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    • 8. 发明授权
    • Method for manufacturing a substantially circular substrate by utilizing scribing
    • 通过划线制造大致圆形基板的方法
    • US06795274B1
    • 2004-09-21
    • US09407003
    • 1999-09-28
    • John HsiehAndrew HomolaDavid Vigdor SalamonHolland Hodges
    • John HsiehAndrew HomolaDavid Vigdor SalamonHolland Hodges
    • G11B582
    • G11B5/8404C03B23/02C03B33/04C03C15/00C03C23/0025Y02P40/57
    • A method for manufacturing a substrate for a magnetic disk comprises the acts of mounting a workpiece on a spindle; rotating the workpiece and scribing the workpiece to form first and second scribe lines on the top surface of the workpiece and first and second scribe lines on the bottom surface of the workpiece; and breaking the workpiece along the first and second scribe lines. The first scribe line on the top and bottom surface of the work piece defines the outer diameter of the substrate. The second scribe line on the top and bottom surface of the workpiece define the inner diameter of the substrate. Because scribe lines are formed on the top and bottom surfaces of the workpiece, the edge of the substrate is less jagged than substrates that are merely scribed on one side of the workpiece and then broken. Because the scribe lines are formed by mounting the workpiece on a spindle and rotating the substrate, the scribing can be done more precisely and quickly than scribe lines formed using an x-y platform.
    • 一种用于制造用于磁盘的基板的方法包括将工件安装在主轴上的动作; 旋转工件并对工件进行划线以在工件的顶表面上形成第一和第二划线,并在工件的底表面上形成第一和第二划痕线; 并沿着第一和第二划线断开工件。 工件的顶部和底部表面上的第一划线限定了基底的外径。 在工件的顶部和底部表面上的第二划线限定了衬底的内径。 由于划痕线形成在工件的顶表面和底表面上,因此衬底的边缘比仅仅刻划在工件的一侧上然后断裂的衬底较少锯齿。 由于划线是通过将工件安装在主轴上并旋转基板而形成的,所以与使用x-y平台形成的划痕线相比,划线可以更准确和快速地进行。