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    • 2. 发明授权
    • Inkjet printed leadframes
    • 喷墨打印引线框
    • US07667304B2
    • 2010-02-23
    • US12110991
    • 2008-04-28
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • H01L23/495H01L21/44
    • H01L21/4821H01L21/6835H01L23/49579H01L24/97H01L2221/68345H01L2924/14H01L2924/00
    • Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.
    • 公开了用于集成电路装置的用于喷墨印刷电互连图案的引线框架的装置和方法。 一种用于包装的装置包括适于高温处理的薄基板,以及使用金属纳米接头喷墨印刷到薄基板上的连接焊盘和接触区域。 然后将nanoink固化以除去液体内容物。 剩余的金属引线框架或电互连图案具有约10至50微米或更小的基本一致的厚度。 相关联的面板组件包括导电衬底面板,该导电衬底面板具有多个单独的器件阵列,每个单独的器件阵列包括多个电互连图案,每个均包括安装在导电衬底面板上的多个集成电路器件,以及封装集成电路器件和相关联的电互连图案的模制帽。 模制帽在每个分离的装置阵列上具有基本均匀的厚度,并且延伸到分离的装置阵列之间的空间中。
    • 3. 发明申请
    • INKJET PRINTED LEADFRAMES
    • US20090267216A1
    • 2009-10-29
    • US12110991
    • 2008-04-28
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • H01L23/48H01L21/4763
    • H01L21/4821H01L21/6835H01L23/49579H01L24/97H01L2221/68345H01L2924/14H01L2924/00
    • Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.
    • 公开了用于集成电路装置的用于喷墨印刷电互连图案的引线框架的装置和方法。 一种用于包装的装置包括适于高温处理的薄基板,以及使用金属纳米接头喷墨印刷到薄基板上的连接焊盘和接触区域。 然后将nanoink固化以除去液体内容物。 剩余的金属引线框架或电互连图案具有约10至50微米或更小的基本一致的厚度。 相关联的面板组件包括导电衬底面板,该导电衬底面板具有多个单独的器件阵列,每个器件阵列包括多个电互连图案,每个电连接图案,安装在导电衬底面板上的多个集成电路器件,以及封装集成电路器件和相关电气互连图案的模制帽。 模制帽在每个分离的装置阵列上具有基本均匀的厚度,并且延伸到分离的装置阵列之间的空间中。
    • 5. 发明授权
    • Inkjet printed leadframe
    • 喷墨印刷引线框
    • US07824963B2
    • 2010-11-02
    • US12626440
    • 2009-11-25
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • H01L21/44H01L23/495
    • H01L21/4821H01L21/6835H01L23/49579H01L24/97H01L2221/68345H01L2924/14H01L2924/00
    • Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.
    • 公开了用于集成电路装置的用于喷墨印刷电互连图案的引线框架的装置和方法。 一种用于包装的装置包括适于高温处理的薄基板,以及使用金属纳米接头喷墨印刷到薄基板上的连接焊盘和接触区域。 然后将nanoink固化以除去液体内容物。 剩余的金属引线框架或电互连图案具有约10至50微米或更小的基本一致的厚度。 相关联的面板组件包括导电衬底面板,该导电衬底面板具有多个单独的器件阵列,每个单独的器件阵列包括多个电互连图案,每个均包括安装在导电衬底面板上的多个集成电路器件,以及封装集成电路器件和相关联的电互连图案的模制帽。 模制帽在每个分离的装置阵列上具有基本均匀的厚度,并且延伸到分离的装置阵列之间的空间中。
    • 7. 发明申请
    • INKJET PRINTED LEADFRAME
    • US20100072613A1
    • 2010-03-25
    • US12626440
    • 2009-11-25
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • Randall L. WalbergLuu T. NguyenAnindya Poddar
    • H01L23/52H01L21/50G06F17/50H01L21/70
    • H01L21/4821H01L21/6835H01L23/49579H01L24/97H01L2221/68345H01L2924/14H01L2924/00
    • Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.
    • 公开了用于集成电路装置的用于喷墨印刷电互连图案的引线框架的装置和方法。 一种用于包装的装置包括适于高温处理的薄基板,以及使用金属纳米接头喷墨印刷到薄基板上的连接焊盘和接触区域。 然后将nanoink固化以除去液体内容物。 剩余的金属引线框架或电互连图案具有约10至50微米或更小的基本一致的厚度。 相关联的面板组件包括导电衬底面板,该导电衬底面板具有多个单独的器件阵列,每个器件阵列包括多个电互连图案,每个电连接图案,安装在导电衬底面板上的多个集成电路器件,以及封装集成电路器件和相关联的电互连图案的模制 模制帽在每个分离的装置阵列上具有基本均匀的厚度,并且延伸到分离的装置阵列之间的空间中。