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1. 发明申请

US20100081361A1 DRESSING METHOD, METHOD OF DETERMINING DRESSING CONDITIONS, PROGRAM FOR DETERMINING DRESSING CONDITIONS, AND POLISHING APPARATUS 有权
标题翻译：连接方法，确定条件条件的方法，确定条件的程序和抛光装置
公开(公告)号：US20100081361A1
公开(公告)日：2010-04-01
申请号：US12566224
申请日：2009-09-24
申请人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
发明人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
IPC分类号： B24B53/02 , B24B1/00 , B24B53/12
CPC分类号： B24B53/017
摘要： A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
摘要翻译：提供了一种用金刚石修整器修整抛光构件的方法，其具有布置在其表面上的金刚石颗粒。该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布进行模拟来确定修整条件，以及在确定的修整条件下用金刚石修整器修整抛光构件。模拟包括根据推入抛光构件的金刚石颗粒的深度校正的滑动距离的计算。

2. 发明授权

US08655478B2 Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus 有权
标题翻译：敷料方法，确定敷料条件的方法，确定敷料条件的程序和抛光装置
公开(公告)号：US08655478B2
公开(公告)日：2014-02-18
申请号：US12566224
申请日：2009-09-24
申请人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
发明人： Akira Fukuda , Yoshihiro Mochizuki , Yutaka Wada , Yoichi Shiokawa , Hirokuni Hiyama
IPC分类号： G06F19/00 , G05B11/01 , G05B19/18 , B24B49/00 , B24B1/00 , G01D1/00
CPC分类号： B24B53/017
摘要： A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
摘要翻译：一种方法用抛光件与金刚石修整器连接，金刚石修整器具有布置在其表面上的金刚石颗粒。该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布的模拟进行模拟，以及在确定的修整条件下用金刚石修整器修整抛光构件来确定修整条件。模拟包括计算根据推入抛光构件的金刚石颗粒的深度校正的滑动距离。

3. 发明授权

US08845391B2 Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus 有权
标题翻译：基板研磨装置，基板研磨方法以及调整抛光装置所使用的抛光垫的研磨面温度的装置
公开(公告)号：US08845391B2
公开(公告)日：2014-09-30
申请号：US12974123
申请日：2010-12-21
申请人： Tadakazu Sone , Yasuyuki Motoshima , Toru Maruyama , Katsutoshi Ono , Yoichi Shiokawa
发明人： Tadakazu Sone , Yasuyuki Motoshima , Toru Maruyama , Katsutoshi Ono , Yoichi Shiokawa
IPC分类号： B24B1/00 , B24B55/02 , B24B37/015 , B24B37/34 , B24B37/10
CPC分类号： B24B37/015 , B24B37/042 , B24B37/10 , B24B37/34 , B24B55/02
摘要： An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
摘要翻译：用于抛光基板的装置包括：支撑抛光垫的可旋转的抛光台;衬底保持器，其构造成保持基板，并将基板压靠在旋转的抛光台上的抛光垫的抛光表面上，以便抛光基板;以及衬垫温度检测器，被配置为测量抛光垫的抛光表面的温度。该装置还包括：衬垫温度调节器，其被配置为接触抛光表面以调节抛光表面的温度;以及温度控制器，其被配置为通过基于关于温度的信息控制焊盘温度调节器来控制抛光表面的温度由焊盘温度检测器检测到的抛光表面。

4. 发明授权

US08360817B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08360817B2
公开(公告)日：2013-01-29
申请号：US12730409
申请日：2010-03-24
申请人： Yu Ishii , Yoichi Shiokawa , Jyoji Heianna , Hisanori Matsuo
发明人： Yu Ishii , Yoichi Shiokawa , Jyoji Heianna , Hisanori Matsuo
IPC分类号： B24B1/00
CPC分类号： B24B57/02 , B24B37/04 , B24B49/00
摘要： A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.
摘要翻译：抛光装置可以对抛光轮廓进行更精确的控制，而无需事先进行许多抛光测试。抛光装置包括：具有抛光表面52a的抛光台22; 用于保持抛光对象W并将抛光对象W压靠在抛光表面52a上的顶环24; 用于将抛光液供给到研磨面52a的研磨液供给喷嘴26; 移动机构70，其用于使抛光液供给喷嘴26的研磨液供给位置26a大致沿研磨面52a的径向移动; 用于控制移动机构70的控制器66; 以及用于预测抛光液供给喷嘴26的研磨液供给位置26a与抛光轮廓之间的关系的模拟器72，进行模拟，并向控制器66输出数据。

5. 发明申请

US20100255756A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20100255756A1
公开(公告)日：2010-10-07
申请号：US12730409
申请日：2010-03-24
申请人： Yu ISHII , Yoichi Shiokawa , Jyoji Heianna , Hisanori Matsuo
发明人： Yu ISHII , Yoichi Shiokawa , Jyoji Heianna , Hisanori Matsuo
IPC分类号： B24B49/00 , B24B1/00
CPC分类号： B24B57/02 , B24B37/04 , B24B49/00
摘要： A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.
摘要翻译：抛光装置可以对抛光轮廓进行更精确的控制，而无需事先进行许多抛光测试。抛光装置包括：具有抛光表面52a的抛光台22; 用于保持抛光对象W并将抛光对象W压靠在抛光表面52a上的顶环24; 用于将抛光液供给到研磨面52a的研磨液供给喷嘴26; 移动机构70，其用于使抛光液供给喷嘴26的研磨液供给位置26a大致沿研磨面52a的径向移动; 用于控制移动机构70的控制器66; 以及用于预测抛光液供给喷嘴26的研磨液供给位置26a与抛光轮廓之间的关系的模拟器72，进行模拟，并向控制器66输出数据。

6. 发明授权

US4059902A Tray for preparing a dentiform model used for an operation on a dental technic 失效
标题翻译：用于准备用于牙科技术操作的牙齿模型的托盘
公开(公告)号：US4059902A
公开(公告)日：1977-11-29
申请号：US683457
申请日：1976-05-05
申请人： Yoichi Shiokawa
发明人： Yoichi Shiokawa
IPC分类号： A61C13/34 , A61C9/00 , A61C13/22
CPC分类号： A61C9/002
摘要： A tray for preparing a dental model which includes an arcuate channel formed in a body and simulating the curvature of a row of teeth. A wedge shaped notch is provided in the channel for assisting removal of a hard body cast in the channel, and the notch is adapted to be filled with a soft substance prior to filling of the channel with a material which will set to form the hard body.
摘要翻译：一种用于制备牙科模型的托盘，其包括形成在体内的弓形通道并模拟一排齿的曲率。在通道中设置有楔形凹口，用于帮助去除在通道中铸造的硬质体，并且在将凹槽填充到通道之前，该凹口适于填充柔性物质，该材料将被设置成形成硬质体。

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