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    • 5. 发明授权
    • Manufacturing of a semiconductor device and corresponding semiconductor device
    • 制造半导体器件和相应的半导体器件
    • US08841186B2
    • 2014-09-23
    • US13582142
    • 2010-03-04
    • Alexander HoelkeDeb Kumar PalKia Yaw KeeYang Hao
    • Alexander HoelkeDeb Kumar PalKia Yaw KeeYang Hao
    • H01L21/336H01L29/78H01L29/06H01L29/10H01L21/265H01L29/66H01L29/423
    • H01L21/26586H01L29/0634H01L29/0696H01L29/1033H01L29/4236H01L29/66659H01L29/7835H01L2924/0002H01L2924/00
    • The disclosed method of manufacturing (110, 120, 130, 140) a semiconductor device (12) has the steps (112, 114, 116) of: forming at least one wall (33) of a body (44) of the semiconductor device (12) by etching at least one trench (22) for a gate (42) of the semiconductor device (12) into the body (44); and performing a slanted implantation doping (126, 128) into the at least one wall (33) of the body (44), after the etching (112) of the at least one trench (22) and prior to coating the at least one trench (22) with an insulating layer (29). A semiconductor device (12) comprises at least one trench (22) for a gate (42) of the semiconductor device (12); and a body (44) having at least one wall (33) of the at least one trench (22), wherein a deviation (64) of a doping concentration (62) along a distance (66) in depth-direction (do) of the at least one trench (22) in a surface (33) of the at least one wall (33) is less than ten percent of a maximum value (68) of the doping concentration (62) along the distance (66).
    • 所公开的制造(110,120,130,140)半导体器件(12)的方法具有以下步骤:形成半导体器件的主体(44)的至少一个壁(33) (12)通过将用于半导体器件(12)的栅极(42)的至少一个沟槽(22)蚀刻到主体(44)中; 以及在所述至少一个沟槽(22)的所述蚀刻(112)之后并且在涂覆所述至少一个沟槽(22)之前,在所述主体(44)的所述至少一个壁(33)中执行倾斜注入掺杂(126,128) 具有绝缘层(29)的沟槽(22)。 半导体器件(12)包括用于半导体器件(12)的栅极(42)的至少一个沟槽(22); 以及具有所述至少一个沟槽(22)的至少一个壁(33)的主体(44),其中沿着深度方向(do)的距离(66)的掺杂浓度(62)的偏差(64) 在所述至少一个壁(33)的表面(33)中的所述至少一个沟槽(22)的距离小于所述距离(66)的所述掺杂浓度(62)的最大值(68)的百分之十。
    • 7. 发明申请
    • MANUFACTURING OF A SEMICONDUCTOR DEVICE AND CORRESPONDING SEMICONDUCTOR DEVICE
    • 半导体器件的制造和相应的半导体器件
    • US20120319193A1
    • 2012-12-20
    • US13582142
    • 2010-03-04
    • Alexander HoelkeDeb Kumar PalKia Yaw KeeYang Hao
    • Alexander HoelkeDeb Kumar PalKia Yaw KeeYang Hao
    • H01L21/336H01L29/78
    • H01L21/26586H01L29/0634H01L29/0696H01L29/1033H01L29/4236H01L29/66659H01L29/7835H01L2924/0002H01L2924/00
    • The disclosed method of manufacturing (110, 120, 130, 140) a semiconductor device (12) has the steps (112, 114, 116) of: forming at least one wall (33) of a body (44) of the semiconductor device (12) by etching at least one trench (22) for a gate (42) of the semiconductor device (12) into the body (44); and performing a slanted implantation doping (126, 128) into the at least one wall (33) of the body (44), after the etching (112) of the at least one trench (22) and prior to coating the at least one trench (22) with an insulating layer (29). A semiconductor device (12) comprises at least one trench (22) for a gate (42) of the semiconductor device (12); and a body (44) having at least one wall (33) of the at least one trench (22), wherein a deviation (64) of a doping concentration (62) along a distance (66) in depth-direction (do) of the at least one trench (22) in a surface (33) of the at least one wall (33) is less than ten percent of a maximum value (68) of the doping concentration (62) along the distance (66).
    • 所公开的制造(110,120,130,140)半导体器件(12)的方法具有以下步骤:形成半导体器件的主体(44)的至少一个壁(33) (12)通过将用于半导体器件(12)的栅极(42)的至少一个沟槽(22)蚀刻到主体(44)中; 以及在所述至少一个沟槽(22)的所述蚀刻(112)之后并且在涂覆所述至少一个沟槽(22)之前,在所述主体(44)的所述至少一个壁(33)中执行倾斜注入掺杂(126,128) 具有绝缘层(29)的沟槽(22)。 半导体器件(12)包括用于半导体器件(12)的栅极(42)的至少一个沟槽(22); 以及具有所述至少一个沟槽(22)的至少一个壁(33)的主体(44),其中沿着深度方向(do)的距离(66)的掺杂浓度(62)的偏差(64) 在所述至少一个壁(33)的表面(33)中的所述至少一个沟槽(22)的距离小于所述距离(66)的所述掺杂浓度(62)的最大值(68)的百分之十。
    • 9. 发明申请
    • TRANSISTOR
    • 晶体管
    • US20110198690A1
    • 2011-08-18
    • US12867257
    • 2009-02-12
    • Yong Hai HuElizabeth Ching Tee KhoZheng Chao LiuDeb Kumar PalMichael Mee Gouh TiongJian LiuKia Yaw KeeWilliam Siang Lim Lau
    • Yong Hai HuElizabeth Ching Tee KhoZheng Chao LiuDeb Kumar PalMichael Mee Gouh TiongJian LiuKia Yaw KeeWilliam Siang Lim Lau
    • H01L29/78
    • H01L29/7834H01L29/0653H01L29/42368H01L29/7835
    • A Metal Oxide Semiconductor (MOS) transistor comprising: a source; a gate; and a drain, the source, gate and drain being located in or on a well structure of a first doping polarity located in or on a substrate; wherein at least one of the source and the drain comprises a first structure comprising: a first region forming a first drift region, the first region being of a second doping polarity opposite the first doping polarity; a second region of the second doping polarity in or on the first region, the second region being a well region and having a doping concentration which is higher than the doping concentration of the first region; and a third region of the second doping polarity in or on the second region. Due to the presence of the second region the transistor may have a lower ON resistance when compared with a similar transistor which does not have the second region. The breakdown voltage may be influenced only to a small extent.
    • 一种金属氧化物半导体(MOS)晶体管,包括:源极; 一个门 以及漏极,源极,栅极和漏极位于位于衬底中或衬底上的第一掺杂极性的阱结构中或其上; 其中所述源极和漏极中的至少一个包括第一结构,所述第一结构包括:形成第一漂移区的第一区,所述第一区具有与所述第一掺杂极性相反的第二掺杂极性; 所述第二区域是所述第二区域中的第二掺杂极性的第二区域,所述第二区域是阱区域,并且具有高于所述第一区域的掺杂浓度的掺杂浓度; 以及在第二区域中或第二区域上的第二掺杂极性的第三区域。 由于存在第二区域,与不具有第二区域的类似晶体管相比,晶体管可能具有较低的导通电阻。 击穿电压可能仅在很小程度上受到影响。