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1. 发明授权

US08040200B2 Parallel differential transmission lines having an opposing grounding conductor separated into two parts by a slot therein 有权
标题翻译：平行的差动传输线具有相对的接地导体，其中的狭槽分成两部分
公开(公告)号：US08040200B2
公开(公告)日：2011-10-18
申请号：US12486912
申请日：2009-06-18
申请人： Akira Minegishi , Toru Yamada , Kazuhide Uriu , Susumu Sawada
发明人： Akira Minegishi , Toru Yamada , Kazuhide Uriu , Susumu Sawada
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H01P1/02
摘要： In a differential transmission line, a substrate has first and second surfaces parallel to each other, and a first grounding conductor is formed on the second surface of the substrate. A dielectric layer is formed on the first grounding conductor, and a second grounding conductor is formed on the dielectric layer. First and the second signal conductors are formed to be parallel to each other on the first surface of the substrate. The first signal conductor and the first and second grounding conductors constitute a first transmission line, and the second signal conductor and the first and second grounding conductors constitute a second transmission line. A slot is formed in the first grounding conductor to three-dimensionally intersect with the first and second signal conductors and to be orthogonal to a longitudinal direction thereof, and a connecting conductor is formed for connecting the first grounding conductor with the second grounding conductor.
摘要翻译：在差动传输线中，基板具有彼此平行的第一和第二表面，并且在基板的第二表面上形成第一接地导体。介电层形成在第一接地导体上，第二接地导体形成在电介质层上。第一和第二信号导体形成为在基板的第一表面上彼此平行。第一信号导体和第一和第二接地导体构成第一传输线，第二信号导体和第一和第二接地导体构成第二传输线。在第一接地导体中形成有与第一和第二信号导体三维相交并且与其纵向正交的槽，并且形成用于将第一接地导体与第二接地导体连接的连接导体。

2. 发明申请

US20090315649A1 DIFFERENTIAL TRANSMISSION LINE INCLUDING TWO TRANSMISSION LINES PARALLEL TO EACH OTHER 有权
标题翻译：差异传输线包括两个传输线并行到每个其他
公开(公告)号：US20090315649A1
公开(公告)日：2009-12-24
申请号：US12486912
申请日：2009-06-18
申请人： Akira MINEGISHI , Toru Yamada , Kazuhide Uriu , Susumu Sawada
发明人： Akira MINEGISHI , Toru Yamada , Kazuhide Uriu , Susumu Sawada
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H01P1/02
摘要： In a differential transmission line, a substrate has first and second surfaces parallel to each other, and a first grounding conductor is formed on the second surface of the substrate. A dielectric layer is formed on the first grounding conductor, and a second grounding conductor is formed on the dielectric layer. First and the second signal conductors are formed to be parallel to each other on the first surface of the substrate. The first signal conductor and the first and second grounding conductors constitutes a first transmission line, and the second signal conductor and the first and second grounding conductors constitutes a second transmission line. A slot is formed in the first grounding conductor to sterically intersect with the first and second signal conductors and to be orthogonal to a longitudinal direction thereof, and a connecting conductor is formed for connecting the first grounding conductor with the second grounding conductor.
摘要翻译：在差动传输线中，基板具有彼此平行的第一和第二表面，并且在基板的第二表面上形成第一接地导体。介电层形成在第一接地导体上，第二接地导体形成在电介质层上。第一和第二信号导体形成为在基板的第一表面上彼此平行。第一信号导体和第一和第二接地导体构成第一传输线，第二信号导体和第一和第二接地导体构成第二传输线。在第一接地导体中形成有与第一和第二信号导体空间交叉并且与其纵向方向垂直的槽，并且形成用于将第一接地导体与第二接地导体连接的连接导体。

3. 发明授权

US08297488B2 Bump forming method using self-assembling resin and a wall surface 有权
标题翻译：使用自组装树脂和壁面的凸起成形方法
公开(公告)号：US08297488B2
公开(公告)日：2012-10-30
申请号：US12282774
申请日：2007-02-22
申请人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
发明人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
IPC分类号： B23K31/00 , B23K31/02
CPC分类号： H05K3/3484 , H01L24/11 , H01L2224/11522 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01055 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H05K2203/0425 , H05K2203/083 , H05K2203/087 , H01L2924/00
摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
摘要翻译：在布线基板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡发生剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。

4. 发明申请

US20110204367A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY 有权
标题翻译：半导体器件，其制造方法和图像显示器
公开(公告)号：US20110204367A1
公开(公告)日：2011-08-25
申请号：US12672135
申请日：2008-08-06
申请人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
发明人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
IPC分类号： H01L33/02 , H01L29/786 , H01L21/336
CPC分类号： H01L51/057 , H01L27/3274 , H01L27/3276 , H01L51/0096 , Y02E10/549 , Y02P70/521
摘要： A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, a source electrode disposed along the inner wall of the through hole, a drain electrode disposed along the inner wall of the through hole, a gate electrode disposed on the other surface of the resin film opposing the through hole, an insulating layer disposed on the gate electrode at the bottom of the through hole and an organic semiconductor disposed in the through hole so as to contact the source electrode and the drain electrode, wherein the organic semiconductor makes contact with at least a part of the insulating layer at the bottom of the through hole so that a channel is formed in the organic semiconductor in the vicinity of the insulating layer that is in contact therewith.
摘要翻译：提供了具有以更高密度形成的半导体元件的半导体器件。此外，还提供了使用该半导体器件的图像显示装置。一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，沿着通孔的内壁设置的源电极，沿该通孔的内壁设置的漏电极，设置在与通孔相对的树脂膜的另一个表面上的栅电极，设置在通孔底部的栅电极上的绝缘层和布置在通孔中的有机半导体，以便与源电极和漏极电极，其中有机半导体与通孔底部的绝缘层的至少一部分接触，使得在与其接触的绝缘层附近的有机半导体中形成沟道。

5. 发明申请

US20110204366A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY 有权
标题翻译：半导体器件，其制造方法和图像显示器
公开(公告)号：US20110204366A1
公开(公告)日：2011-08-25
申请号：US12672127
申请日：2008-08-06
申请人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
发明人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Susumu Sawada
IPC分类号： H01L33/02 , H01L29/786 , H01L21/336
CPC分类号： H01L27/3274 , H01L27/283 , H01L27/3248 , H01L27/3276 , H01L51/0005 , H01L51/0558 , H01L2227/323
摘要： A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, an organic semiconductor disposed inside the through hole, an insulating film on one end of the organic semiconductor, a gate electrode on the insulating film, a source electrode connected electrically to the other end of the organic semiconductor and a drain electrode connected electrically to the other end of the organic semiconductor.
摘要翻译：提供了具有以更高密度形成的半导体元件的半导体器件。此外，还提供了使用该半导体器件的图像显示装置。一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，设置在所述通孔内的有机半导体，在所述有机半导体的一端上的绝缘膜，所述绝缘膜上的栅电极与该有机半导体的另一端电连接的源电极和与该有机半导体的另一端电连接的漏电极。

6. 发明申请

US20090008776A1 Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method 审中-公开
标题翻译：电子元件安装体，带焊料凸块的电子部件，焊料树脂混合材料，电子部件安装方法和电子部件制造方法
公开(公告)号：US20090008776A1
公开(公告)日：2009-01-08
申请号：US12281195
申请日：2007-02-23
申请人： Takashi Kitae , Seiichi Nakatani , Seiji Karashima , Susumu Sawada , Kenichi Hotehama
发明人： Takashi Kitae , Seiichi Nakatani , Seiji Karashima , Susumu Sawada , Kenichi Hotehama
IPC分类号： H01L23/488 , H05K3/30 , H05K1/02 , H01L21/56
CPC分类号： H05K3/3484 , B23K1/0016 , B23K2101/40 , B23K2103/10 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11522 , H01L2224/1181 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/293 , H01L2224/8101 , H01L2224/81801 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/323 , H05K2201/0209 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y10T29/49144 , H01L2224/05599
摘要： In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecter, and the solder connecter contains solder and insulation filler. Alternatively, a solder bump is formed on the electrode of the electronic component, and the solder bump includes the insulation filler.
摘要翻译：在电子部件安装体中，第一电子部件的电极和第二电子部件的电极通过焊料连接器电连接，焊料连接器包含焊料和绝缘填料。或者，在电子部件的电极上形成焊料凸块，焊料凸块包括绝缘填料。

7. 发明授权

US07919357B2 Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates 有权
标题翻译：相互连接基板，倒装芯片安装体和基板之间的相互连接结构的方法
公开(公告)号：US07919357B2
公开(公告)日：2011-04-05
申请号：US12489895
申请日：2009-06-23
申请人： Susumu Sawada , Seiichi Nakatani , Seiji Karashima , Takashi Kitae
发明人： Susumu Sawada , Seiichi Nakatani , Seiji Karashima , Takashi Kitae
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , H01L23/3121 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/06515 , H01L2224/10165 , H01L2224/10175 , H01L2224/11015 , H01L2224/11522 , H01L2224/13099 , H01L2224/14515 , H01L2224/1601 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/812 , H01L2224/81801 , H01L2224/8314 , H01L2224/83855 , H01L2224/83886 , H01L2224/83951 , H01L2224/9201 , H01L2224/9212 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H05K3/323 , H05K2201/09909 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , H05K2203/1147 , H05K2203/1178 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent.
摘要翻译：在第一基板和第二基板之间提供含有导电粒子和气泡生成剂的树脂，然后将树脂加热，从树脂中包含的气泡生成剂产生气泡，使树脂自组装电极之间。然后，进一步加热树脂以熔化包含在树脂中的导电颗粒，从而在电极之间形成连接器。在树脂的周边部附近设置密封基板之间的间隔的分隔部件，树脂中的气泡通过不存在分隔部件的树脂的周边部排出到外部。

8. 发明授权

US5456815A Sputtering targets of high-purity aluminum or alloy thereof 失效
标题翻译：高纯度铝或其合金的溅射靶
公开(公告)号：US5456815A
公开(公告)日：1995-10-10
申请号：US364073
申请日：1994-12-27
申请人： Hideaki Fukuyo , Susumu Sawada , Masaru Nagasawa
发明人： Hideaki Fukuyo , Susumu Sawada , Masaru Nagasawa
IPC分类号： C23C14/34
CPC分类号： C23C14/3414
摘要： A sputtering target of a high-purity Al or Al alloy having (1) a target crystal structure as a recrystallization structure and average grain diameters in various portions of 500 .mu.m or less, with dispersions within .+-.15%, and (2) a {200} crystalline orientation content ratio on the sputtering surface of at least 0.35 in various portions of the target, with dispersions within .+-.15%, said {200} crystalline orientation content ratio being defined by the following formula: ##EQU1## where I.sub.{200}, I.sub.{111}, I.sub.{220} and I.sub.{311} are peak strengths for (200), (111), (220) and (311) crystal planes, respectively, as obtained X-ray diffraction method. Simultaneous realization of (1)+(2) is desirable. For these purposes, uniform warm or cold working to a desired final geometry below the recrystallization temperature must be followed by uniform heat treatment throughout the target at the recrystallization temperature of the material to finish the recrystallization.
摘要翻译：一种高纯度Al或Al合金的溅射靶，其具有（1）作为再结晶结构的靶晶体结构，各种部分的平均粒径为500μm以下，分散在±15％以内，（2 ）在溅射表面上的{200}晶体取向含量比在靶的各个部分中至少为0.35，分散体在+/- 15％内，所述{200}结晶取向含量比由下式定义：其中I {200}，I {111}，I {220}和I {311}分别是（200），（111），（220）和（311）晶面的峰值强度，如X射线衍射法。同时实现（1）+（2）是可取的。为了这些目的，在再结晶温度以下的期望最终几何形状的均匀加热或冷加工必须在材料的再结晶温度下在整个靶材上进行均匀的热处理，以完成重结晶。

9. 发明授权

US08097958B2 Flip chip connection structure having powder-like conductive substance and method of producing the same 有权
标题翻译：具有粉末状导电物质的倒装芯片连接结构体及其制造方法
公开(公告)号：US08097958B2
公开(公告)日：2012-01-17
申请号：US12298464
申请日：2007-04-18
申请人： Susumu Sawada , Seiichi Nakatani , Seiji Karashima , Takashi Kitae
发明人： Susumu Sawada , Seiichi Nakatani , Seiji Karashima , Takashi Kitae
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/323 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/31 , H01L24/81 , H01L24/83 , H01L2224/13099 , H01L2224/16225 , H01L2224/16501 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29347 , H01L2224/81193 , H01L2224/81801 , H01L2224/8192 , H01L2224/83192 , H01L2224/83851 , H01L2224/83855 , H01L2224/83886 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1579 , H01L2924/351 , H05K3/3436 , H05K3/3484 , H05K3/361 , H05K3/363 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2224/29311 , H01L2924/00014 , H01L2924/00015
摘要： A connection structure (package 10) has a first plate body 101 and a second plate body; in the first plate body 101, a wiring pattern having a plurality of connection terminals 102 is formed, and the second plate body has at least two connection terminals (electrode terminals 104) arranged facing the connection terminals of the first plate body 101. The connection terminals of the first and second plate bodies are connection terminals formed as projections on the surfaces of the first and second plate bodies. A conductive substance 108 is accumulated to cover at least a part of each side face of the connection terminals opposed to each other of the first and second plate bodies, and the connection terminals thus opposed are connected to each other via the conductive substance. The package thus formed is ready for a high-pin-count, narrow-pitch configuration of a next-generation semiconductor chip, and exhibits excellent productivity and reliability. The present invention is advantageous for such a package, for a connection structure applicable to the production of the package, and for a method of producing the connection structure.
摘要翻译：连接结构（封装10）具有第一板体101和第二板体; 在第一板体101中，形成具有多个连接端子102的布线图案，第二板体具有面对第一板体101的连接端子配置的至少两个连接端子（电极端子104）。连接第一和第二板体的端子是在第一和第二板体的表面上形成为突起的连接端子。聚集导电物质108以覆盖第一和第二板体彼此相对的连接端子的每个侧面的至少一部分，并且由此相对的连接端子经由导电物质彼此连接。这样形成的封装准备好用于下一代半导体芯片的高引脚数，窄间距配置，并且表现出优异的生产率和可靠性。本发明对于这种包装，对于适用于包装的生产的连接结构以及制造连接结构的方法是有利的。

10. 发明申请

US20090078746A1 BUMP FORMING METHOD AND BUMP FORMING APPARATUS 有权
标题翻译： BUMP形成方法和BUMP形成装置
公开(公告)号：US20090078746A1
公开(公告)日：2009-03-26
申请号：US12282774
申请日：2007-02-22
申请人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
发明人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
IPC分类号： B23K1/20 , B23K3/00
CPC分类号： H05K3/3484 , H01L24/11 , H01L2224/11522 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01055 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H05K2203/0425 , H05K2203/083 , H05K2203/087 , H01L2924/00
摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
摘要翻译：在布线板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡生成剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。

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