专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110000588A1 Continuous production system for magnetic processing of metals and alloys to tailor next generation materials 审中-公开
标题翻译：用于金属和合金的磁加工的连续生产系统来定制下一代材料
公开(公告)号：US20110000588A1
公开(公告)日：2011-01-06
申请号：US12459323
申请日：2009-07-01
申请人： Alexander Bogicevic , Aquil Ahmad , John A. Kovacich , Bohdan Lisowsky , Michael L. Killian , Alaa A. Elmoursi
发明人： Alexander Bogicevic , Aquil Ahmad , John A. Kovacich , Bohdan Lisowsky , Michael L. Killian , Alaa A. Elmoursi
IPC分类号： C21D1/04 , B29C67/00
CPC分类号： C21D1/04
摘要： A system and method for producing material characteristics are described. A magnetic treatment chamber with a high magnetic field treats workpieces; and a conveyor or transporter continuously moves the workpieces through the high magnetic field in the magnetic chamber. A frictional or mechanical engagement system extracts the workpieces through and out of the high magnetic field.
摘要翻译：描述了用于生产材料特性的系统和方法。磁场高磁场处理工件; 输送机或输送机通过磁性室中的高磁场连续移动工件。摩擦或机械接合系统通过和从高磁场提取工件。

2. 发明授权

US08821701B2 Ion beam sputter target and method of manufacture 有权
标题翻译：离子束溅射靶及其制造方法
公开(公告)号：US08821701B2
公开(公告)日：2014-09-02
申请号：US12792324
申请日：2010-06-02
申请人： Clifton Higdon , Alaa A. Elmoursi , Jason Goldsmith , Bruce Cook , Peter Blau , Qu Jun , Robert Milner
发明人： Clifton Higdon , Alaa A. Elmoursi , Jason Goldsmith , Bruce Cook , Peter Blau , Qu Jun , Robert Milner
IPC分类号： C23C14/00 , C25B9/00 , C25B11/00 , C25B13/00
CPC分类号： C23C14/3414 , C23C14/3407 , C23C14/46
摘要： A target for use in an ion beam sputtering apparatus made of at least two target tiles where at least two of the target tiles are made of different chemical compositions and are mounted on a main tile and geometrically arranged on the main tile to yield a desired chemical composition on a sputtered substrate. In an alternate embodiment, the tiles are of varied thickness according to the desired chemical properties of the sputtered film. In yet another alternate embodiment, the target is comprised of plugs pressed in a green state which are disposed in cavities formed in a main tile also formed in a green state and the assembly can then be compacted and then sintered.
摘要翻译：用于由至少两个目标瓦片制成的离子束溅射装置中的靶，其中至少两个目标瓦片由不同的化学成分制成并且安装在主瓦片上并几何地布置在主瓦片上以产生期望的化学品在溅射衬底上的组成。在替代实施例中，根据溅射膜的期望化学特性，瓷砖的厚度变化。在另一替代实施例中，目标由按压在绿色状态的塞子组成，它们设置在也形成为绿色状态的主瓦片中形成的空腔中，然后可将该组件压实，然后烧结。

3. 发明申请

US20110297535A1 ION BEAM SPUTTER TARGET AND METHOD OF MANUFACTURE 有权
标题翻译：离子束溅射靶和制造方法
公开(公告)号：US20110297535A1
公开(公告)日：2011-12-08
申请号：US12792324
申请日：2010-06-02
申请人： Clifton Higdon , Alaa A. Elmoursi , Jason Goldsmith , Bruce Cook , Peter Blau , Qu Jun , Robert Milner
发明人： Clifton Higdon , Alaa A. Elmoursi , Jason Goldsmith , Bruce Cook , Peter Blau , Qu Jun , Robert Milner
IPC分类号： C23C14/34 , B32B38/00
CPC分类号： C23C14/3414 , C23C14/3407 , C23C14/46
摘要： A target for use in an ion beam sputtering apparatus made of at least two target tiles where at least two of the target tiles are made of different chemical compositions and are mounted on a main tile and geometrically arranged on the main tile to yield a desired chemical composition on a sputtered substrate. In an alternate embodiment, the tiles are of varied thickness according to the desired chemical properties of the sputtered film. In yet another alternate embodiment, the target is comprised of plugs pressed in a green state which are disposed in cavities formed in a main tile also formed in a green state and the assembly can then be compacted and then sintered.
摘要翻译：用于由至少两个目标瓦片制成的离子束溅射装置中的靶，其中至少两个目标瓦片由不同的化学成分制成并且安装在主瓦片上并几何地布置在主瓦片上以产生期望的化学品在溅射衬底上的组成。在替代实施例中，根据溅射膜的期望化学特性，瓷砖的厚度变化。在另一替代实施例中，目标由按压在绿色状态的塞子组成，它们设置在也形成为绿色状态的主瓦片中形成的空腔中，然后可将该组件压实然后烧结。

4. 发明授权

US07476422B2 Copper circuit formed by kinetic spray 有权
标题翻译：铜电路由动力喷雾形成
公开(公告)号：US07476422B2
公开(公告)日：2009-01-13
申请号：US10154342
申请日：2002-05-23
申请人： Alaa A. Elmoursi , Frans P. Lautzenhiser , Albert B. Campbell , John R. Smith
发明人： Alaa A. Elmoursi , Frans P. Lautzenhiser , Albert B. Campbell , John R. Smith
IPC分类号： B05D5/12 , B05D1/08 , C23C4/08
CPC分类号： H05K3/102 , C23C24/04 , H05K1/092 , H05K3/245 , H05K2203/1344 , H05K2203/1518 , Y10T428/24926
摘要： The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer. Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate, forming a bond layer including silver over select portions of the substrate according to a desired shape of the circuit, and depositing copper on the bond layer by the steps of introducing copper particles into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles into a supersonic jet, and directing the jet toward the bond layer formed over the substrate such that the jet has a velocity sufficient to cause plastic deformation of the copper particles onto the bond layer, thereby forming an electrically conductive layer on the bond layer.
摘要翻译：本发明涉及具有电绝缘性基板的铜基电路，根据电路的所需形状在基板的选定部分上形成的包含银的接合层，以及包含沉积在该键上的铜质塑性变形颗粒的导电层层。此外，本发明还涉及形成铜基电路的方法，其中该方法包括以下步骤：提供电绝缘衬底，根据电路的所需形状，在衬底的选定部分上形成包含银的结合层，以及通过将铜颗粒引入加压载气中的步骤将铜沉积在接合层上，将加压的载气和铜颗粒形成超音速射流，并将射流引向形成在基底上的接合层，使得射流具有足以使铜颗粒塑性变形到接合层上的速度，从而在接合层上形成导电层。

5. 发明授权

US07081376B2 Kinetically sprayed aluminum metal matrix composites for thermal management 有权
公开(公告)号：US07081376B2
公开(公告)日：2006-07-25
申请号：US10972919
申请日：2004-10-25
申请人： Donald T. Morelli , Alaa A. Elmoursi , Thomas H. Van Steenkiste , Brian K. Fuller , Bryan A. Gillispie , Daniel W. Gorkiewicz
发明人： Donald T. Morelli , Alaa A. Elmoursi , Thomas H. Van Steenkiste , Brian K. Fuller , Bryan A. Gillispie , Daniel W. Gorkiewicz
IPC分类号： H01L21/44
CPC分类号： C23C24/04
摘要： Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

6. 发明申请

US20080290378A1 Transistor package with wafer level dielectric isolation 审中-公开
标题翻译：晶体管封装，晶圆级绝缘隔离
公开(公告)号：US20080290378A1
公开(公告)日：2008-11-27
申请号：US11804925
申请日：2007-05-21
申请人： Bruce A. Myers , Darrel E. Peugh , Alaa A. Elmoursi , Thomas Hubert Van Steenkiste , Zhibo Zhao , Bryan A. Gillispie
发明人： Bruce A. Myers , Darrel E. Peugh , Alaa A. Elmoursi , Thomas Hubert Van Steenkiste , Zhibo Zhao , Bryan A. Gillispie
IPC分类号： H01L21/20 , H01L29/76
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/15312 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A low cost transistor package is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die, high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer is fixed to a silicon transistor die, for coupling to a heat conducting buffer and attachment to a substrate. The dielectric layer is fixed to the die by growing the dielectric layer, depositing the dielectric layer, or applying the dielectric layer using a plasma spray. In an aspect, a conductive layer is formed to the silicon transistor die by a thermal or kinetic spray process, and the dielectric layer is applied to the conductive layer. The dielectric layer may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die.
摘要翻译：为高功率应用提供了低成本晶体管封装。该封装为硅晶体管裸片提供高导热性和耗散能力，高电流承载能力和隔离性以及高功率和热循环寿命性能和可靠性。电介质层被固定到硅晶体管管芯，用于耦合到导热缓冲器并附接到衬底。通过生长电介质层，沉积介电层或使用等离子体喷涂来施加电介质层，将电介质层固定到管芯。在一个方面，通过热或动力学喷涂工艺将导电层形成于硅晶体管管芯，并将介电层施加到导电层上。电介质层也可以在晶体管制造之前或之后建立。电和热互连有利地从硅晶体管管芯的相对侧定位。

7. 发明授权

US07351450B2 Correcting defective kinetically sprayed surfaces 有权
标题翻译：校正有缺陷的动力喷涂表面
公开(公告)号：US07351450B2
公开(公告)日：2008-04-01
申请号：US10677869
申请日：2003-10-02
申请人： Brian K Fuller , Alaa A. Elmoursi , Kenneth M Rahmoeller
发明人： Brian K Fuller , Alaa A. Elmoursi , Kenneth M Rahmoeller
IPC分类号： C23C4/12 , B05D1/12
CPC分类号： C23C24/04 , C23C4/01 , C23C4/02 , C23C4/18
摘要： Disclosed is a method for repairing defects in kinetically sprayed surfaces. The typical defects comprise isolated or connected conical shaped holes in the kinetic spray coating. The repair involves thermally spraying a molten material into the defective area to fill in the cone followed by continued kinetic spraying to complete the coating.
摘要翻译：公开了一种修复动力学喷涂表面缺陷的方法。典型的缺陷在动力喷涂中包括隔离或连接的圆锥形孔。该修复涉及将熔融材料热喷涂到缺陷区域以填充锥体，然后继续动力喷涂以完成涂层。

8. 发明授权

US06949300B2 Product and method of brazing using kinetic sprayed coatings 有权
标题翻译：使用动力喷涂的钎焊的产品和方法
公开(公告)号：US06949300B2
公开(公告)日：2005-09-27
申请号：US10418244
申请日：2003-04-16
申请人： Bryan A. Gillispie , Zhibo Zhao , John Robert Smith , Thomas Hubert Van Steenkiste , Alaa A. Elmoursi , Yang Luo , Hartley F. Hutchins
发明人： Bryan A. Gillispie , Zhibo Zhao , John Robert Smith , Thomas Hubert Van Steenkiste , Alaa A. Elmoursi , Yang Luo , Hartley F. Hutchins
IPC分类号： B23K1/00 , C23C24/04 , F28F19/06 , B32B15/01 , B05D1/02
CPC分类号： C23C24/04 , B23K1/0012 , B23K2101/14 , F28F19/06 , Y10S428/937 , Y10S428/94 , Y10T428/12014 , Y10T428/12028 , Y10T428/12063 , Y10T428/1209 , Y10T428/12493 , Y10T428/12639 , Y10T428/12736 , Y10T428/12764 , Y10T428/12792
摘要： The present invention is directed to a process for preparing aluminum and aluminum alloy surfaces in heat exchangers for brazing by depositing thereon a kinetic sprayed brazing composition. The process simultaneously deposits monolith or composite coatings that can include all braze materials and corrosion protection materials used in the brazing of aluminum fins to plates and tubes in a single stage.
摘要翻译：本发明涉及一种在用于钎焊的热交换器中通过在其上沉积动力喷涂钎焊组合物来制备铝和铝合金表面的方法。该工艺同时沉积单块或复合涂层，其可以包括在单个阶段将铝翅片钎焊到板和管的所有钎焊材料和防腐蚀材料。

9. 发明授权

US5458927A Process for the formation of wear- and scuff-resistant carbon coatings 失效
标题翻译：形成耐磨和耐磨碳涂层的方法
公开(公告)号：US5458927A
公开(公告)日：1995-10-17
申请号：US401110
申请日：1995-03-08
申请人： Gerard W. Malaczynski , Xiaohong Qiu , Joseph V. Mantese , Alaa A. Elmoursi , Aboud H. Hamdi , Blake P. Wood , Kevin C. Walter , Michael A. Nastasi
发明人： Gerard W. Malaczynski , Xiaohong Qiu , Joseph V. Mantese , Alaa A. Elmoursi , Aboud H. Hamdi , Blake P. Wood , Kevin C. Walter , Michael A. Nastasi
IPC分类号： C23C16/02 , C23C16/26 , B05D3/06
CPC分类号： C23C16/26 , C23C16/0245
摘要： A process for forming an adherent diamond-like carbon coating on a workpiece of suitable material such as an aluminum alloy is disclosed. The workpiece is successively immersed in different plasma atmospheres and subjected to short duration, high voltage, negative electrical potential pulses or constant negative electrical potentials or the like so as to clean the surface of oxygen atoms, implant carbon atoms into the surface of the alloy to form carbide compounds while codepositing a carbonaceous layer on the surface, bombard and remove the carbonaceous layer, and to thereafter deposit a generally amorphous hydrogen-containing carbon layer on the surface of the article.
摘要翻译：公开了一种在诸如铝合金的合适材料的工件上形成粘附的类金刚石碳涂层的方法。将工件连续地浸渍在不同的等离子体气氛中，经受短时间，高电压，负电势脉冲或恒定负电位等，以清洁氧原子的表面，将碳原子注入合金表面形成碳化物，同时在表面上共沉积碳质层，轰击并除去碳质层，然后在制品的表面上沉积一般无定形的含氢碳层。

10. 发明申请

US20090285996A1 HIGH PERFORMANCE KINETIC SPRAY NOZZLE 审中-公开
标题翻译：高性能动力喷雾喷嘴
公开(公告)号：US20090285996A1
公开(公告)日：2009-11-19
申请号：US12499434
申请日：2009-07-08
申请人： Zhibo Zhao , Bryan A. Gillispie , Taeyoung Han , Alaa A. Elmoursi , Nilesh B. Patel
发明人： Zhibo Zhao , Bryan A. Gillispie , Taeyoung Han , Alaa A. Elmoursi , Nilesh B. Patel
IPC分类号： B05D1/12
CPC分类号： C23C24/04 , B05B1/044 , B05B7/1486 , B05B7/1613
摘要： A nozzle assembly for a kinetic spray system includes a convergent portion, a throat portion, and a divergent portion, each cooperating together to define a passage therethrough for passing a mixture of powder particles suspended in a flow of a high pressure heated gas. The nozzle assembly further includes an extension portion attached to the divergent portion and extending to a distal end a pre-determined length from the divergent portion of the nozzle assembly. The extension portion permits a dragging force exerted on the powder particles by the flow of high pressure heated gas to act upon the powder particles for a longer duration of time, thereby permitting the powder particles to accelerate to a greater velocity than has been previously achievable.
摘要翻译：用于动力喷雾系统的喷嘴组件包括会聚部分，喉部和发散部分，每个共同部分配合在一起以限定通过其中的通道，用于使悬浮在高压加热气体流中的粉末颗粒的混合物通过。喷嘴组件还包括附接到发散部分并延伸到远端的延伸部分，其具有从喷嘴组件的发散部分的预定长度。延伸部分允许通过高压加热气体的流动施加在粉末颗粒上的拖曳力，以对粉末颗粒作用更长的持续时间，从而允许粉末颗粒加速到比先前可实现的更大的速度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式