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    • 4. 发明申请
    • IMAGE TRANSFER PROCESS FOR THIN FILM COMPONENT DEFINITION
    • 薄膜组件定义的图像传输过程
    • US20080026325A1
    • 2008-01-31
    • US11870364
    • 2007-10-10
    • Dwight CornwellDouglas Werner
    • Dwight CornwellDouglas Werner
    • G03C5/00
    • G11B5/3163
    • A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of material to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the material layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the material layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.
    • 根据一个实施例的制造薄膜部件的方法包括:形成具有薄膜层,剥离层和光刻胶图案层的晶片; 将光致抗蚀剂层的图案转印到剥离层和薄膜层上; 向晶片添加一层材料; 将晶片加热到预定温度一段足以使光致抗蚀剂变形到使光致抗蚀剂在材料层中产生裂纹的程度; 施加溶剂以溶解至少一部分释放层,溶剂穿透材料层中的裂纹以到达剥离层; 以及去除脱模层和剥离层上方的层的任何部分。