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1. 发明申请

US20110298156A1 METHODS AND SYSTEMS FOR LASER PROCESSING A WORKPIECE USING A PLURALITY OF TAILORED LASER PULSE SHAPES 失效
标题翻译：激光加工工艺的方法和系统使用多种激光激光脉冲形状
公开(公告)号：US20110298156A1
公开(公告)日：2011-12-08
申请号：US13076810
申请日：2011-03-31
申请人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
发明人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
IPC分类号： B29C35/08
CPC分类号： H01S3/102 , B23K26/0622 , B23K26/064 , B23K26/389 , B23K26/40 , B23K26/705 , B23K2103/172 , B23K2103/50 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01055 , H01L2924/01056 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/12043 , H01L2924/13091 , H01L2924/14 , H01S3/0057 , H01S3/1305 , H01L2924/00 , H01L2924/3512
摘要： Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.
摘要翻译：定制的激光脉冲形状用于加工工件。例如，半导体器件晶片在芯片附着膜（DAF）上的激光切割可以使用不同的定制的激光脉冲形状，用于将器件层划分到半导体衬底，切割半导体衬底，切割下面的DAF和/或后处理的上模边缘以增加冲模强度。不同的单形激光脉冲序列可以用于激光束在划线上的相应配方步骤或通过。在另一个实施例中，划线半导体器件晶片仅使用包括彼此不同的至少两个激光脉冲的混合形激光脉冲串沿着划线的激光束的单次通过。另外，或者在其他实施例中，可以选择一个或多个定制的脉冲形状并将其提供给工件。选择可以基于传感器反馈。

2. 发明授权

US08598490B2 Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes 失效
标题翻译：使用多个定制的激光脉冲形状激光加工工件的方法和系统
公开(公告)号：US08598490B2
公开(公告)日：2013-12-03
申请号：US13076810
申请日：2011-03-31
申请人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
发明人： Andrew Hooper , David Barsic , Kelly J. Bruland , Daragh S. Finn , Lynn Sheehan , Xiaoyuan Peng , Yasu Osako , Jim Dumestre , William J. Jordens
IPC分类号： H01L21/78
CPC分类号： H01S3/102 , B23K26/0622 , B23K26/064 , B23K26/389 , B23K26/40 , B23K26/705 , B23K2103/172 , B23K2103/50 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01055 , H01L2924/01056 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/12043 , H01L2924/13091 , H01L2924/14 , H01S3/0057 , H01S3/1305 , H01L2924/00 , H01L2924/3512
摘要： Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.
摘要翻译：定制的激光脉冲形状用于加工工件。例如，半导体器件晶片在芯片附着膜（DAF）上的激光切割可以使用不同的定制的激光脉冲形状，用于将器件层划分到半导体衬底，切割半导体衬底，切割下面的DAF和/或后处理的上模边缘以增加冲模强度。不同的单形激光脉冲序列可以用于激光束在划线上的相应配方步骤或通过。在另一个实施例中，使用包括彼此不同的至少两个激光脉冲的混合形状的激光脉冲串，划线半导体器件晶片仅包括激光束沿着划线的单次通过。另外，或者在其他实施例中，可以选择一个或多个定制的脉冲形状并将其提供给工件。选择可以基于传感器反馈。

3. 发明申请

US20120160814A1 METHODS AND SYSTEMS FOR LINK PROCESSING USING LASER PULSES WITH OPTIMIZED TEMPORAL POWER PROFILES AND POLARIZATIONS 审中-公开
标题翻译：使用激光脉冲进行链接处理的方法和系统与优化的时间功率分布和极化
公开(公告)号：US20120160814A1
公开(公告)日：2012-06-28
申请号：US12980131
申请日：2010-12-28
申请人： Yasu Osako , Kelly J. Bruland , Andrew Hooper , Jim Dumestre , David Lord
发明人： Yasu Osako , Kelly J. Bruland , Andrew Hooper , Jim Dumestre , David Lord
IPC分类号： B23K26/00
CPC分类号： B23K26/364 , B23K26/0624 , B23K26/40 , B23K2101/40 , B23K2103/172 , B23K2103/50
摘要： Systems and methods ablate electrically conductive links using laser pulses with optimized temporal power profiles and/or polarizations. In certain embodiments, the polarization property of a laser beam is set such that coupling between the laser beam and an electrically conductive link reduces the pulse energy required to ablate the electrically conductive link. In one such embodiment, the polarization is selected based on a depth of a target link structure. In another embodiment, the polarization changes as deeper material is removed from a target location. In addition, or in other embodiments, a first portion of a temporal power profile of a laser beam includes a rapid rise time to heat an upper portion of an electrically conductive link so as to form cracks in a passivation layer over upper corners of the electrically conductive link, without forming cracks at lower corners of the electrically conductive link.
摘要翻译：系统和方法使用具有优化的时间功率分布和/或偏振的激光脉冲消融导电链路。在某些实施例中，激光束的偏振特性被设定为使得激光束和导电链节之间的耦合降低了烧蚀导电连接所需的脉冲能量。在一个这样的实施例中，基于目标链路结构的深度来选择极化。在另一个实施例中，当从目标位置移除较深的材料时，偏振改变。另外或在其他实施例中，激光束的时间功率分布的第一部分包括加热导电连接件的上部的快速上升时间，以便在电气的上角上的钝化层中形成裂纹导电连接件，而不会在导电连接件的下角形成裂纹。

4. 发明申请

US20110287607A1 METHOD AND APPARATUS FOR IMPROVED WAFER SINGULATION 审中-公开
标题翻译：改进方法和装置调整方法
公开(公告)号：US20110287607A1
公开(公告)日：2011-11-24
申请号：US13076238
申请日：2011-03-30
申请人： Yasu Osako , Bong Cho , Daragh Finn , Andrew Hooper , James O'Brien
发明人： Yasu Osako , Bong Cho , Daragh Finn , Andrew Hooper , James O'Brien
IPC分类号： H01L21/78 , B23K26/00
CPC分类号： B23K26/364 , B23K26/0608 , B23K26/40 , B23K2103/172 , B23K2103/50 , H01L21/67092
摘要： Laser singulation of electronic devices from semiconductor substrates including wafers is performed using up to 3 lasers from 2 wavelength ranges. Using up to 3 lasers from 2 wavelength ranges permits laser singulation of wafers held by die attach film while avoiding problems caused by single-wavelength dicing. In particular, using up to 3 lasers from 2 wavelength ranges permits efficient dicing of semiconductor wafers while avoiding debris and thermal problems associated with laser processing die attach tape.
摘要翻译：使用来自2个波长范围的3个激光器来执行包括晶片的半导体基板的电子器件的激光切割。使用2个波长范围的多达3个激光器可以激光切割由芯片附着膜保持的晶片，同时避免单波长切割引起的问题。特别地，使用2个波长范围的多达3个激光器可以有效切割半导体晶片，同时避免与激光加工芯片附着带相关的碎片和热问题。

5. 发明授权

US08609512B2 Method for laser singulation of chip scale packages on glass substrates 失效
标题翻译：在玻璃基板上激光切割芯片级封装的方法
公开(公告)号：US08609512B2
公开(公告)日：2013-12-17
申请号：US12413068
申请日：2009-03-27
申请人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
发明人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
IPC分类号： H01L21/00
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/50
摘要： An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
摘要翻译：提出了一种改进的复合电子设备分离方法。复合电子装置通过将两个或多个基板组合成包含多个装置的组件来制造。提出了使用激光加工对复合电子器件进行单片化的方法。所提出的方法提供了更少的缺陷，例如基板的破裂或碎裂，同时最小化切口的宽度并维持系统的生产量。

6. 发明申请

US20110240616A1 METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS 有权
标题翻译：用于激光激光材料的方法和装置
公开(公告)号：US20110240616A1
公开(公告)日：2011-10-06
申请号：US12753367
申请日：2010-04-02
申请人： Yasu Osako , Daragh Finn
发明人： Yasu Osako , Daragh Finn
IPC分类号： B23K26/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/0626 , B23K26/38 , B23K26/40 , B23K2103/50 , B23K2103/56
摘要： An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.
摘要翻译：用于将电子衬底分离成骰子的改进方法使用激光器首先在衬底中形成切口，然后通过改变激光器参数来倒角切口的边缘。倒角通过减少残余损伤并消除由初始激光切割引起的碎片而增加冲模强度，而不需要额外的工艺步骤，附加设备或消耗品。

7. 发明授权

US09029731B2 Methods and systems for laser processing continuously moving sheet material 有权
标题翻译：激光加工连续移动片材的方法和系统
公开(公告)号：US09029731B2
公开(公告)日：2015-05-12
申请号：US11949582
申请日：2007-12-03
申请人： Yasu Osako , Mark Unrath , Mark Kosmowski
发明人： Yasu Osako , Mark Unrath , Mark Kosmowski
IPC分类号： B23K26/08
CPC分类号： B23K26/0846 , B23K26/38
摘要： Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.
摘要翻译：用于激光处理连续移动的片材的系统和方法包括一个或多个激光处理头，其被配置为用一个或多个激光束照射移动片材。片材可以包括例如在激光处理期间从第一辊连续地移动到第二辊的光学膜。在一个实施例中，真空卡盘构造成将可动片材的第一部分可拆卸地固定到其上。当第一部分被一个或多个激光束处理时，真空吸盘控制移动片材的速度。在一个实施例中，输送机包括多个真空卡盘，其构造成在激光加工期间连续地贴附到片材的不同部分。

8. 发明授权

US08383984B2 Method and apparatus for laser singulation of brittle materials 有权
标题翻译：用于激光切割脆性材料的方法和装置
公开(公告)号：US08383984B2
公开(公告)日：2013-02-26
申请号：US12753367
申请日：2010-04-02
申请人： Yasu Osako , Daragh Finn
发明人： Yasu Osako , Daragh Finn
IPC分类号： B23K26/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/0626 , B23K26/38 , B23K26/40 , B23K2103/50 , B23K2103/56
摘要： An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.
摘要翻译：用于将电子衬底分离成骰子的改进方法使用激光器首先在衬底中形成切口，然后通过改变激光器参数来倒角切口的边缘。倒角通过减少残余损伤并消除由初始激光切割引起的碎片而增加冲模强度，而不需要额外的工艺步骤，附加设备或消耗品。

9. 发明申请

US20110085574A1 METHODS AND SYSTEMS FOR GENERATING PULSE TRAINS FOR MATERIAL PROCESSING 有权
标题翻译：用于生成材料加工的脉冲火车的方法和系统
公开(公告)号：US20110085574A1
公开(公告)日：2011-04-14
申请号：US12907768
申请日：2010-10-19
申请人： Yasu Osako , Hisashi Matsumoto
发明人： Yasu Osako , Hisashi Matsumoto
IPC分类号： H01S3/10
CPC分类号： B23K26/382 , B23K26/0622 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/42 , B23K2103/50 , H01S3/2383
摘要： Systems and methods generate laser pulse trains for material processing. In one embodiment, stable laser pulse trains at high repetition rates are generated from a continuous wave (CW) or quasi-CW laser beams. One or more laser pulses in the laser pulse train may be shaped to control energy delivered to a target material. In another embodiment, multiple laser beams are distributed to multiple processing heads from a single laser pulse, CW laser beam, or quasi-CW laser beam. In one such embodiment, a single optical deflector distributes multiple laser beams among respective processing heads.
摘要翻译：系统和方法产生用于材料加工的激光脉冲串。在一个实施例中，从连续波（CW）或准CW激光束产生高重复率的稳定激光脉冲串。激光脉冲串中的一个或多个激光脉冲可以被成形为控制输送到目标材料的能量。在另一个实施例中，多个激光束从单个激光脉冲，CW激光束或准CW激光束分配到多个处理头。在一个这样的实施例中，单个光学偏转器在相应的处理头之间分配多个激光束。

10. 发明申请

US20100248451A1 Method for Laser Singulation of Chip Scale Packages on Glass Substrates 失效
标题翻译：玻璃基板上芯片尺寸封装的激光切割方法
公开(公告)号：US20100248451A1
公开(公告)日：2010-09-30
申请号：US12413068
申请日：2009-03-27
申请人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
发明人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
IPC分类号： H01L21/78
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/50
摘要： An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
摘要翻译：提出了一种改进的复合电子设备分离方法。复合电子装置通过将两个或多个基板组合成包含多个装置的组件来制造。提出了使用激光加工对复合电子器件进行单片化的方法。所提出的方法提供了更少的缺陷，例如基板的破裂或碎裂，同时最小化切口的宽度并维持系统的生产量。

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