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    • 2. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20100078795A1
    • 2010-04-01
    • US11993516
    • 2006-06-28
    • Ronald DekkerFreddy RoozeboomPeter NottenAntonius Lucien Adrianus Maria Kemmeren
    • Ronald DekkerFreddy RoozeboomPeter NottenAntonius Lucien Adrianus Maria Kemmeren
    • H01L23/538H01L23/482
    • H03H9/0547H01L25/16H01L27/14618H01L31/0203H01L2924/0002H03H9/105H01L2924/00
    • The electronic device comprises a semiconductor substrate (10) with at a first side (1) a circuit of semiconductor elements (20). The substrate (10) is present between a carrier (40) and an encapsulation (70), so that the first side (1) of the substrate (10) faces the carrier (40). The circuit of semiconductor elements (20) is coupled with conductor tracks (25) to a metallization (82) in a groove (80) in the encapsulation (70), which metallization (82) extends to terminals (90) at an outside of the encapsulation (70). At least one further electrical element (120) is defined between the first side (1) of the semiconductor substrate (10) and the encapsulation (70). This further element (120) is provided with at least one conductor track (65) extending to the metallization (82) in the groove (80) so as to incorporate the further element (120) in the circuit of semiconductor elements (20) on the first side (1) of the substrate (10).
    • 电子器件包括半导体衬底(10),在半导体元件(20)的第一侧(1)具有电路。 衬底(10)存在于载体(40)和封装(70)之间,使得衬底(10)的第一侧(1)面向载体(40)。 半导体元件(20)的电路与导体轨道(25)耦合到封装(70)中的凹槽(80)中的金属化(82),该金属化(82)延伸到端子(90)的外部 封装(70)。 在半导体衬底(10)的第一侧(1)和封装(70)之间限定至少一个另外的电元件(120)。 这个另外的元件(120)设置有至少一个延伸到凹槽(80)中的金属化(82)的导体轨道(65),以便在半导体元件(20)的电路中并入另外的元件(120) 衬底(10)的第一侧(1)。