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1. 发明授权

US07215235B2 Conductive substrate with resistance layer, resistance board, and resistance circuit board 失效
标题翻译：具有电阻层，电阻板和电阻电路板的导电基板
公开(公告)号：US07215235B2
公开(公告)日：2007-05-08
申请号：US10819929
申请日：2004-04-08
申请人： Akira Matsuda , Yuuji Suzuki , Hideo Otsuka , Yuuki Kikuchi , Sadao Matsumoto
发明人： Akira Matsuda , Yuuji Suzuki , Hideo Otsuka , Yuuki Kikuchi , Sadao Matsumoto
IPC分类号： H01C1/012
CPC分类号： H01C17/065 , H05K1/167 , H05K3/384 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723
摘要： A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.
摘要翻译：一种具有电阻层的导电性基板，其特征在于，具有通过电阻部件在其表面上被电阻成分处理的基本平坦的高导电性基板粗糙化，并且通过所述电阻部件设置有电阻层，使得能够使高导电性基板和电阻成分层之间的界面成为基本平坦化，能够在剥离高导电性基材后能够获得具有稳定电阻的薄膜电阻层，并且能够与绝缘支撑体一起保持剥离强度，以及使用其的电阻板。

2. 发明授权

US07794578B2 Method for preparing a circuit board material having a conductive base and a resistance layer 有权
标题翻译：制备具有导电基底和电阻层的电路板材料的方法
公开(公告)号：US07794578B2
公开(公告)日：2010-09-14
申请号：US10719020
申请日：2003-11-24
申请人： Akira Matsuda , Yuuji Suzuki , Hideo Otsuka , Yuuki Kikuchi , Sadao Matsumoto
发明人： Akira Matsuda , Yuuji Suzuki , Hideo Otsuka , Yuuki Kikuchi , Sadao Matsumoto
IPC分类号： C25D3/56
CPC分类号： H05K1/167 , C25D3/562 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723 , Y10T428/12944
摘要： A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.
摘要翻译：一种镀浴，其能够在导电性基体的粗糙化表面上形成具有均匀厚度分布的电阻层，包括镍离子和氨基磺酸或其盐作为必要成分，以及至少一种磷酸，亚磷酸，次磷酸，及其盐; 具有电阻稳定的薄电阻层的导电性基材和使用该导电性基材的电阻电路基板材料。

3. 发明授权

US5829623A Easily openable can lid 失效
标题翻译：容易打开盖子
公开(公告)号：US5829623A
公开(公告)日：1998-11-03
申请号：US156764
申请日：1993-11-24
申请人： Hideo Otsuka , Hiroyuki Terasawa , Shigeaki Yamanashi , Ichio Otsuka , Sunao Morishita
发明人： Hideo Otsuka , Hiroyuki Terasawa , Shigeaki Yamanashi , Ichio Otsuka , Sunao Morishita
IPC分类号： B65D8/12 , B21D51/44 , B65D8/08 , B65D17/32 , B65D17/34
CPC分类号： B65D17/165 , Y10S220/906
摘要： An easily openable can lid wherein buckling parts are provided nearby a peripheral groove formed on the can lid in a range of 25 to 65 degrees from the center of the top plate from a line between the tip end of the openable member and the center of the top plate in all sector segments formed when the can lid is divided into four sector segments by a line between an extreme end of the openable member and the center of the top plate and a line which passes through the center of the top plate and orthogonally intersects the above described line. A reinforcing part with a reinforcing effect smaller than a buckling effect is provided at a coupling part between the top plate and the peripheral groove or near said coupling part except for the buckling part at an opposite side of the openable member and its neighborhood to provide a difference of strength between the buckling part at the openable member side and the buckling part at an opposite side of the openable member.
摘要翻译：一种容易打开的罐盖，其中弯曲部分设置在形成于罐盖上的周边槽附近，与顶板的中心之间的距离为25至65度的范围，从可打开构件的顶端与中心之间的线当罐盖通过可打开构件的末端和顶板的中心之间的线分成四个扇形段时形成的所有扇形段中的顶板和穿过顶板的中心并且正交相交的线上述行。在顶板和周边槽之间的耦合部分或靠近所述耦合部分的除了在可打开构件的相对侧的屈曲部分及其附近之外的耦合部分处提供具有小于屈曲效应的增强效果的加强部分，以提供可打开构件侧的屈曲部与可打开构件的相对侧的屈曲部之间的强度差。

4. 发明授权

US5834140A Electrodeposited copper foil for fine pattern and method for producing the same 失效
标题翻译：用于精细图案的电沉积铜箔及其制造方法
公开(公告)号：US5834140A
公开(公告)日：1998-11-10
申请号：US715104
申请日：1996-09-18
申请人： Adam M. Wolski , Michel Streel , Akitoshi Suzuki , Hideo Otsuka
发明人： Adam M. Wolski , Michel Streel , Akitoshi Suzuki , Hideo Otsuka
IPC分类号： C25D1/04 , C25F3/02 , H05K1/09 , H05K3/00
CPC分类号： C25D1/04 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.
摘要翻译：本发明是一种电沉积铜箔，其特征在于，在未处理铜箔的无光泽面上进行粗糙化处理，其中未处理铜箔的无光泽面的表面粗糙度Rz与表面粗糙度Rz相同或小于这个未经处理的铜箔的光泽面。电沉积铜箔通过从含有0.05-5ppm 3-巯基1-丙磺酸盐的电解质将铜电沉积到鼓上制成，至少一种选自0.1至15ppm的多糖，其为碳水化合物如淀粉，纤维素和植物橡胶，和0.3至35ppm的重均分子量为10,000或更小的低分子量胶; 和10〜60ppm的氯离子。铜箔可用于制造印刷电路板或二次电池单元的组件。

5. 发明授权

US5503494A Spline-coupling structure 失效
标题翻译：花键耦合结构
公开(公告)号：US5503494A
公开(公告)日：1996-04-02
申请号：US278218
申请日：1994-07-21
申请人： Akira Kamata , Hiroshi Moriya , Yuzi Ikki , Takeshi Hanamoto , Yoshiari Takagi , Hideo Otsuka
发明人： Akira Kamata , Hiroshi Moriya , Yuzi Ikki , Takeshi Hanamoto , Yoshiari Takagi , Hideo Otsuka
IPC分类号： F16D1/06 , F16D1/08 , F16D3/06 , F16H55/17
CPC分类号： F16H57/0025 , F16D1/0858 , F16D3/06 , F16D2001/103 , Y10T403/7035
摘要： A spline-coupling structure in which at least one of male and female members has a press-fit guide face provided at its end opposed to the other member before press-fitting of the members. The press-fit guide face includes a plurality of guide face portions smoothly interconnecting the end and bottom lands of the spline teeth of the one member to form axially outwardly expanded arcs, a plurality of second guide face portions smoothly interconnecting tooth addendums of the spline teeth and the end to form axially outwardly expanded arcs, and a plurality of third guide face portions smoothly interconnecting tooth flanks of the spline teeth and the second guide face portion to form axially outwardly expanded arcs. The first, second and third guide face portions are connected smoothly to one another. Thus, dragging between the spline teeth of both members is prevented during press-fit coupling, to maximize the function of crownings to reduce press-fitting load and provide a sufficient coupling force, and facilitate disengagement of both members from each other and allow reuse of both members.
摘要翻译：一种花键联接结构，其中，在构件的压配合之前，凸构件和阴构件中的至少一个具有设置在其与另一构件相对的端部处的压入引导面。压入引导面包括多个引导面部分，其平滑地将一个部件的花键齿的端部和底部平台互连以形成轴向向外的扩展的弧形;多个第二引导面部分，其平滑地互连花键齿的齿顶并且端部形成轴向向外扩展的弧，并且多个第三引导面部分使花键齿的齿面与第二引导面部分平滑地互连，以形成轴向向外扩展的弧。第一，第二和第三引导面部分彼此平滑地连接。因此，在压配合期间防止两个构件的花键齿之间的拖动，以最大限度地发挥冠部的功能，以减小压配合载荷并提供足够的联接力，并且有助于两个构件彼此分离并允许再次使用两个成员。

6. 发明授权

US07172818B2 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board 失效
标题翻译：用于片上胶片的铜箔，等离子体显示面板或高频印刷电路板
公开(公告)号：US07172818B2
公开(公告)日：2007-02-06
申请号：US10651099
申请日：2003-08-29
申请人： Tadao Nakaoka , Akitoshi Suzuki , Hideo Otsuka , Hisao Kimijima
发明人： Tadao Nakaoka , Akitoshi Suzuki , Hideo Otsuka , Hisao Kimijima
IPC分类号： B32B3/00 , B32B5/02 , B32B5/16 , B32B15/20
CPC分类号： C25D7/0614 , H05K1/0242 , H05K1/09 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10T428/12063 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/12792 , Y10T428/1291 , Y10T428/12993
摘要： A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.
摘要翻译：一种用于膜片上使用的铜箔，等离子体显示面板或通过轧制铜箔来平滑表面以获得不超过理想平滑表面的1.30倍的表面积而获得的高频印刷电路板，在其上沉积有Cu或Cu或Mo的合金颗粒或Cu或包含Cu和选自Ni，Co，Fe和Cr中的至少一种元素的合金颗粒的Cu或细小的粗糙化颗粒的平滑化铜或该合金颗粒和选自V，Mo和W组中的至少一种元素的氧化物。

7. 发明授权

US4401506A Process for producing semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US4401506A
公开(公告)日：1983-08-30
申请号：US321130
申请日：1981-11-13
申请人： Hideo Otsuka
发明人： Hideo Otsuka
IPC分类号： C30B25/18 , H01L21/205 , H01L21/322 , C30B25/20
CPC分类号： C30B25/18 , H01L21/02381 , H01L21/02532 , H01L21/0262 , H01L21/02658 , H01L21/3221 , Y10S117/913
摘要： A process for producing a semiconductor device having high quality and self-gettering action. First, oxygen ion is implanted to the surface of a silicon monocrystalline substrate. Then, it is heat treated to precipitate the oxygen ion and to thereby produce micro defects in the layer to which oxygen ion is implanted. Subsequently, an epitaxial layer is grown on the micro defect layer. The two steps after the oxygen ion implantation may be conducted in reverse order to one another.
摘要翻译：一种具有高质量和自吸性作用的半导体器件的制造方法。首先，将氧离子注入硅单晶衬底的表面。然后，将其进行热处理以沉淀氧离子，从而在植入氧离子的层中产生微小缺陷。随后，在微缺陷层上生长外延层。氧离子注入后的两个步骤可以彼此相反的顺序进行。

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