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    • 5. 发明授权
    • Programmable high speed routing switch
    • 可编程高速路由交换机
    • US5760605A
    • 1998-06-02
    • US723082
    • 1996-09-30
    • Ying W. Go
    • Ying W. Go
    • H03K17/06H03K17/24H03K19/094
    • H03K17/063H03K17/24
    • A programmable high speed routing switch is provided which has a lower ON-resistance so as to increase its gate oxide reliability. The routing switch includes a non-volatile memory cell (12) having a floating gate (FG). The floating gate is selectively charged and discharged to provide either a net positive potential or a net negative potential. The routing switch also includes a memory transistor (14), a pass gate transistor (16), and a poly load element (18). The source of the memory transistor is connected to a first power supply potential. The gate of the memory transistor is connected to the floating gate of the memory cell, and the drain thereof is connected to the gate of the pass gate transistor and to a first end of the poly load element. The drain of the pass gate transistor is connected to a first signal line (PG1) and the source of the pass gate transistor is connected to a second signal line (PG2). The second end of the poly load element is connected to a second power supply potential.
    • 提供了一种可编程的高速布线开关,其具有较低的导通电阻,从而增加其栅极氧化可靠性。 路由交换机包括具有浮动门(FG)的非易失性存储单元(12)。 浮栅被选择性地充电和放电以提供净正电位或净负电位。 路由选择开关还包括存储晶体管(14),栅极晶体管(16)和多重负载元件(18)。 存储晶体管的源极连接到第一电源电位。 存储晶体管的栅极连接到存储单元的浮置栅极,其漏极连接到栅极晶体管的栅极和多重负载元件的第一端。 栅极晶体管的漏极连接到第一信号线(PG1),并且栅极晶体管的源极连接到第二信号线(PG2)。 多负载元件的第二端连接到第二电源电位。
    • 6. 发明授权
    • Method for manufacturing a non-volatile electrically alterable memory cell that stores multiple data
    • 用于制造存储多个数据的非易失性电可变存储器单元的方法
    • US07544566B2
    • 2009-06-09
    • US11744730
    • 2007-05-04
    • Andy T. YuYing W. Go
    • Andy T. YuYing W. Go
    • H01L21/336
    • H01L27/11521H01L27/115H01L29/7887H01L29/7923
    • A self-aligned method for manufacturing an electrically alterable memory device on a semiconductor layer includes (a) forming an insulating layer on the semiconductor layer, (b) depositing a first conductive layer on the insulating layer, (c) forming trench isolation regions along and into the semiconductor layer, (d) depositing a sacrificial material on the first conductive layer, (e) etching the sacrificial material to form isolation channels, (f) forming two gate masks along lateral sides of the sacrificial material, (g) etching the first conductive layer to extend the channels to the insulating layer, (h) etching the sacrificial material to form a control channel, (i) etching the block of the first conductive layer, and (j) filling the control channel with a second conductive layer.
    • 用于在半导体层上制造电可变存储器件的自对准方法包括:(a)在半导体层上形成绝缘层,(b)在绝缘层上沉积第一导电层,(c)沿着绝缘层形成沟槽隔离区 (d)在第一导电层上沉积牺牲材料,(e)蚀刻牺牲材料以形成隔离通道,(f)沿牺牲材料的侧面形成两个栅极掩模,(g)蚀刻 所述第一导电层将所述通道延伸到所述绝缘层,(h)蚀刻所述牺牲材料以形成控制沟道,(i)蚀刻所述第一导电层的所述块,以及(j)用所述第二导电 层。