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1. 发明申请

US20050220931A1 Nozzle assembly for applying a liquid to a substrate 有权
标题翻译：用于将液体施加到基底的喷嘴组件
公开(公告)号：US20050220931A1
公开(公告)日：2005-10-06
申请号：US10522563
申请日：2003-07-10
申请人： Anatol Schwersenz , Werner Saule , Andreas Noring , Peter Dress , Christian Burgel , Martin Tschinkl , Marlene Strobl
发明人： Anatol Schwersenz , Werner Saule , Andreas Noring , Peter Dress , Christian Burgel , Martin Tschinkl , Marlene Strobl
IPC分类号： G03F7/30 , B05B1/14 , B05C5/00 , H01L21/027
CPC分类号： B05C5/005
摘要： The aim of the invention is to achieve a rapid, homogeneous application of a liquid with as little force as possible to a substrate. To achieve this, the invention provides a nozzle assembly (22) for applying a liquid to a substrate, said assembly having a nozzle body (26) comprising a plurality of nozzles (36) that are substantially arranged in a line and a guide plate (28) that extends essentially in a vertical direction with a straight lower edge. According to the invention, the nozzles (36) above the lower edge are directed towards the guide plate (28) in such a way that a film of liquid forms on the guide plate (28) and flows over the lower edge (64).
摘要翻译：本发明的目的是以尽可能少的力将液体快速，均匀地应用于基底。为了实现这一点，本发明提供了一种用于将液体施加到基底的喷嘴组件（22），所述组件具有喷嘴主体（26），喷嘴主体（26）包括基本上布置在管线中的多个喷嘴（36）和引导板 28），其基本上在垂直方向上以直的下边缘延伸。根据本发明，下边缘上方的喷嘴（36）以导向板（28）上形成的液体薄膜流过下边缘（64）的方式指向引导板（28）。

2. 发明授权

US07419549B2 Nozzle assembly for applying a liquid to a substrate 有权
标题翻译：用于将液体施加到基底的喷嘴组件
公开(公告)号：US07419549B2
公开(公告)日：2008-09-02
申请号：US10522563
申请日：2003-07-10
申请人： Anatol Schwersenz , Werner Saule , Andreas Nöring , Peter Dress , Christian Bürgel , Martin Tschinkl , Marlene Strobl
发明人： Anatol Schwersenz , Werner Saule , Andreas Nöring , Peter Dress , Christian Bürgel , Martin Tschinkl , Marlene Strobl
IPC分类号： B05C3/02
CPC分类号： B05C5/005
摘要： The aim of the invention is to achieve a rapid, homogeneous application of a liquid with as little force as possible to a substrate. To achieve this, the invention provides a nozzle assembly (22) for applying a liquid to a substrate, said assembly having a nozzle body (26) comprising a plurality of nozzles (36) that are substantially arranged in a line and a guide plate (28) that extends essentially in a vertical direction with a straight lower edge. According to the invention, the nozzles (36) above the lower edge are directed towards the guide plate (28) in such a way that a film of liquid forms on the guide plate (28) and flows over the lower edge (64).
摘要翻译：本发明的目的是以尽可能少的力将液体快速，均匀地应用于基底。为了实现这一点，本发明提供了一种用于将液体施加到基底的喷嘴组件（22），所述组件具有喷嘴主体（26），喷嘴主体（26）包括基本上布置在管线中的多个喷嘴（36）和引导板 28），其基本上在垂直方向上以直的下边缘延伸。根据本发明，下边缘上方的喷嘴（36）以导向板（28）上形成的液体薄膜流过下边缘（64）的方式指向引导板（28）。

3. 发明授权

US06919538B2 Method for thermally treating substrates 有权
标题翻译：基板热处理方法
公开(公告)号：US06919538B2
公开(公告)日：2005-07-19
申请号：US10433253
申请日：2001-11-28
申请人： Jakob Szekeresch , Peter Dress , Uwe Dietze , Werner Saule
发明人： Jakob Szekeresch , Peter Dress , Uwe Dietze , Werner Saule
IPC分类号： H05B3/00 , H01L21/00 , H01L21/02 , H01L21/027 , F27B5/14
CPC分类号： H01L21/67248
摘要： To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.
摘要翻译：为了提高待热处理的基板的表面上的温度均匀性，提供了一种热处理基板的方法，根据该方法，基板被几个可单独控制的加热元件加热。为每个所述加热元件预定义期望值曲线。该方法包括以下步骤：在热处理期间局部分析测量衬底表面远离加热元件的温度; 确定在基板表面上发生的温度不均匀性; 基于所述温度不均匀性定义新的期望值曲线; 并为后续处理准备新的期望值曲线。

4. 发明授权

US07842905B2 Method and device for the thermal treatment of substrates 有权
标题翻译：用于基材热处理的方法和装置
公开(公告)号：US07842905B2
公开(公告)日：2010-11-30
申请号：US11573012
申请日：2005-11-12
申请人： Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
发明人： Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
IPC分类号： H05B3/68 , A21B2/00 , C23C16/00
CPC分类号： H01L21/67248 , H01L21/67103
摘要： This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.
摘要翻译：本发明涉及一种用于热处理基板的方法和装置，其中基板被保持与加热板接触或距离加热板稍微距离，该加热板由多个可单独控制的加热元件在所述加热板至少在其平面中被与所述基板间隔开的框架包围，并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中加热板。

5. 发明申请

US20080217319A1 Method and Device for the Thermal Treatment of Substrates 有权
标题翻译：基板热处理方法和装置
公开(公告)号：US20080217319A1
公开(公告)日：2008-09-11
申请号：US11573012
申请日：2005-11-12
申请人： Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
发明人： Werner Saule , Lothar Berger , Christian Krauss , Robert Weihing
IPC分类号： H05B3/20 , G05B13/02 , H01L21/02
CPC分类号： H01L21/67248 , H01L21/67103
摘要： This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.
摘要翻译：本发明涉及一种用于热处理基板的方法和装置，其中基板被保持与加热板接触或距离加热板稍微距离，该加热板由多个可单独控制的加热元件在所述加热板至少在其平面中被与所述基板间隔开的框架包围，并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中加热板。

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