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    • 2. 发明申请
    • Device and method for cleaning the edges of substrates
    • 用于清洁基板边缘的装置和方法
    • US20070000516A1
    • 2007-01-04
    • US10575746
    • 2004-10-07
    • Christian KraussKarl AppichJakob SzekereschPeter Dress
    • Christian KraussKarl AppichJakob SzekereschPeter Dress
    • B08B3/02
    • H01L21/67051
    • A device and method for cleaning the edges of substrates, including at least one cleaning head for receiving at least one nozzle element for supplying medium to a substrate. Formed in a main body of the cleaning head are a medium-suctioning port and an adjoining medium-suctioning duct. The cleaning head also has at least one first flange extending from the main body and having a flat side facing the port and extending essentially perpendicular to a surface of the main body containing the port. The nozzle element is provided on the flange and spaced from the main body, and has at least one outlet port opening in the direction that the flat side faces and directed substantially perpendicular thereto. The outlet port is recessed relative to the flat side or is flush therewith. During a cleaning process, the fat side is spaced by 0.05 to 0.5 mm from the substrate surface.
    • 一种用于清洁基底边缘的装置和方法,包括至少一个清洁头,用于接收至少一个用于将介质供给到基底的喷嘴元件。 在清洗头的主体中形成有中等吸入口和相邻的介质吸入管。 清洁头还具有至少一个从主体延伸的第一凸缘,并且具有面向端口的平坦侧面,并且基本垂直于容纳口的主体表面延伸。 喷嘴元件设置在凸缘上并且与主体间隔开,并且具有至少一个出口端口,其在平坦侧面朝向并基本上与其垂直的方向上开口。 出口相对于平坦侧凹入或与其平齐。 在清洁过程中,脂肪侧与衬底表面间隔0.05至0.5mm。
    • 3. 发明授权
    • Method for thermally treating substrates
    • 基板热处理方法
    • US06919538B2
    • 2005-07-19
    • US10433253
    • 2001-11-28
    • Jakob SzekereschPeter DressUwe DietzeWerner Saule
    • Jakob SzekereschPeter DressUwe DietzeWerner Saule
    • H05B3/00H01L21/00H01L21/02H01L21/027F27B5/14
    • H01L21/67248
    • To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.
    • 为了提高待热处理的基板的表面上的温度均匀性,提供了一种热处理基板的方法,根据该方法,基板被几个可单独控制的加热元件加热。 为每个所述加热元件预定义期望值曲线。 该方法包括以下步骤:在热处理期间局部分析测量衬底表面远离加热元件的温度; 确定在基板表面上发生的温度不均匀性; 基于所述温度不均匀性定义新的期望值曲线; 并为后续处理准备新的期望值曲线。