion beam space charge neutralization in an ion implanter is realized.
    • 公开了一种用于通过将电子限制在其磁性区域内以减少电子损失并因此提高低能量束的传输效率来改进邻近离子注入机的磁体的空间电荷中和的方法和装置。 提供了一种用于离子注入机的磁体的磁极构件,其包括具有与磁极构件相邻形成磁场浓度的多个磁场浓度构件的外表面。 遇到这种增加的磁场的电子沿着相同的磁场线被击退,而不是允许逃逸。 还提供了包括磁极的分析器磁体和离子注入机,从而实现了在离子注入机中提高低能量离子束空间电荷中和的方法。
    • 7. 发明授权
    • Bi mode ion implantation with non-parallel ion beams
    • 具有非平行离子束的Bi模式离子注入
    • US06573518B1
    • 2003-06-03
    • US09699653
    • 2000-10-30
    • Anthony RenauJoseph C. Olson
    • Anthony RenauJoseph C. Olson
    • H01J37317
    • H01J37/3171H01J2237/24528H01J2237/24542
    • A method for implanting ions into a workpiece, such as a semiconductor wafer, includes the steps of generating an ion beam, measuring an angle of non-parallelism of the ion beam, tilting the wafer at a first angle, performing a first implant at the first angle, tilting the wafer at a second angle, and performing a second implant at the second angle. The first and second angles are opposite in sign with respect to a reference direction and in magnitude are equal to or greater than the measured angle of non-parallelism. Preferably, the first and second implants are controlled to provide substantially equal ion doses in the workpiece.
    • 用于将离子注入到诸如半导体晶片的工件中的方法包括以下步骤:产生离子束,测量离子束的非平行度的角度,以第一角度倾斜晶片,在 第一角度,以第二角度倾斜晶片,并且以第二角度执行第二植入。 第一和第二角度相对于参考方向的符号相反,并且幅度等于或大于所测量的非平行度的角度。 优选地,控制第一和第二植入物以在工件中提供基本相等的离子剂量。