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    • 2. 发明授权
    • Memory device
    • 内存设备
    • US08947920B2
    • 2015-02-03
    • US14018148
    • 2013-09-04
    • Masahiro TakahashiTsuneo InabaDong Keun KimJi Wang Lee
    • Masahiro TakahashiTsuneo InabaDong Keun KimJi Wang Lee
    • G11C11/00G11C11/16
    • G11C11/1673G11C11/161G11C11/1659
    • According to one embodiment, a memory device includes a memory cell, a sense amplifier, unit structures and a reference signal generator. Each structure includes a first end, a first transistor, a first local line, a variable resistance element, a second transistor, a second local line, and a third transistor coupled in series. The reference signal generator includes first to fourth global lines, and first and second ones of the unit structures. The first unit structure is coupled at the first end to the first global line and coupled at the second end to the third global line. The second unit structure is coupled at the first end to the fourth global line and coupled at the second end to the second global line.
    • 根据一个实施例,存储器件包括存储器单元,读出放大器,单元结构和参考信号发生器。 每个结构包括第一端,第一晶体管,第一局部线,可变电阻元件,第二晶体管,第二本地线和串联耦合的第三晶体管。 参考信号发生器包括第一至第四全局线,以及第一和第二单元结构。 第一单元结构在第一端耦合到第一全局线并且在第二端耦合到第三全局线。 第二单元结构在第一端耦合到第四全局线并且在第二端耦合到第二全局线。
    • 7. 发明授权
    • NAND type flash memory
    • NAND型闪存
    • US08274826B2
    • 2012-09-25
    • US12838867
    • 2010-07-19
    • Toshifumi HashimotoNoboru ShibataToshiki HisadaTsuneo Inaba
    • Toshifumi HashimotoNoboru ShibataToshiki HisadaTsuneo Inaba
    • G11C16/04
    • G11C16/06
    • According to one embodiment, a NAND type flash memory includes a first transfer transistor disposed between first and second memory planes, the first potential transfer terminal of the first transfer transistor being commonly connected to a first word line in the first NAND block and a second word line in the third NAND block, a second transfer transistor disposed at a first end of the first memory plane, the first potential transfer terminal of the second transfer transistor being connected to a third word line in the second NAND block, and a third transfer transistor disposed at a second end of the second memory plane, the first potential transfer terminal of the third transfer transistor being connected to a fourth word line in the fourth NAND block.
    • 根据一个实施例,NAND型闪速存储器包括设置在第一和第二存储器平面之间的第一传输晶体管,第一传输晶体管的第一电位传输端共同连接到第一NAND块中的第一字线,第二字 配置在第三NAND块中的第二转移晶体管,设置在第一存储器平面的第一端的第二转移晶体管,第二转移晶体管的第一电位转移端连接到第二NAND块中的第三字线,以及第三转移晶体管 设置在第二存储器平面的第二端,第三传输晶体管的第一电位传输端连接到第四NAND块中的第四字线。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100237321A1
    • 2010-09-23
    • US12793172
    • 2010-06-03
    • Tsuneo Inaba
    • Tsuneo Inaba
    • H01L27/24H01L27/11
    • H01L27/228B82Y10/00G11C11/1659G11C13/0004G11C13/0023G11C2213/79H01L27/24
    • A semiconductor memory device includes the first transistor having first and second source/drain diffusion regions positioned below a second bit line to sandwich the first word line therebetween, and the second source/drain diffusion region positioned between the first and second word lines and connected to a first bit line, a second transistor having second and third source/drain diffusion regions positioned below the second bit line to sandwich the second word line therebetween, a first resistive memory element formed below the second bit line above the first source/drain diffusion region, and having terminals connected to the second bit line and the first source/drain diffusion region, and a second resistive memory element formed below the second bit line above the third source/drain diffusion region, and having terminals connected to the second bit line and the third source/drain diffusion region.
    • 半导体存储器件包括第一晶体管,其具有位于第二位线下方的第一和第二源极/漏极扩散区,以将第一字线夹在其间,第二源/漏扩散区位于第一和第二字线之间并连接到 第一位线,具有位于第二位线下方以将第二字线夹在其间的第二和第三源极/漏极扩散区的第二晶体管,形成在第一源极/漏极扩散区域之上的第二位线下方的第一电阻性存储元件 并且具有连接到第二位线和第一源极/漏极扩散区域的端子,以及形成在第三源极/漏极扩散区域之上的第二位线下方的第二电阻性存储元件,并且具有连接到第二位线的端子和 第三源极/漏极扩散区域。
    • 10. 发明申请
    • NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE
    • 非挥发性半导体存储器件
    • US20100232224A1
    • 2010-09-16
    • US12721001
    • 2010-03-10
    • Takashi MAEDATsuneo Inaba
    • Takashi MAEDATsuneo Inaba
    • G11C16/04
    • G11C16/26G11C16/0483H01L27/11573H01L27/11578H01L27/11582
    • A memory cell array has plural memory strings arranged therein, each of which including a plurality of electrically-rewritable memory transistors and selection transistors. Each memory string includes a body semiconductor layer including four or more columnar portions, and a joining portion formed to join the lower ends thereof. An electric charge storage layer is formed to surround a side surface of the columnar portions. A first conductive layer is formed to surround a side surface of the columnar portions as well as the electric charge storage layer. A plurality of second conductive layers are formed on side surfaces of the joining portion via an insulation film, and function as control electrodes of a plurality of back-gate transistors formed at a respective one of the joining portions.
    • 存储单元阵列具有布置在其中的多个存储器串,每个存储单元包括多个电可重写存储晶体管和选择晶体管。 每个存储器串包括包括四个或更多个柱状部分的主体半导体层和形成为连接其下端的接合部分。 形成电荷存储层以包围柱状部分的侧表面。 形成第一导电层以包围柱状部分的侧表面以及电荷存储层。 多个第二导电层经由绝缘膜形成在接合部分的侧表面上,并且用作形成在相应一个接合部分的多个后栅极晶体管的控制电极。