专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08826529B2 Method of forming a micro-electromechanical system device 有权
标题翻译：形成微机电系统装置的方法
公开(公告)号：US08826529B2
公开(公告)日：2014-09-09
申请号：US12975090
申请日：2010-12-21
申请人： Andrew Joseph Detor , Reed Corderman , Christopher Keimel , Marco Aimi
发明人： Andrew Joseph Detor , Reed Corderman , Christopher Keimel , Marco Aimi
IPC分类号： H05K3/10 , C25D7/00 , H05K13/04 , C25D5/50 , H01H1/00 , H01H59/00 , C25D3/56
CPC分类号： C25D7/00 , C25D1/003 , C25D3/562 , C25D5/02 , C25D5/022 , C25D5/48 , C25D5/50 , C25D7/123 , H01H1/0036 , H01H59/0009 , H01H2001/0052 , H01H2001/0084 , H01L2924/01079 , H05K13/0486 , H05K2201/0355 , Y10S977/70 , Y10S977/701 , Y10S977/708 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A device includes a substrate (308) and a metallic layer (336) formed over the substrate (308) with a deposition process for which the metallic layer (336) is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer (336) is reduced relative to the pre-determinable as-deposited defect density of the same layer (336) or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate (308) is provided and a removable layer (330) is formed over the substrate (308). A metallic layer (336) is formed over the removable layer (330) and is patterned and etched to define a structure over the removable layer (330). The removable layer (330) is removed, and the metallic layer (336) is heated for a time beyond that necessary for bonding of a hermetic sealing cap (340) thereover.
摘要翻译：一种器件包括通过沉积工艺形成在衬底（308）上方的衬底（308）和金属层（336），金属层（336）可以将金属层（336）表征为具有可预定的沉积缺陷密度。作为制造工艺的结果，金属层（336）的缺陷密度相对于同一层（336）或具有类似组成的另一层的预先确定的沉积缺陷密度降低，并且形成在类似沉积条件。在相关方法中，提供衬底（308），并且在衬底（308）之上形成可移除层（330）。金属层（336）形成在可移除层（330）上方并被图案化和蚀刻以限定可移除层（330）上的结构。去除可移除层（330），并且将金属层（336）加热超过其上的气密密封盖（340）的粘合所需的时间。

2. 发明申请

US20110163397A1 Composition and Manufacturing Method 有权
标题翻译：组成和制造方法
公开(公告)号：US20110163397A1
公开(公告)日：2011-07-07
申请号：US12975090
申请日：2010-12-21
申请人： Andrew Joseph Detor , Reed Corderman , Christopher Keimel , Marco Aimi
发明人： Andrew Joseph Detor , Reed Corderman , Christopher Keimel , Marco Aimi
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： C25D7/00 , C25D1/003 , C25D3/562 , C25D5/02 , C25D5/022 , C25D5/48 , C25D5/50 , C25D7/123 , H01H1/0036 , H01H59/0009 , H01H2001/0052 , H01H2001/0084 , H01L2924/01079 , H05K13/0486 , H05K2201/0355 , Y10S977/70 , Y10S977/701 , Y10S977/708 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A device includes a substrate (308) and a metallic layer (336) formed over the substrate (308) with a deposition process for which the metallic layer (336) is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer (336) is reduced relative to the pre-determinable as-deposited defect density of the same layer (336) or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate (308) is provided and a removable layer (330) is formed over the substrate (308). A metallic layer (336) is formed over the removable layer (330) and is patterned and etched to define a structure over the removable layer (330). The removable layer (330) is removed, and the metallic layer (336) is heated for a time beyond that necessary for bonding of a hermetic sealing cap (340) thereover.
摘要翻译：一种器件包括通过沉积工艺形成在衬底（308）上方的衬底（308）和金属层（336），金属层（336）可以将金属层（336）表征为具有可预定的沉积缺陷密度。作为制造工艺的结果，金属层（336）的缺陷密度相对于相同层（336）或具有类似组成的另一层的可预先确定的沉积缺陷密度降低，并且形成在类似沉积条件。在相关方法中，提供衬底（308），并且在衬底（308）之上形成可移除层（330）。金属层（336）形成在可移除层（330）上方并被图案化和蚀刻以限定可移除层（330）上的结构。去除可移除层（330），并且将金属层（336）加热超过其上的气密密封盖（340）的粘合所需的时间。

3. 发明申请

US20060260919A1 Methods and apparatus for filling a microswitch with liquid metal 审中-公开
标题翻译：用液态金属填充微动开关的方法和装置
公开(公告)号：US20060260919A1
公开(公告)日：2006-11-23
申请号：US11130846
申请日：2005-05-17
申请人： Marco Aimi , Timothy Beerling , Kevin Killeen
发明人： Marco Aimi , Timothy Beerling , Kevin Killeen
IPC分类号： H01H35/34 , H01H11/00
CPC分类号： H01H11/02 , H01H2029/008 , Y10T29/49105
摘要： Enclosed (or at least substantially enclosed) microswitch cavities can be constructed with suitable channels, and in some instances vents, to allow for the transport of fluidic microswitch components to the cavities. This generally allows for fluid transport to cavities that are largely completed. Various techniques, including formation of pressure gradients and electrowetting, can be used to transport fluid along the channels. Additionally, structures and techniques for providing fluid to multiple microswitches and for providing fluid in desired amounts to microswitches are disclosed.
摘要翻译：封闭的（或至少基本上封闭的）微动开关腔可以用适当的通道构造，并且在一些情况下可以构造为通气口，以允许将流体微动开关部件输送到空腔。这通常允许流体输送到大部分完成的空腔。可以使用各种技术，包括形成压力梯度和电润湿，以沿着通道输送流体。另外，公开了用于向多个微型开关提供流体并用于将流体以所需量提供给微型开关的结构和技术。

4. 发明授权

US07158159B2 Micro-machined nozzles 失效
标题翻译：微加工喷嘴
公开(公告)号：US07158159B2
公开(公告)日：2007-01-02
申请号：US11003067
申请日：2004-12-02
申请人： Timothy Beerling , Marco Aimi
发明人： Timothy Beerling , Marco Aimi
IPC分类号： B41J2/14
CPC分类号： B01L3/0262 , B01L2200/12 , B01L2300/0819 , B01L2400/0487 , B81B1/004 , B81B2201/057 , B81B2201/058 , B81B2203/0353 , H01H11/02 , H01H2029/008 , Y10T428/24273 , Y10T428/2902
摘要： A micro-machined nozzle includes a substrate having a hole formed on a first side that extends partially through a thickness dimension of the substrate and a nozzle orifice formed on a second opposite side that communicates with the hole. The nozzle orifice has at least a portion of its interior wall serrated. A method of fabricating a micro-machined nozzle includes the steps of etching a first side of a silicon substrate to form a hole that extends partially through a thickness dimension of the substrate and etching a second opposite side of the silicon substrate to form a serrated nozzle orifice that communicates with the hole.
摘要翻译：微加工喷嘴包括：基板，其具有形成在第一侧上的部分地延伸穿过基板的厚度尺寸的孔;以及形成在与孔连通的第二相对侧上的喷嘴孔。喷嘴孔具有其内壁的至少一部分锯齿状。一种制造微加工喷嘴的方法包括以下步骤：蚀刻硅衬底的第一面以形成部分延伸穿过衬底的厚度尺寸并蚀刻硅衬底的第二相对侧以形成锯齿形喷嘴的孔孔与孔连通。

5. 发明申请

US20060118511A1 Micro-machined nozzles 失效
标题翻译：微加工喷嘴
公开(公告)号：US20060118511A1
公开(公告)日：2006-06-08
申请号：US11003067
申请日：2004-12-02
申请人： Timothy Beerling , Marco Aimi
发明人： Timothy Beerling , Marco Aimi
IPC分类号： G01D15/00
CPC分类号： B01L3/0262 , B01L2200/12 , B01L2300/0819 , B01L2400/0487 , B81B1/004 , B81B2201/057 , B81B2201/058 , B81B2203/0353 , H01H11/02 , H01H2029/008 , Y10T428/24273 , Y10T428/2902
摘要： A micro-machined nozzle includes a substrate having a hole formed on a first side that extends partially through a thickness dimension of the substrate and a nozzle orifice formed on a second opposite side that communicates with the hole. The nozzle orifice has at least a portion of its interior wall serrated. A method of fabricating a micro-machined nozzle includes the steps of etching a first side of a silicon substrate to form a hole that extends partially through a thickness dimension of the substrate and etching a second opposite side of the silicon substrate to form a serrated nozzle orifice that communicates with the hole.
摘要翻译：微加工喷嘴包括：基板，其具有形成在第一侧上的部分地延伸穿过基板的厚度尺寸的孔;以及形成在与孔连通的第二相对侧上的喷嘴孔。喷嘴孔具有其内壁的至少一部分锯齿状。一种制造微加工喷嘴的方法包括以下步骤：蚀刻硅衬底的第一面以形成部分延伸穿过衬底的厚度尺寸并蚀刻硅衬底的第二相对侧以形成锯齿状喷嘴的孔孔与孔连通。

6. 发明申请

US20110308924A1 MEMS Switching Array Having a Substrate Arranged to Conduct Switching Current 有权
标题翻译：具有布置以导通开关电流的基板的MEMS开关阵列
公开(公告)号：US20110308924A1
公开(公告)日：2011-12-22
申请号：US12817578
申请日：2010-06-17
申请人： Kuna Venkat Satya Rama Kishore , Marco Aimi
发明人： Kuna Venkat Satya Rama Kishore , Marco Aimi
IPC分类号： H01H57/00
CPC分类号： H01H1/0036 , H01H59/0009 , H01H2001/0063 , H01H2001/0084
摘要： A micro-electromechanical systems (MEMS) switch or array is provided. A first substrate (e.g., carrier substrate) includes an electrically conductive substrate region. An electrical isolation layer may be disposed over a first surface of the carrier substrate. Movable actuators may be provided. At least one substrate contact is electrically coupled to at least one of the plurality of movable actuators so that a flow of electrical current is established during an electrically-closed condition of the MEMS switch array. A cover substrate may also be provided and includes an electrically conductive substrate region. The electrically conductive region of the carrier substrate is electrically coupled to the electrically conductive region of the cover substrate to define an electrically conductive path for the flow of electrical current during the electrically-closed condition of the switching array.
摘要翻译：提供微机电系统（MEMS）开关或阵列。第一衬底（例如，载体衬底）包括导电衬底区域。电隔离层可以设置在载体衬底的第一表面上。可以提供可移动致动器。至少一个衬底接触件电耦合到多个可移动致动器中的至少一个，使得在MEMS开关阵列的电闭合状态期间建立电流流动。还可以提供覆盖基板，并且包括导电基板区域。载体衬底的导电区域电耦合到覆盖衬底的导电区域，以在开关阵列的电闭合状态期间限定用于电流流动的导电路径。

7. 发明申请

US20070000762A1 Architecture and method of fabrication for a liquid metal microswitch (LIMMS) 失效
标题翻译：液态金属微动开关（LIMMS）的结构和制造方法
公开(公告)号：US20070000762A1
公开(公告)日：2007-01-04
申请号：US11171610
申请日：2005-06-30
申请人： Timothy Beerling , Steven Rosenau , Benjamin Law , Ronald Fazzio , Marco Aimi
发明人： Timothy Beerling , Steven Rosenau , Benjamin Law , Ronald Fazzio , Marco Aimi
IPC分类号： H01H29/00
CPC分类号： H01H1/0036 , H01H2029/008
摘要： A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.
摘要翻译：开关包括具有限定在其上的薄膜结构的第一晶片，具有限定在其中的多个特征的第二晶片，以及在第一晶片和第二晶片之间的密封，形成两晶片结构，其具有限定在其间的液态金属微动开关。

8. 发明申请

US20070181963A1 MICRO-ELECTROMECHANICAL SYSTEM (MEMS) BASED CURRENT AND MAGNETIC FIELD SENSOR USING TUNNELING CURRENT SENSING 有权
标题翻译：基于微机电系统（MEMS）的电流和使用隧道式电流传感器的磁场传感器
公开(公告)号：US20070181963A1
公开(公告)日：2007-08-09
申请号：US11736678
申请日：2007-04-18
申请人： Ertugrul Berkcan , Christopher Kapusta , Marco Aimi , Shankar Chandrasekaran , Glenn Claydon
发明人： Ertugrul Berkcan , Christopher Kapusta , Marco Aimi , Shankar Chandrasekaran , Glenn Claydon
IPC分类号： H01L29/84
CPC分类号： G01R15/207 , G01R15/148 , G01R33/0283 , G01R33/0286 , G01R35/005
摘要： A micro-electro-mechanical system (MEMS) current sensor for sensing a magnetic field produced by an electrical current flowing in a conductor includes a first fixed element and a moving element. The moving element is spaced away from the first fixed element and is movable relative to the fixed element responsive to a magnetic field produced by an electrical current flowing in a conductor for providing a mechanical indication of a strength of the magnetic field. The sensor also includes a tunneling current generator for generating a tunneling current between the first fixed element and the moving element and a tunneling current monitor for monitoring a change in the tunneling current responsive to the mechanical indication to provide an indication of a value of the electrical current in the conductor.
摘要翻译：用于感测由在导体中流动的电流产生的磁场的微机电系统（MEMS）电流传感器包括第一固定元件和移动元件。移动元件与第一固定元件间隔开，并且可响应于在导体中流动的电流产生的磁场相对于固定元件移动，以提供磁场强度的机械指示。传感器还包括用于在第一固定元件和移动元件之间产生隧道电流的隧道电流发生器，以及隧道电流监视器，用于响应于机械指示监视隧道电流的变化，以提供电气值的指示电流在导体中。

9. 发明申请

US20070039170A1 Three-dimensional metal microfabrication process and devices produced thereby 有权
标题翻译：三维金属微细加工工艺及其制造的装置
公开(公告)号：US20070039170A1
公开(公告)日：2007-02-22
申请号：US11445067
申请日：2006-06-01
申请人： Masaru Rao , Marco Aimi , Noel MacDonald
发明人： Masaru Rao , Marco Aimi , Noel MacDonald
IPC分类号： B44C1/22 , H01B13/00 , C23F1/00 , H01R43/00
CPC分类号： C23F4/00 , B81B2201/042 , B81B2203/033 , B81C1/00126 , B81C2201/0132 , Y10T29/49117
摘要： The present invention relates, in general, to a method for three-dimensional (3D) microfabrication of complex, high aspect ratio structures with arbitrary surface height profiles in metallic materials, and to devices fabricated in accordance with this process. The method builds upon anisotropic deep etching methods for metallic materials previously developed by the inventors by enabling simplified realization of complex, non-prismatic structural geometries composed of multiple height levels and sloping and/or non-planar surface profiles. The utility of this approach is demonstrated in the fabrication of a sloping electrode structure intended for application in bulk micromachined titanium micromirror devices, however such a method could find use in the fabrication of any number of other microactuator, microsensor, microtransducer, or microstructure devices as well.
摘要翻译：本发明一般涉及用于金属材料中具有任意表面高度分布的复合高纵横比结构的三维（3D）微细加工方法，以及根据该方法制造的器件。该方法基于由本发明人先前开发的金属材料的各向异性深蚀刻方法，其通过使得能够简化实现由多个高度级别和倾斜和/或非平面表面轮廓组成的复杂的非棱柱结构几何形状。在制造用于体积微加工的钛微镜器件中的倾斜电极结构的过程中证明了这种方法的实用性，然而这种方法可用于制造任何数量的其它微型致动器，微传感器，微传感器或微结构器件，如好。

10. 发明授权

US08576029B2 MEMS switching array having a substrate arranged to conduct switching current 有权
标题翻译： MEMS开关阵列具有布置成传导开关电流的基板
公开(公告)号：US08576029B2
公开(公告)日：2013-11-05
申请号：US12817578
申请日：2010-06-17
申请人： Kuna Venkat Satya Rama Kishore , Marco Aimi
发明人： Kuna Venkat Satya Rama Kishore , Marco Aimi
IPC分类号： H01H51/22 , H01H57/00
CPC分类号： H01H1/0036 , H01H59/0009 , H01H2001/0063 , H01H2001/0084
摘要： A micro-electromechanical systems (MEMS) switch or array is provided. A first substrate (e.g., carrier substrate) includes an electrically conductive substrate region. An electrical isolation layer may be disposed over a first surface of the carrier substrate. Movable actuators may be provided. At least one substrate contact is electrically coupled to at least one of the plurality of movable actuators so that a flow of electrical current is established during an electrically-closed condition of the MEMS switch array. A cover substrate may also be provided and includes an electrically conductive substrate region. The electrically conductive region of the carrier substrate is electrically coupled to the electrically conductive region of the cover substrate to define an electrically conductive path for the flow of electrical current during the electrically-closed condition of the switching array.
摘要翻译：提供微机电系统（MEMS）开关或阵列。第一衬底（例如，载体衬底）包括导电衬底区域。电隔离层可以设置在载体衬底的第一表面上。可以提供可移动致动器。至少一个衬底接触件电耦合到多个可移动致动器中的至少一个，使得在MEMS开关阵列的电闭合状态期间建立电流流动。还可以提供覆盖基板，并且包括导电基板区域。载体衬底的导电区域电耦合到覆盖衬底的导电区域，以在开关阵列的电闭合状态期间限定用于电流流动的导电路径。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式