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1. 发明申请

US20120044399A1 IMAGING APPARATUS, METHOD OF CONTROLLING IMAGING APPARATUS, AND PROGRAM 有权
标题翻译：成像装置，控制成像装置的方法和程序
公开(公告)号：US20120044399A1
公开(公告)日：2012-02-23
申请号：US13170832
申请日：2011-06-28
申请人： Akira HIRAI , Akira Fukuda , Takuya Higuchi , Satoshi Takada , Tsuyoshi Harata
发明人： Akira HIRAI , Akira Fukuda , Takuya Higuchi , Satoshi Takada , Tsuyoshi Harata
IPC分类号： H04N5/222
CPC分类号： H04N5/23293 , H04N5/23245 , H04N5/345 , H04N5/772
摘要： An apparatus includes: an element that receives subject light from a subject to generate image data; a section that generates a recording image to be recorded on a recording medium from the image data when a first mode is set; a section that generates a second display image, which allows display of a live-view image, from the image data when a second mode is set, and that generates a first display image, which allows display of an image identical to the recording image, from the image data when the first mode is set; a section that sequentially displays the first display image or the second display image; a section that detects a specific state of the apparatus that obstructs recording of an imaging object onto the recording image; and a section that controls switching between the first mode and the second mode on the basis of the detection results.
摘要翻译：一种装置包括：从对象接收被摄体光以产生图像数据的元件; 当设置第一模式时，从图像数据生成要记录在记录介质上的记录图像的部分; 当设置第二模式时，从图像数据生成允许显示实时取景图像的第二显示图像的部分，并且生成允许显示与记录图像相同的图像的第一显示图像，当设置第一模式时，从图像数据; 依次显示第一显示图像或第二显示图像的部分; 检测装置的特定状态，该装置阻碍成像对象记录到记录图像上; 以及基于检测结果控制第一模式和第二模式之间的切换的部分。

2. 发明授权

US08675110B2 Imaging apparatus, method of controlling imaging apparatus, and program for continuous image capturing 有权
标题翻译：成像设备，成像设备的控制方法和用于连续图像捕获的程序
公开(公告)号：US08675110B2
公开(公告)日：2014-03-18
申请号：US13170832
申请日：2011-06-28
申请人： Akira Hirai , Akira Fukuda , Takuya Higuchi , Satoshi Takada , Tsuyoshi Harata
发明人： Akira Hirai , Akira Fukuda , Takuya Higuchi , Satoshi Takada , Tsuyoshi Harata
IPC分类号： H04N5/222
CPC分类号： H04N5/23293 , H04N5/23245 , H04N5/345 , H04N5/772
摘要： An apparatus includes: an element that receives subject light from a subject to generate image data; a section that generates a recording image to be recorded on a recording medium from the image data when a first mode is set; a section that generates a second display image, which allows display of a live-view image, from the image data when a second mode is set, and that generates a first display image, which allows display of an image identical to the recording image, from the image data when the first mode is set; a section that sequentially displays the first display image or the second display image; a section that detects a specific state of the apparatus that obstructs recording of an imaging object onto the recording image; and a section that controls switching between the first mode and the second mode on the basis of the detection results.
摘要翻译：一种装置包括：从对象接收被摄体光以产生图像数据的元件; 当设置第一模式时，从图像数据生成要记录在记录介质上的记录图像的部分; 当设置第二模式时，从图像数据生成允许显示实时取景图像的第二显示图像的部分，并且生成允许显示与记录图像相同的图像的第一显示图像，当设置第一模式时，从图像数据; 依次显示第一显示图像或第二显示图像的部分; 检测装置的特定状态，该装置阻碍成像对象记录到记录图像上; 以及基于检测结果控制第一模式和第二模式之间的切换的部分。

3. 发明申请

US20100081361A1 DRESSING METHOD, METHOD OF DETERMINING DRESSING CONDITIONS, PROGRAM FOR DETERMINING DRESSING CONDITIONS, AND POLISHING APPARATUS 有权
标题翻译：连接方法，确定条件条件的方法，确定条件的程序和抛光装置
公开(公告)号：US20100081361A1
公开(公告)日：2010-04-01
申请号：US12566224
申请日：2009-09-24
申请人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
发明人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
IPC分类号： B24B53/02 , B24B1/00 , B24B53/12
CPC分类号： B24B53/017
摘要： A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
摘要翻译：提供了一种用金刚石修整器修整抛光构件的方法，其具有布置在其表面上的金刚石颗粒。该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布进行模拟来确定修整条件，以及在确定的修整条件下用金刚石修整器修整抛光构件。模拟包括根据推入抛光构件的金刚石颗粒的深度校正的滑动距离的计算。

4. 发明申请

US20090239446A1 Polishing Apparatus and Polishing Method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20090239446A1
公开(公告)日：2009-09-24
申请号：US11884746
申请日：2005-08-30
申请人： Akira Fukuda , Yoshihiro Mochizuki , Kazuto Hirokawa
发明人： Akira Fukuda , Yoshihiro Mochizuki , Kazuto Hirokawa
IPC分类号： B24B49/00 , B24B1/00 , B24B49/08 , B24B49/16 , B24D11/00 , B24B37/04
CPC分类号： B24B37/005
摘要： A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) 201 and the wafer W held by a holding member (top ring) 52 and relatively moving the polishing member 201 to the wafer W. The polishing apparatus comprises a top ring 52 for holding the wafer W, a pressure adjusting mechanism 206 for adjusting a supporting pressure with which the wafer W is supported on a supporting surface by a retainer ring 203, and a control unit 208 for controlling the pressure adjusting mechanism 206 to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer W. The top ring 52 comprises an air bag 202 for pressing the wafer W against the polishing pad 201, a retainer ring 203 which surrounds the wafer W, and an air bag 204 for pressing the retainer ring 203.
摘要翻译：提供抛光装置用于以高屈服率抛光晶片，即使存在滚降。抛光装置通过在抛光构件（抛光垫）201和由保持构件（顶环））52保持的晶片W之间施加压力并将抛光构件201相对移动到晶片W来对晶片W进行抛光。抛光装置包括用于保持晶片W的顶环52，用于调节通过保持环203将晶片W支撑在支撑表面上的支撑压力的压力调节机构206以及用于将压力调节机构206控制到基于晶片W的滚降量将支撑压力提高到期望的压力。顶环52包括用于将晶片W压靠在抛光垫201上的气囊202，围绕晶片W的保持环203和用于按压保持环203的气囊204。

5. 发明申请

US20080211931A1 IMAGE-CAPTURING APPARATUS AND IMAGE PROCESSING METHOD 有权
标题翻译：图像捕获设备和图像处理方法
公开(公告)号：US20080211931A1
公开(公告)日：2008-09-04
申请号：US12026026
申请日：2008-02-05
申请人： Toshiki FUJISAWA , Toru Shiono , Hitoshi Yano , Shinichi Maehama , Akira Fukuda , Shinya Nara
发明人： Toshiki FUJISAWA , Toru Shiono , Hitoshi Yano , Shinichi Maehama , Akira Fukuda , Shinya Nara
IPC分类号： H04N5/76 , H04N9/77
CPC分类号： H04N5/232 , H04N5/23245 , H04N5/765 , H04N5/772 , H04N5/907 , H04N9/8047 , H04N9/8205 , H04N9/8227 , H04N2101/00
摘要： An image-capturing apparatus includes an image-capturing unit configured to sequentially output image data in a RAW format related to each of captured images as a result of a continuous series of image capturing operations; a signal processor configured to perform a predetermined process on the image data in a RAW format and output processed image data; image processing circuits configured to perform a luminance/color-difference conversion process and a data compression process on the processed image data and output compressed image data; and a recording controller configured to cause compressed image data output from the image processing circuits to be recorded in a predetermined recorder. The signal processor includes a selection output unit configured to selectively output the processed image data related to each of the captured images to the image processing circuits and cause the image processing related to each captured image to be shared by the image processing circuits.
摘要翻译：图像捕获装置包括：图像拍摄单元，被配置为作为连续的图像捕获操作的结果，顺序地输出与每个拍摄图像相关的RAW格式的图像数据; 信号处理器，被配置为以RAW格式对所述图像数据执行预定处理，并输出处理后的图像数据; 图像处理电路，被配置为对所处理的图像数据执行亮度/色差转换处理和数据压缩处理，并输出压缩图像数据; 以及记录控制器，被配置为使得从图像处理电路输出的压缩图像数据被记录在预定记录器中。信号处理器包括选择输出单元，其被配置为向图像处理电路选择性地输出与每个拍摄图像相关的处理后的图像数据，并且使得与每个拍摄图像相关的图像处理由图像处理电路共享。

6. 发明授权

US4828451A Industrial robot 失效
标题翻译：工业机器人
公开(公告)号：US4828451A
公开(公告)日：1989-05-09
申请号：US81744
申请日：1987-08-05
申请人： Tadafumi Mikoshi , Hitoshi Oka , Akira Fukuda
发明人： Tadafumi Mikoshi , Hitoshi Oka , Akira Fukuda
IPC分类号： B25J9/04 , B25J9/06 , B25J9/10 , B25J9/16 , B25J17/02 , B25J19/00 , G05B19/18
CPC分类号： G05B19/182 , B25J17/0258 , B25J19/0008 , B25J9/046 , B25J9/06 , B25J9/1035 , B25J9/1666 , B25J9/1676 , G05B2219/39364 , G05B2219/40362
摘要： An industrial robot provided with at least six joints and adapted to have at least six degrees of freedom, wherein rotational joints rotatable around axes extending lengthwise of the arm and bending joints swingable around perpendicular axes extending perpendicularly to the lengthwise direction of the arm, thereby enabling the position and attitude control for a wrist at the arm and the obstacle avoiding control to change height of an elbow portion at the arm so as to avoid the obstacle.
摘要翻译：一种具有至少六个接头并适于具有至少六个自由度的工业机器人，其中旋转接头可围绕臂纵向延伸的轴线旋转，并且弯曲接头围绕垂直于臂的纵向方向延伸的垂直轴线摆动，从而使能在手臂处的手腕的位置和姿态控制以及障碍物避免控制以改变手臂处的肘部的高度，以避免障碍。

7. 发明授权

US11274446B2 Screw-type rebar joint structure of deformed rebar and manufacturing method thereof 有权
公开(公告)号：US11274446B2
公开(公告)日：2022-03-15
申请号：US16279390
申请日：2019-02-19
申请人： Akira Fukuda
发明人： Kozo Wakiyama , Keiji Hirai , Akira Fukuda
IPC分类号： E04C5/16 , E04C5/03 , E04C5/01 , B21H3/02 , B21F15/06
摘要： A threaded reinforcing bar coupling structure comprises a pair of reinforcing bars and a tubular coupler connecting the pair of reinforcing bars. Each of the reinforcing bars is a deformed reinforcing bar having spiral node portions on an outer periphery of a reinforcing bar main body having a round shaft shape. A cylindrical portion with node portions removed is formed on an end portion of the reinforcing bar, and a male threaded portion is formed on the cylindrical portion. The male threaded portion has hardness or tensile strength greater than that of a remaining portion of the reinforcing bar. The pair of reinforcing bars is connected by the screw tubular coupler that is screwed onto the male threaded portions.

8. 发明授权

US07976358B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07976358B2
公开(公告)日：2011-07-12
申请号：US12613044
申请日：2009-11-05
申请人： Akira Fukuda , Yoshihiro Mochizuki , Kazuto Hirokawa
发明人： Akira Fukuda , Yoshihiro Mochizuki , Kazuto Hirokawa
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/005
摘要： A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and the wafer held by a holding member (top ring) and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
摘要翻译：即使存在滚降，抛光装置以高屈服率抛光晶片。抛光装置通过在抛光构件（抛光垫）和由保持构件（顶环）保持的晶片之间施加压力并且相对于晶片移动抛光构件来抛光晶片。抛光装置包括用于保持晶片的顶环，用于调节通过保持环将晶片支撑在支撑表面上的支撑压力的压力调节机构，以及用于控制压力调节机构以使支撑基于晶片的滚降量将压力压到所需的压力。顶环包括用于将晶片压靠在抛光垫上的气囊，围绕晶片的保持环和用于按压保持环的气囊。

9. 发明申请

US20080176008A1 Apparatus and method for forming magnetic film 审中-公开
标题翻译：用于形成磁性膜的设备和方法
公开(公告)号：US20080176008A1
公开(公告)日：2008-07-24
申请号：US12010181
申请日：2008-01-22
申请人： Xinming Wang , Akira Owatari , Takashi Koba , Tsutomu Nakada , Akira Fukuda
发明人： Xinming Wang , Akira Owatari , Takashi Koba , Tsutomu Nakada , Akira Fukuda
IPC分类号： H01F10/08
CPC分类号： H01F41/24 , C23C18/161 , C23C18/1673 , C23C18/1879 , C23C18/36
摘要： A magnetic film forming apparatus can form a magnetic film, especially a magnetic alloy film, selectively on a metal surface exposed on a surface of a substrate, such as a semiconductor wafer. The magnetic film forming apparatus comprises an electroless plating apparatus having a magnetic field generation apparatus for generating a magnetic field around and parallel to a substrate disposed such that the surface of the substrate is in contact with a plating solution in a plating tank.
摘要翻译：磁性膜形成装置可以在暴露在诸如半导体晶片的基板的表面上的金属表面上选择性地形成磁性膜，特别是磁性合金膜。磁性膜形成装置包括具有磁场产生装置的化学镀设备，用于产生围绕并平行于基板的磁场，该基板设置成使得基板的表面与电镀槽中的镀液接触。

10. 发明申请

US20070232203A1 Polishing method and polishing apparatus 审中-公开
标题翻译：抛光方法和抛光装置
公开(公告)号：US20070232203A1
公开(公告)日：2007-10-04
申请号：US11730141
申请日：2007-03-29
申请人： Akira Fukuda , Hirokuni Hiyama , Manabu Tsujimura
发明人： Akira Fukuda , Hirokuni Hiyama , Manabu Tsujimura
IPC分类号： B24B1/00
CPC分类号： B24B53/017 , B08B1/04 , B08B3/02 , H01L21/67219
摘要： A polishing method can prevent scratches in a polished surface of a polishing object, caused by foreign matter adhering to a surface of a polishing member, thus preventing the attendant lowering of the yield even when the polishing object is large-sized. The polishing method includes: specifying a foreign matter adhesion position or a foreign matter adhesion area in a surface of the polishing member; and intensively cleaning the foreign matter adhesion position or the foreign matter adhesion area in the surface of the polishing member.
摘要翻译：抛光方法可以防止抛光对象的抛光表面由于抛光构件的表面附着的异物引起的划痕，从而即使在抛光对象大的情况下也能防止随之降低的成品率。抛光方法包括：指定抛光构件的表面中的异物粘附位置或异物粘附区域; 并且强烈地清洗抛光部件的表面中的异物附着位置或异物粘附区域。

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