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1. 发明授权

US4830264A Method of forming solder terminals for a pinless ceramic module 失效
标题翻译：形成无引脚陶瓷模块焊接端子的方法
公开(公告)号：US4830264A
公开(公告)日：1989-05-16
申请号：US106094
申请日：1987-10-07
申请人： Alexis Bitaillou , Michel Grandguillot
发明人： Alexis Bitaillou , Michel Grandguillot
IPC分类号： H01L21/48 , H01L21/60 , H05K1/03 , H05K3/34 , H05K3/40
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/486 , H01L2224/11334 , H01L2924/15311 , H05K1/0306 , H05K2201/09572 , H05K2201/10666 , H05K2201/10734 , H05K2203/041 , H05K2203/043 , H05K2203/0485 , H05K3/3489
摘要： Disclosed is a method of forming solder terminals for a pinless module, preferably for a pinless metallized ceramic module. The method is comprised of the following steps: forming a substrate having a pattern of conductors formed onto its top surface and preformed via-holes extending from the top to bottom surface; applying a droplet of flux at at least one of said preformed via-hole openings of the bottom surface of said substrate to fill said via-holes with flux by capillarity and form a glob of flux at the bottom openings; applying a solder preform, i.e. solder balls on each glob of flux to which it will adhere, the volume of the preform being substantially equal to the inner volume of the via hole plus the volume of the bump to be formed; heating to cause solder reflow of the solder preform to fill the via-hole and the inner volume of the eyelet with solder; and, cooling below the melting point of the solder so that the molten solder solidifies to form solder terminals at the via-hole locations while forming solder columns in the via-holes. The resultant pinless metallized ceramic module has connections between the I/O's of the module interfacing with the next level of packaging, (i.e., printed circuit boards), that consist of integral solder terminals. Each integral solder terminal comprises a column in the vias of the metallized ceramic substrate, a mound of solder at the top surface of the substrate and spherical solder bumps on the bottom level for making interconnections with the next level of packaging.
摘要翻译：公开了一种形成无针模块的焊接端子的方法，优选地用于无针金属化陶瓷模块。该方法包括以下步骤：形成具有形成在其顶表面上的导体图案的基底和预先形成的从顶部到底面延伸的通孔; 在所述衬底的底表面的至少一个所述预制通孔开口处施加液滴以通过毛细管作用填充所述通孔，并在底部开口处形成焊剂球; 将焊料预制件（即，将要粘附到其上的焊剂球上的焊球）施加到预成型件的体积上，其大体上等于通孔的内部容积加上待形成的凸块的体积; 加热以使焊料预制件的焊料回流以焊料填充孔眼和孔的内部体积; 并且冷却到低于焊料的熔点，使得熔融焊料在通孔位置处固化以形成焊接端子，同时在通孔中形成焊料柱。所得到的无引脚金属化陶瓷模块具有与由整体焊接端子组成的下一级封装（即，印刷电路板）的模块的I / O之间的连接。每个整体焊接端子包括在金属化陶瓷衬底的通孔中的柱，在衬底的顶表面上的焊料堆，以及底层上的球形焊料凸块，用于与下一级封装相互连接。

2. 发明授权

US06344234B1 Method for forming reflowed solder ball with low melting point metal cap 失效
标题翻译：用低熔点金属帽形成回流焊球的方法
公开(公告)号：US06344234B1
公开(公告)日：2002-02-05
申请号：US08476475
申请日：1995-06-07
申请人： Hormazdyar Minocher Dalal , Alexis Bitaillou , Kenneth Michael Fallon , Gene Joseph Gaudenzi , Kenneth Robert Herman , Frederic Pierre , Georges Robert
发明人： Hormazdyar Minocher Dalal , Alexis Bitaillou , Kenneth Michael Fallon , Gene Joseph Gaudenzi , Kenneth Robert Herman , Frederic Pierre , Georges Robert
IPC分类号： B05D512
CPC分类号： H01L24/12 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L2224/0401 , H01L2224/05171 , H01L2224/05184 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/11472 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/136 , H01L2224/13609 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/0435 , Y02P70/613 , Y10T29/49144 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/013
摘要： A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.
摘要翻译：公开了一种用于焊接互连的方法和结构，其使用用于将低温芯片附接到任何更高级别的封装衬底的焊球。在使用标准方法形成焊球后，回流焊锡球表面光滑。一层低熔点金属，例如铋，铟或锡，优选纯锡，沉积在焊料球的顶部。这种结构导致即使在多个低温回流循环之后，在随后的低温接合循环中形成的共晶合金也定位到高熔点焊球的顶部。该方法不需要对芯片要连接的基板进行镀锡，这使得该方法成本低廉。还注意到，当温度升高到略高于共熔温度的情况下，结构总是用铜线在接头周围形成液体圆角。这种液体圆角形成导致显着的热疲劳寿命改善以减少界面处的应力; 其次，为了芯片烧录，更换或现场维修的目的，提供了一种便于拆卸芯片的方法。

3. 发明授权

US06259159B1 Reflowed solder ball with low melting point metal cap 失效
标题翻译：具有低熔点金属帽的回流焊球
公开(公告)号：US06259159B1
公开(公告)日：2001-07-10
申请号：US08794982
申请日：1997-01-30
申请人： Hormazdyar Minocher Dalal , Alexis Bitaillou , Kenneth Michael Fallon , Gene Jospeh Gaudenzi , Kenneth Robert Herman , Frederic Pierre , Georges Robert
发明人： Hormazdyar Minocher Dalal , Alexis Bitaillou , Kenneth Michael Fallon , Gene Jospeh Gaudenzi , Kenneth Robert Herman , Frederic Pierre , Georges Robert
IPC分类号： H01L2348
CPC分类号： H01L24/12 , H01L21/0331 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L2224/0401 , H01L2224/05171 , H01L2224/05184 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/1147 , H01L2224/11472 , H01L2224/11902 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/136 , H01L2224/13609 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H05K3/143 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2924/013
摘要： A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.
摘要翻译：公开了一种用于焊接互连的方法和结构，其使用用于将低温芯片附接到任何更高级别的封装衬底的焊球。在使用标准方法形成焊球后，回流焊锡球表面光滑。一层低熔点金属，例如铋，铟或锡，优选纯锡，沉积在焊料球的顶部。这种结构导致即使在多个低温回流循环之后，在随后的低温接合循环中形成的共晶合金也定位到高熔点焊球的顶部。该方法不需要对芯片要连接的基板进行镀锡，这使得该方法成本低廉。还注意到，当温度升高到略高于共熔温度的情况下，结构总是用铜线在接头周围形成液体圆角。这种液体圆角形成导致显着的热疲劳寿命改善以减少界面处的应力; 其次，为了芯片烧录，更换或现场维修的目的，提供了一种便于拆卸芯片的方法。

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