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1. 发明授权

US08257152B2 Silicate composite polishing pad 有权
标题翻译：硅酸复合抛光垫
公开(公告)号：US08257152B2
公开(公告)日：2012-09-04
申请号：US12945557
申请日：2010-11-12
申请人： Andrew R. Wank , Donna M. Alden , Joseph K. So , Robert Gargione , Mark E. Gazze , David Drop , Colin F. Cameron, Jr. , Mai Tieu Banh , Shawn Riley
发明人： Andrew R. Wank , Donna M. Alden , Joseph K. So , Robert Gargione , Mark E. Gazze , David Drop , Colin F. Cameron, Jr. , Mai Tieu Banh , Shawn Riley
IPC分类号： B24D11/00
CPC分类号： B24B37/24
摘要： The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.
摘要翻译：本发明提供了一种用于抛光半导体，磁性和光学衬底中的至少一种的抛光垫。它包括具有抛光表面的聚合物基质。聚合物微量元素分布在聚合物基体内和聚合物基质的抛光表面。分布在每个聚合微量元素内的含硅酸盐的区域涂覆小于聚合物微量元素的外表面的50％。低于0.1重量％的聚合物微量元素与i）具有大于5μm的粒度的硅酸盐颗粒相关联; ii）覆盖聚合物微量元素的外表面的大于50％的含硅酸盐区域; 和iii）用硅酸盐颗粒聚集到大于120μm的平均簇尺寸的聚合物微量元素。

2. 发明申请

US20120117888A1 Hollow Polymeric-Silicate Composite 有权
标题翻译：中空聚合硅酸盐复合材料
公开(公告)号：US20120117888A1
公开(公告)日：2012-05-17
申请号：US12945587
申请日：2010-11-12
申请人： Andrew R. Wank , Donna M. Alden , Mark E. Gazze , Robert Gargione , Joseph K. So , David Drop , Mai Tieu Banh , Shawn Riley
发明人： Andrew R. Wank , Donna M. Alden , Mark E. Gazze , Robert Gargione , Joseph K. So , David Drop , Mai Tieu Banh , Shawn Riley
IPC分类号： B24D3/00 , C09K3/14
CPC分类号： B24B37/24 , Y10T428/24405 , Y10T428/249954
摘要： The invention provides a plurality of polymeric particles embedded with silicate that include gas-filled polymeric microelements. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell having an outer surface and a diameter of 5 μm to 200 μm with silicate particles embedded in the polymer. The silicate particles have an average particle size of 0.01 to 3 μm. The silicate-containing regions are spaced to coat less than 50 percent of the outer surface of the polymeric microelements; and less than 0.1 weight percent total of the polymeric microelements is associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric micro elements agglomerated with silicate particles to an average cluster size of greater than 120 μm.
摘要翻译：本发明提供了包含硅酸盐的多个聚合物颗粒，其包括气体填充的聚合物微量元素。气体填充的聚合物微量元素具有壳，密度为5g / l至200g / l。壳体具有外表面，直径为5μm至200μm，硅酸盐颗粒嵌入聚合物中。硅酸盐颗粒的平均粒径为0.01〜3μm。含硅酸盐的区域间隔开以涂覆低于聚合物微量元素外表面的50％; 并且少于0.1重量％的聚合物微量元素与i）具有大于5μm的粒度的硅酸盐颗粒相关联; ii）覆盖聚合物微量元素的外表面的大于50％的含硅酸盐区域; 和iii）用硅酸盐颗粒凝聚成大于120μm的平均簇尺寸的聚合物微量元素。

3. 发明授权

US08357446B2 Hollow polymeric-silicate composite 有权
标题翻译：中空聚硅酸盐复合材料
公开(公告)号：US08357446B2
公开(公告)日：2013-01-22
申请号：US12945587
申请日：2010-11-12
申请人： Andrew R. Wank , Donna M. Alden , Mark E. Gazze , Robert Gargione , Joseph K. So , David Drop , Mai Tieu Banh , Shawn Riley
发明人： Andrew R. Wank , Donna M. Alden , Mark E. Gazze , Robert Gargione , Joseph K. So , David Drop , Mai Tieu Banh , Shawn Riley
IPC分类号： D06N7/04 , B32B3/26 , B24D18/00 , B24D3/02 , C09C1/68
CPC分类号： B24B37/24 , Y10T428/24405 , Y10T428/249954
摘要： The invention provides a plurality of polymeric particles embedded with silicate that include gas-filled polymeric microelements. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell having an outer surface and a diameter of 5 μm to 200 μm with silicate particles embedded in the polymer. The silicate particles have an average particle size of 0.01 to 3 μm. The silicate-containing regions are spaced to coat less than 50 percent of the outer surface of the polymeric microelements; and less than 0.1 weight percent total of the polymeric microelements is associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric micro elements agglomerated with silicate particles to an average cluster size of greater than 120 μm.
摘要翻译：本发明提供了包含硅酸盐的多个聚合物颗粒，其包括气体填充的聚合物微量元素。气体填充的聚合物微量元素具有壳，密度为5g / l至200g / l。壳体具有外表面，直径为5μm至200μm，硅酸盐颗粒嵌入聚合物中。硅酸盐颗粒的平均粒径为0.01〜3μm。含硅酸盐的区域间隔开以涂覆低于聚合物微量元素外表面的50％; 并且少于0.1重量％的聚合物微量元素与i）具有大于5μm的粒度的硅酸盐颗粒相关联; ii）覆盖聚合物微量元素的外表面的大于50％的含硅酸盐区域; 和iii）用硅酸盐颗粒凝聚成大于120μm的平均簇尺寸的聚合物微量元素。

4. 发明授权

US08202334B2 Method of forming silicate polishing pad 有权
标题翻译：形成硅酸盐抛光垫的方法
公开(公告)号：US08202334B2
公开(公告)日：2012-06-19
申请号：US12945504
申请日：2010-11-12
申请人： Donna M. Alden , Andrew R. Wank , Robert Gargione , Mark E. Gazze , Joseph K. So , David Drop , Shawn Riley , Mai Tieu Banh
发明人： Donna M. Alden , Andrew R. Wank , Robert Gargione , Mark E. Gazze , Joseph K. So , David Drop , Shawn Riley , Mai Tieu Banh
IPC分类号： B24D3/00 , B24D11/00 , B24D7/19 , B24D7/30 , B24D1/00 , B28D11/18
CPC分类号： B24B37/24
摘要： The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.1 weight percent total of the polymeric microelements being associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm. Inserting the cleaned polymeric microelements into a polymeric matrix forms the polishing pad.
摘要翻译：该方法提供一种制备用于抛光半导体，磁性和光学基底中的至少一种的含硅酸盐的抛光垫的方法。该方法包括将气体填充的聚合物微量元素的进料流引入气体射流。聚合物微量元素具有不同的密度，变化的壁厚和不同的粒度。通过在Coanda块附近的气体喷射器中充满气体的微量元件，柯恩达块具有弯曲的壁，用于将聚合物微量元素与柯达效应，惯性和气体流动阻力分开。来自柯安达块弯曲壁的粗聚合物微量元素，用于清洁聚合物微量元素。收集的聚合物微量元素含有小于0.1重量％的聚合物微量元素，其与i）具有大于5μm的粒度的硅酸盐颗粒相关联; ii）覆盖聚合物微量元素的外表面的大于50％的含硅酸盐区域; 和iii）用硅酸盐颗粒聚集到大于120μm的平均簇尺寸的聚合物微量元素。将清洁的聚合物微量元件插入聚合物基质中形成抛光垫。

5. 发明申请

US20120122381A1 Silicate Composite Polishing Pad 有权
标题翻译：硅酸盐复合抛光垫
公开(公告)号：US20120122381A1
公开(公告)日：2012-05-17
申请号：US12945557
申请日：2010-11-12
申请人： Andrew R. Wank , Donna M. Alden , Joseph K. So , Robert Gargione , Mark E. Gazze , David Drop , Colin E. Cameron, JR. , Mai Tieu Banh , Shawn Riley
发明人： Andrew R. Wank , Donna M. Alden , Joseph K. So , Robert Gargione , Mark E. Gazze , David Drop , Colin E. Cameron, JR. , Mai Tieu Banh , Shawn Riley
IPC分类号： B24D11/00
CPC分类号： B24B37/24
摘要： The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.
摘要翻译：本发明提供了一种用于抛光半导体，磁性和光学衬底中的至少一种的抛光垫。它包括具有抛光表面的聚合物基质。聚合物微量元素分布在聚合物基体内和聚合物基质的抛光表面。分布在每个聚合微量元素内的含硅酸盐的区域涂覆小于聚合物微量元素的外表面的50％。低于0.1重量％的聚合物微量元素与i）具有大于5μm的粒度的硅酸盐颗粒相关联; ii）覆盖聚合物微量元素的外表面的大于50％的含硅酸盐区域; 和iii）用硅酸盐颗粒聚集到大于120μm的平均簇尺寸的聚合物微量元素。

6. 发明申请

US20120117889A1 METHOD OF FORMING SILICATE POLISHING PAD 有权
标题翻译：形成硅酸盐抛光垫的方法
公开(公告)号：US20120117889A1
公开(公告)日：2012-05-17
申请号：US12945504
申请日：2010-11-12
申请人： Donna M. Alden , Andrew R. Wank , Robert Gargione , Mark E. Gazze , Joseph K. So , David Drop , Shawn Riley , Mai Tieu Banh
发明人： Donna M. Alden , Andrew R. Wank , Robert Gargione , Mark E. Gazze , Joseph K. So , David Drop , Shawn Riley , Mai Tieu Banh
IPC分类号： B24D11/00
CPC分类号： B24B37/24
摘要： The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.1 weight percent total of the polymeric microelements being associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm. Inserting the cleaned polymeric microelements into a polymeric matrix forms the polishing pad.
摘要翻译：该方法提供一种制备用于抛光半导体，磁性和光学基底中的至少一种的含硅酸盐的抛光垫的方法。该方法包括将气体填充的聚合物微量元素的进料流引入气体射流。聚合物微量元素具有不同的密度，变化的壁厚和不同的粒度。通过在Coanda块附近的气体喷射器中充满气体的微量元件，柯恩达块具有弯曲的壁，用于将聚合物微量元素与柯达效应，惯性和气体流动阻力分开。来自柯安达块弯曲壁的粗聚合物微量元素，用于清洁聚合物微量元素。收集的聚合物微量元素含有小于0.1重量％的聚合物微量元素，其与i）具有大于5μm的粒度的硅酸盐颗粒相关联; ii）覆盖聚合物微量元素的外表面的大于50％的含硅酸盐区域; 和iii）用硅酸盐颗粒聚集到大于120μm的平均簇尺寸的聚合物微量元素。将清洁的聚合物微量元件插入聚合物基质中形成抛光垫。

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