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1. 发明授权

US07262900B2 Utilizing a protective plug to maintain the integrity of the FTP shrink hinge 有权
标题翻译：利用保护塞保持FTP收缩铰链的完整性
公开(公告)号：US07262900B2
公开(公告)日：2007-08-28
申请号：US11125473
申请日：2005-05-10
申请人： Anthony DiCarlo , Rabah Mezenner , James C. Baker , Mark A. Franklin , George Harakas
发明人： Anthony DiCarlo , Rabah Mezenner , James C. Baker , Mark A. Franklin , George Harakas
IPC分类号： G02B26/00
CPC分类号： G02B26/0833 , B81B2201/042 , B81B2203/0181 , B81C1/00801 , B81C2201/053
摘要： As robust hinge post structure for use with torsional hinged devices such as micromirrors and method of manufacturing is disclosed. The fabrication process uses a protective layer such as BARC on the bottom of the aperture used to form the hinge post structure to protect an oxide layer during an etching step. The oxide layer, in turn protects the metal layer at the bottom of the aperture. Therefore, the metal layer, the oxide layer, and the protective layer prevent the erosion and/or pitting of the bottom electrode during a cleaning process, and provide additional support to the structure.
摘要翻译：公开了用于扭转铰接装置如微反射镜和制造方法的坚固的铰链柱结构。制造工艺在用于形成铰链柱结构的孔的底部上使用诸如BARC的保护层，以在蚀刻步骤期间保护氧化物层。氧化物层又保护孔的底部的金属层。因此，金属层，氧化物层和保护层在清洁过程中防止底部电极的侵蚀和/或点蚀，并为结构提供额外的支撑。

2. 发明申请

US20060255424A1 Utilizing a protective plug to maintain the integrity of the FTP shrink hinge 有权
标题翻译：利用保护塞保持FTP收缩铰链的完整性
公开(公告)号：US20060255424A1
公开(公告)日：2006-11-16
申请号：US11125473
申请日：2005-05-10
申请人： Anthony DiCarlo , Rabah Mezenner , James Baker , Mark Franklin , George Harakas
发明人： Anthony DiCarlo , Rabah Mezenner , James Baker , Mark Franklin , George Harakas
IPC分类号： H01L29/00
CPC分类号： G02B26/0833 , B81B2201/042 , B81B2203/0181 , B81C1/00801 , B81C2201/053
摘要： As robust hinge post structure for use with torsional hinged devices such as micromirrors and method of manufacturing is disclosed. The fabrication process uses a protective layer such as BARC on the bottom of the aperture used to form the hinge post structure to protect an oxide layer during an etching step. The oxide layer, in turn protects the metal layer at the bottom of the aperture. Therefore, the metal layer, the oxide layer, and the protective layer prevent the erosion and/or pitting of the bottom electrode during a cleaning process, and provide additional support to the structure.
摘要翻译：公开了用于扭转铰接装置如微反射镜和制造方法的坚固的铰链柱结构。制造工艺在用于形成铰链柱结构的孔的底部上使用诸如BARC的保护层，以在蚀刻步骤期间保护氧化物层。氧化物层又保护孔的底部的金属层。因此，金属层，氧化物层和保护层在清洁过程中防止底部电极的侵蚀和/或点蚀，并为结构提供额外的支撑。

3. 发明授权

US07252395B2 MEMS device deflection stop 有权
标题翻译： MEMS器件偏转停止
公开(公告)号：US07252395B2
公开(公告)日：2007-08-07
申请号：US11372686
申请日：2006-03-10
申请人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
发明人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
IPC分类号： G02B26/00
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array fabricated on a semiconductor substrate. The array is comprised of three operating layers. An addressing layer is fabricated on the substrate. A hinge layer is spaced above the addressing layer by an air gap. A mirror layer is spaced over the hinge layer by a second air gap. The hinge layer has a hinge under and attached to the mirror, the hinge permitting the mirror to tilt. The hinge layer further has spring tips under the mirror, which are attached to the addressing layer. These spring tips provide a stationary landing surface for the mirror.
摘要翻译：制造在半导体衬底上的微镜阵列。该阵列由三个操作层组成。在衬底上制造寻址层。铰链层通过气隙在寻址层上方间隔开。镜层通过第二气隙在铰链层上间隔开。铰链层具有在镜子下方并附接到铰链上的铰链，铰链允许镜子倾斜。铰链层还具有在镜下的弹簧尖端，其附接到寻址层。这些弹簧尖端为镜子提供了固定的着陆面。

4. 发明授权

US07654677B2 Yokeless hidden hinge digital micromirror device 有权
标题翻译：无线隐形铰链数码微镜装置
公开(公告)号：US07654677B2
公开(公告)日：2010-02-02
申请号：US11834583
申请日：2007-08-06
申请人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
发明人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
IPC分类号： G02B26/08 , G02B28/00
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译：制造在半导体衬底11上的微镜阵列110.阵列110由三个工作层12,13,14组成。寻址层12被制造在衬底上。铰链层13通过气隙在寻址层12上方间隔开。镜层14通过第二气隙在铰链层13上间隔开。铰链层13在反射镜14a的下方并具有铰链13a，铰链13a允许反射镜14a倾斜。铰链层13还具有安装在寻址层12下方的反射镜14a下面的弹簧尖端13c。这些弹簧顶端13c为反射镜14a提供固定的着陆面。

5. 发明申请

US20070285757A1 Yokeless Hidden Hinge Digital Micromirror Device 有权
标题翻译：无线隐藏式数字微镜装置
公开(公告)号：US20070285757A1
公开(公告)日：2007-12-13
申请号：US11834583
申请日：2007-08-06
申请人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
发明人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
IPC分类号： G02B26/08
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译：制造在半导体衬底11上的微镜阵列110。阵列110由三个操作层12,13,14组成。在衬底上制造寻址层12。铰链层13通过气隙在寻址层12上方间隔开。镜层14通过第二气隙在铰链层13上间隔开。铰链层13具有在反射镜14a下面并附接到铰链13a上的铰链13a，铰链13a允许反射镜14a倾斜。铰链层13还具有附接到寻址层12的反射镜13a下的弹簧尖端13c。这些弹簧尖端13c为反射镜14a提供固定的着陆面。

6. 发明申请

US20060152690A1 Yokeless hidden hinge digital micromirror device 有权
标题翻译：无线隐形铰链数码微镜装置
公开(公告)号：US20060152690A1
公开(公告)日：2006-07-13
申请号：US11372686
申请日：2006-03-10
申请人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
发明人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
IPC分类号： G03B21/28
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译：制造在半导体衬底11上的微镜阵列110。阵列110由三个操作层12,13,14组成。在衬底上制造寻址层12。铰链层13通过气隙在寻址层12上方间隔开。镜层14通过第二气隙在铰链层13上间隔开。铰链层13具有在反射镜14a下面并附接到铰链13a上的铰链13a，铰链13a允许反射镜14a倾斜。铰链层13还具有附接到寻址层12的反射镜13a下的弹簧尖端13c。这些弹簧尖端13c为反射镜14a提供固定的着陆面。

7. 发明授权

US07011415B2 Yokeless hidden hinge digital micromirror device 有权
标题翻译：无线隐形铰链数码微镜装置
公开(公告)号：US07011415B2
公开(公告)日：2006-03-14
申请号：US10298423
申请日：2002-11-18
申请人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
发明人： Anthony DiCarlo , Patrick I. Oden , Richard L. Knipe , Rabah Mezenner , James D. Huffman
IPC分类号： G02B26/00
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array fabricated on a semiconductor substrate. The array is comprised of three operating layers. An addressing layer is fabricated on the substrate. A hinge layer is spaced above the addressing layer by an air gap. A mirror layer is spaced over the hinge layer by a second air gap. The hinge layer has a hinge under and attached to the mirror, the hinge permitting the mirror to tilt. The hinge layer further has spring tips under the mirror, which are attached to the addressing layer. These spring tips provide a stationary landing surface for the mirror.
摘要翻译：制造在半导体衬底上的微镜阵列。该阵列由三个操作层组成。在衬底上制造寻址层。铰链层通过气隙在寻址层上方间隔开。镜层通过第二气隙在铰链层上间隔开。铰链层具有在镜子下方并附接到铰链上的铰链，铰链允许镜子倾斜。铰链层还具有在镜下的弹簧尖端，其附接到寻址层。这些弹簧尖端为镜子提供了固定的着陆面。

8. 发明授权

US07871931B2 Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same 有权
标题翻译：位于光致抗蚀剂层之上的金属层的化学机械平面化方法以及使用该方法制造微型像素阵列的方法
公开(公告)号：US07871931B2
公开(公告)日：2011-01-18
申请号：US11231249
申请日：2005-09-20
申请人： Anthony DiCarlo , Jingqiu Chen , Yanghua He , James C. Baker , David A. Rothenbury
发明人： Anthony DiCarlo , Jingqiu Chen , Yanghua He , James C. Baker , David A. Rothenbury
IPC分类号： H01L21/302
CPC分类号： G03F7/40 , G02B26/0841
摘要： The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.
摘要翻译：本发明提供了一种用于平坦化金属层的方法和一种用于制造微像素阵列的方法。用于平坦化金属层的方法，但不限于，可以包括在光致抗蚀剂层上形成金属层，然后使用化学机械平坦化工艺平坦化金属层的步骤。

9. 发明申请

US20070035807A1 Unique method for manufacturing a digital micromirror device and a method for manufacturing a projection display system using the same 有权
标题翻译：用于制造数字微镜器件的独特方法和使用其的投影显示系统的制造方法
公开(公告)号：US20070035807A1
公开(公告)日：2007-02-15
申请号：US11203854
申请日：2005-08-15
申请人： Anthony DiCarlo , Stephen Meisner
发明人： Anthony DiCarlo , Stephen Meisner
IPC分类号： G02B26/00
CPC分类号： G02B26/0841
摘要： The present invention provides a method for manufacturing a digital micromirror device and a method for manufacturing a projection display system. The method for manufacturing the digital micromirror device, without limitation, may include providing a material stack (130), the material stack (130) including a spacer layer (140) having one or more openings (145) therein and located over control circuitry (110) located on or in a semiconductor substrate (105), a layer of hinge material (150) located over the spacer layer (140) and within the one or more openings (145), and a layer of hinge support material (160) located over the layer of hinge material (150) and within the one or more openings (145). The method may further include patterning the layer of hinge support material (160) using photoresist (180), patterning the layer of hinge material (150) using the patterned layer of hinge support material (160) as a hardmask, and removing the patterned layer of hinge support material (160) from over an upper surface of the patterned layer of hinge material (150).
摘要翻译：本发明提供一种数字微镜器件的制造方法及投影显示系统的制造方法。用于制造数字微镜装置的方法，但不限于，可以包括提供材料堆叠（130），所述材料堆叠（130）包括其中具有一个或多个开口（145）的间隔层（140），并且位于控制电路位于半导体衬底（105）上或半导体衬底（105）中的一层铰链材料（150），位于间隔层（140）上方并且在一个或多个开口（145）内，以及铰链支撑材料层（160）位于所述铰链材料层（150）之上并且位于所述一个或多个开口（145）内。该方法还可以包括使用光致抗蚀剂（180）图案化铰链支撑材料层（160），使用铰链支撑材料（160）的图案化层作为硬掩模来图案化铰链材料层（150），并且去除图案层铰链支撑材料（160）从铰链材料（150）的图案化层的上表面上方延伸。

10. 发明申请

US20070066063A1 Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same 有权
标题翻译：位于光致抗蚀剂层之上的金属层的化学机械平面化方法以及使用该方法制造微型像素阵列的方法
公开(公告)号：US20070066063A1
公开(公告)日：2007-03-22
申请号：US11231249
申请日：2005-09-20
申请人： Anthony DiCarlo , Jingqiu Chen , Yanghua He , James Baker , David Rothenbury
发明人： Anthony DiCarlo , Jingqiu Chen , Yanghua He , James Baker , David Rothenbury
IPC分类号： H01L21/302
CPC分类号： G03F7/40 , G02B26/0841
摘要： The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.
摘要翻译：本发明提供了一种用于平坦化金属层的方法和一种用于制造微像素阵列的方法。用于平坦化金属层的方法，但不限于，可以包括在光致抗蚀剂层上形成金属层，然后使用化学机械平坦化工艺平坦化金属层的步骤。

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