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1. 发明授权

US07326593B2 Method of producing a package for semiconductor chips 失效
标题翻译：制造半导体芯片封装的方法
公开(公告)号：US07326593B2
公开(公告)日：2008-02-05
申请号：US10483212
申请日：2002-07-04
申请人： Andreas Bischof , Knut Kahlisch , Henning Mieth
发明人： Andreas Bischof , Knut Kahlisch , Henning Mieth
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L23/16 , H01L23/3114 , H01L24/29 , H01L2224/16 , H01L2224/2919 , H01L2224/45144 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/18161 , H01L2924/00
摘要： The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.
摘要翻译：本发明的方法基于在制造包装期间释放半导体芯片和支撑衬底之间的机械连接的想法。用于在半导体芯片和支撑衬底之间产生电接触所需的机械连接仅仅是临时的。结果，去除填料中的关键界面，从而明显降低热机械应力。

2. 发明授权

US06979887B2 Support matrix with bonding channel for integrated semiconductors, and method for producing it 失效
标题翻译：用于集成半导体的结合通道的支撑矩阵及其制造方法
公开(公告)号：US06979887B2
公开(公告)日：2005-12-27
申请号：US09901550
申请日：2001-07-09
申请人： Knut Kahlisch , Henning Mieth
发明人： Knut Kahlisch , Henning Mieth
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60 , H01L23/13 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/495
CPC分类号： H01L23/13 , H01L21/563 , H01L23/4985 , H01L2224/45144 , H01L2224/73203 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15173 , H01L2924/00
摘要： Support matrices for semiconductors are often encapsulated in a region of the bonding leads, the so-called bonding channel. The encapsulation is effected using a dispensable material that can flow onto the support matrix and causes contamination there. In order to prevent this flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding channel. In the bonding channel bonding leads or wires for connecting the conductor track structures to the integrated semiconductor are disposed. Disposed along the edge of the bonding channel a barrier for preventing the flow of flowable material from the bonding channel onto the frame and/or the conductor track structures. A method for producing such support matrices is likewise disclosed.
摘要翻译：用于半导体的支撑矩阵通常封装在所谓的结合通道的接合引线的区域中。使用可分散的材料进行封装，该材料可以流到支撑基体上并在那里引起污染。为了防止这种流动，用于集成半导体的支撑矩阵具有框架，导体轨道结构和至少一个结合通道。在接合通道中，设置用于将导体轨道结构连接到集成半导体的引线或导线。沿着接合通道的边缘设置用于防止可流动材料从粘合通道流到框架和/或导体轨道结构上的屏障。同样公开了制备这种支撑基质的方法。

3. 发明授权

US06605864B2 Support matrix for integrated semiconductors, and method for producing it 有权
公开(公告)号：US06605864B2
公开(公告)日：2003-08-12
申请号：US09901524
申请日：2001-07-09
申请人： Knut Kahlisch , Henning Mieth
发明人： Knut Kahlisch , Henning Mieth
IPC分类号： H01L23495
CPC分类号： H01L23/4951 , H01L23/3107 , H01L2924/0002 , H01L2924/00
摘要： Support matrices for semiconductors are often disposed with spacers on the semiconductor chip. The spacers are composed of silicone that flows into the region of the bonding leads and prevents reliable electrical connection of the bonding leads to the semiconductor chip. In order to prevent the flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding lead for connecting the conductor track structures to the integrated semiconductor. The bonding lead has, between a bonding region and the conductor track structures, at least one barrier for preventing the flow of flowable material onto the bonding region. A method for producing such support matrices is likewise described.

4. 发明申请

US20080272503A1 Semiconductor Device and Method for Making Same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080272503A1
公开(公告)日：2008-11-06
申请号：US11744725
申请日：2007-05-04
申请人： Henning Mieth
发明人： Henning Mieth
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L21/565 , H01L21/561 , H01L2924/0002 , H01L2924/00
摘要： A transfer mold process for encapsulation of a matrix array package of dice on a substrate is proposed wherein the flow of the mold compound between dice is at least partly obstructed. In other words, the flow velocity of the mold compound between dice is constrained with the goal of approximating it to the flow velocity above the dice. It is to be understood that every limitation of the flow velocity between the dice, even if it does not result in equal or uniform velocity throughout the cross-sectional area, will bring about a positive effect in terms of reducing the clustering of filler particles in certain areas of the mold compound. The semiconductor device thus produced is part of the present disclosure.
摘要翻译：提出了一种用于在基板上封装矩阵阵列包装的转移模具方法，其中模具化合物在骰子之间的流动至少部分被阻碍。换句话说，模具化合物在骰子之间的流动速度受到限制，目的是将其与骰子上方的流速近似。应当理解，即使在整个横截面积上不产生相等或均匀的速度，骰子之间的流速的每个限制将在减少填料颗粒聚集方面产生积极的作用某些区域的模具化合物。由此制造的半导体器件是本公开的一部分。

5. 发明授权

US07867817B2 Method for manufacturing a wafer level package 有权
标题翻译：晶圆级封装的制造方法
公开(公告)号：US07867817B2
公开(公告)日：2011-01-11
申请号：US12023853
申请日：2008-01-31
申请人： Stephan Dobritz , Harry Hedler , Henning Mieth
发明人： Stephan Dobritz , Harry Hedler , Henning Mieth
IPC分类号： H01L21/00
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/6835 , H01L24/02 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/97 , H01L2224/0231 , H01L2224/02333 , H01L2224/0401 , H01L2224/04042 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/00
摘要： A method for manufacturing a wafer level package of an integrated circuit element for direct attachment to a wiring board is disclosed. An integrated circuit element includes input/output pads located on an active side. A non-conductive support structure is formed on the active side of the integrated circuit element in an area that is free from input/output pads. A conductive path is formed upon the support structure and a non-conductive coating is formed on over the active side of the integrated circuit element such that a surface is formed which leaves interface pads accessible.
摘要翻译：公开了一种用于制造用于直接连接到布线板的集成电路元件的晶片级封装的方法。集成电路元件包括位于有源侧的输入/输出焊盘。在不具有输入/输出焊盘的区域中，在集成电路元件的有源侧上形成非导电支撑结构。在支撑结构上形成导电路径，并且在集成电路元件的有源侧上形成非导电涂层，使得形成离开界面焊盘的表面。

6. 发明申请

US20090194881A1 Method for Manufacturing a Wafer Level Package 有权
标题翻译：制造晶圆级封装的方法
公开(公告)号：US20090194881A1
公开(公告)日：2009-08-06
申请号：US12023853
申请日：2008-01-31
申请人： Stephan Dobritz , Harry Hedler , Henning Mieth
发明人： Stephan Dobritz , Harry Hedler , Henning Mieth
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/6835 , H01L24/02 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/97 , H01L2224/0231 , H01L2224/02333 , H01L2224/0401 , H01L2224/04042 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/00
摘要： A method for manufacturing a wafer level package of an integrated circuit element for direct attachment to a wiring board is disclosed. An integrated circuit element includes input/output pads located on an active side. A non-conductive support structure is formed on the active side of the integrated circuit element in an area that is free from input/output pads. A conductive path is formed upon the support structure and a non-conductive coating is formed on over the active side of the integrated circuit element such that a surface is formed which leaves interface pads accessible.
摘要翻译：公开了一种用于制造用于直接连接到布线板的集成电路元件的晶片级封装的方法。集成电路元件包括位于有源侧的输入/输出焊盘。在不具有输入/输出焊盘的区域中，在集成电路元件的有源侧上形成非导电支撑结构。在支撑结构上形成导电路径，并且在集成电路元件的有源侧上形成非导电涂层，使得形成离开界面焊盘的表面。

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