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1. 发明申请

US20060278611A1 Method and device for flattening surface of solid 有权
标题翻译：固体表面平整的方法和装置
公开(公告)号：US20060278611A1
公开(公告)日：2006-12-14
申请号：US10573942
申请日：2004-09-29
申请人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
发明人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
IPC分类号： C23F1/00 , C03C15/00
CPC分类号： H01J37/3244 , C23F4/00 , H01J37/08 , H01J37/3053 , H01J2237/0812 , H01J2237/3151
摘要： In a method of irradiating a gas cluster ion beam on a solid surface and smoothing the solid surface, the angle formed between the solid surface and the gas cluster ion beam is chosen to be between 1° and an angle less than 30°. In case the solid surface is relatively rough, the processing efficiency is raised by first irradiating a beam at an irradiation angle θ chosen to be something like 90° as a first step, and subsequently at an irradiation angle θ chosen to be 1° to less than 30° as a second step. Alternatively, the set of the aforementioned first step and second step is repeated several times.
摘要翻译：在固体表面上照射气体团簇离子束并平滑固体表面的方法中，将固体表面和气体团簇离子束之间形成的角度选择在1°和小于30°的角度之间。在固体表面相对粗糙的情况下，通过首先以选择为90°的照射角度θ照射光束来提高加工效率，作为第一步骤，然后以选择为1°以下的照射角度θ 超过30°作为第二步。或者，将上述第一步骤和第二步骤的组合重复多次。

2. 发明申请

US20100096263A1 Solid surface smoothing apparatus 审中-公开
标题翻译：固体表面平滑装置
公开(公告)号：US20100096263A1
公开(公告)日：2010-04-22
申请号：US12642633
申请日：2009-12-18
申请人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
发明人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
IPC分类号： C23C14/34
CPC分类号： H01J37/08 , C23F4/00 , H01J2237/0812 , H01J2237/3151 , H01L21/302 , H01L21/3105 , H01L21/321
摘要： In a method of irradiating a gas cluster ion beam on a solid surface and smoothing the solid surface, the angle formed between the solid surface and the gas cluster ion beam is chosen to be between 1° and an angle less than 30°. In case the solid surface is relatively rough, the processing efficiency is raised by first irradiating a beam at an irradiation angle θ chosen to be something like 90° as a first step, and subsequently at an irradiation angle θ chosen to be 1° to less than 30° as a second step. Alternatively, the set of the aforementioned first step and second step is repeated several times.
摘要翻译：在固体表面上照射气体团簇离子束并平滑固体表面的方法中，将固体表面和气体团簇离子束之间形成的角度选择在1°和小于30°的角度之间。在固体表面比较粗糙的情况下，通过首先以照射角照射光束来提高加工效率; 选择作为第一步的90°，随后在照射角度＆amp; 选择为1°至小于30°作为第二步。或者，将上述第一步骤和第二步骤的组合重复多次。

3. 发明授权

US07563379B2 Dry etching method and photonic crystal device fabricated by use of the same 有权
标题翻译：干蚀刻法和使用其制造的光子晶体器件
公开(公告)号：US07563379B2
公开(公告)日：2009-07-21
申请号：US11008606
申请日：2004-12-08
申请人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
发明人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
IPC分类号： H01L21/302
CPC分类号： B82Y20/00 , B81C1/00531 , B81C1/00619 , G02B6/1225 , G02B6/136 , H01J2237/0812 , H01L21/3065
摘要： In a dry etching method in which clusters formed by agglomeration of atoms or molecules are ionized and accelerated as a cluster ion beam for irradiation of an object surface to etch away therefrom its constituent atoms, the clusters are mixed clusters 42 formed by agglomeration of two or more kinds of atoms or molecules, and the mixed clusters 42 contain atoms 43 of at least one of argon, neon, xenon and krypton, and a component 44 that is deposited on the object surface to form a thin film by reaction therewith. With this method, it is possible to provide an extremely reduced sidewall surface roughness and high vertical machining accuracy.
摘要翻译：在干法蚀刻方法中，通过原子或分子的聚集形成的团簇被离子化并加速作为用于照射物体表面的簇离子束以从其中去除其组成原子，所述簇是通过两个或多个更多种类的原子或分子，并且混合簇42包含氩，氖，氙和氪中的至少一种的原子43和沉积在物体表面上以通过与其反应形成薄膜的成分44。通过这种方法，可以提供极小的侧壁表面粗糙度和高垂直加工精度。

4. 发明授权

US08764952B2 Method for smoothing a solid surface 有权
标题翻译：平滑固体表面的方法
公开(公告)号：US08764952B2
公开(公告)日：2014-07-01
申请号：US10573942
申请日：2004-09-29
申请人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
发明人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
IPC分类号： C23C14/00 , C23C14/32 , C25B9/00 , C25B11/00 , C25B13/00 , B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , A61N5/00 , G21G5/00 , G21K5/10 , H01J37/08 , C23C14/02 , H01L21/302 , H01L21/461
CPC分类号： H01J37/3244 , C23F4/00 , H01J37/08 , H01J37/3053 , H01J2237/0812 , H01J2237/3151
摘要： In a method of irradiating a gas cluster ion beam on a solid surface and smoothing the solid surface, the angle formed between the solid surface and the gas cluster ion beam is chosen to be between 1° and an angle less than 30°. In case the solid surface is relatively rough, the processing efficiency is raised by first irradiating a beam at an irradiation angle θ chosen to be something like 90° as a first step, and subsequently at an irradiation angle θ chosen to be 1° to less than 30° as a second step. Alternatively, the set of the aforementioned first step and second step is repeated several times.
摘要翻译：在固体表面上照射气体团簇离子束并平滑固体表面的方法中，将固体表面和气体团簇离子束之间形成的角度选择在1°和小于30°的角度之间。在固体表面比较粗糙的情况下，通过首先以照射角照射光束来提高加工效率; 选择作为第一步的90°，随后在照射角度＆amp; 选择为1°至小于30°作为第二步。或者，将上述第一步骤和第二步骤的组合重复多次。

5. 发明申请

US20050155951A1 Dry etching method and photonic crystal device fabricated by use of the same 有权
标题翻译：干蚀刻法和使用其制造的光子晶体器件
公开(公告)号：US20050155951A1
公开(公告)日：2005-07-21
申请号：US11008606
申请日：2004-12-08
申请人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
发明人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki , Takaaki Aoki
IPC分类号： H01L21/302 , B44C1/22 , G02B6/122 , G02B6/136 , H01L21/3065
CPC分类号： B82Y20/00 , B81C1/00531 , B81C1/00619 , G02B6/1225 , G02B6/136 , H01J2237/0812 , H01L21/3065
摘要： In a dry etching method in which clusters formed by agglomeration of atoms or molecules are ionized and accelerated as a cluster ion beam for irradiation of an object surface to etch away therefrom its constituent atoms, the clusters are mixed clusters 42 formed by agglomeration of two or more kinds of atoms or molecules, and the mixed clusters 42 contain atoms 43 of at least one of argon, neon, xenon and krypton, and a component 44 that is deposited on the object surface to form a thin film by reaction therewith. With this method, it is possible to provide an extremely reduced sidewall surface roughness and high vertical machining accuracy.
摘要翻译：在干法蚀刻方法中，通过原子或分子的聚集形成的团簇被离子化并加速作为用于照射物体表面的簇离子束以从其中去除其组成原子，所述簇是通过两个或多个更多种类的原子或分子，并且混合簇42包含氩，氖，氙和氪中的至少一种的原子43和沉积在物体表面上以通过与其反应形成薄膜的成分44。通过这种方法，可以提供极小的侧壁表面粗糙度和高垂直加工精度。

6. 发明申请

US20100207041A1 Method of Smoothing Solid Surface with Gas Cluster Ion Beam and Solid Surface Smoothing Apparatus 审中-公开
标题翻译：用气体簇离子束和固体表面平滑装置平滑固体表面的方法
公开(公告)号：US20100207041A1
公开(公告)日：2010-08-19
申请号：US12312265
申请日：2007-10-30
申请人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
发明人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
IPC分类号： H01J37/30
CPC分类号： C23F4/00 , H01J27/026 , H01J37/20 , H01J37/3053 , H01J37/317 , H01J2237/20207 , H01J2237/20214 , H01L21/3065
摘要： Scratches or similar surface roughness in a solid surface is reduced by gas cluster ion beam irradiation. A method of smoothing a solid surface with a gas cluster ion beam includes an irradiation step in which the solid surface is irradiated with a gas cluster ion beam, and the irradiation step includes a process of causing clusters from a plurality of directions to collide with at least an area (spot) irradiated with the gas cluster ion beam on the solid surface. Collision of the clusters from a plurality of directions with the spot is brought about by an irradiation of the gas cluster ion beam in which flight directions of the clusters diverge with respect to a center of the beam, for example.
摘要翻译：通过气体簇离子束照射减少了固体表面中的划痕或类似的表面粗糙度。利用气体簇离子束平滑固体表面的方法包括其中固体表面被气体团簇离子束照射的照射步骤，并且照射步骤包括使来自多个方向的团簇与至少在固体表面上用气体团簇离子束照射的面积（斑点）。例如，聚簇从多个方向与斑点的碰撞是通过其中簇的飞行方向相对于束的中心发散的气体团簇离子束的照射引起的。

7. 发明授权

US08481981B2 Method of smoothing solid surface with gas cluster ion beam and solid surface smoothing apparatus 有权
标题翻译：用气体团簇离子束和固体表面平滑装置平滑固体表面的方法
公开(公告)号：US08481981B2
公开(公告)日：2013-07-09
申请号：US12312203
申请日：2007-10-30
申请人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
发明人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
IPC分类号： G21K5/04
CPC分类号： H01L21/3065 , H01J2237/0812 , H01J2237/202 , H01J2237/3151
摘要： Surface roughness having intervals of several tens of nanometers to about a hundred micrometers in a solid surface is reduced by directing a gas cluster ion beam to the surface. An angle formed between the normal to the solid surface and the gas cluster ion beam is referred to as an irradiation angle, and an irradiation angle at which the distance of interaction between the solid and the cluster colliding with the solid dramatically increases is referred to as a critical angle. A solid surface smoothing method includes an irradiation step of directing the gas cluster ion beam onto the solid surface at an irradiation angle not smaller than the critical angle. The critical angle is 70°.
摘要翻译：通过将气体团簇离子束引导到表面，在固体表面中具有数十纳米至约百微米间隔的表面粗糙度被减小。被称为固体表面和气体团簇离子束的法线之间的角度被称为照射角度，并且固体和团簇与固体之间的相互作用距离急剧增加的照射角度被称为一个临界角。固体表面平滑化方法包括将气体团簇离子束以不小于临界角的照射角度引导到固体表面的照射步骤。临界角为70°。

8. 发明申请

US20090305507A1 Method of processing solid surface with gas cluster ion beam 有权
标题翻译：用气体簇离子束处理固体表面的方法
公开(公告)号：US20090305507A1
公开(公告)日：2009-12-10
申请号：US12312266
申请日：2007-10-30
申请人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
发明人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
IPC分类号： H01L21/308 , H01L21/302
CPC分类号： H01L21/3083 , H01J2237/0812 , H01L21/3065
摘要： A solid surface is processed while corner portions of a relief structure are protected from deformation. A method of processing a solid surface with a gas cluster ion beam includes a cluster protection layer formation step of forming, on the solid surface, a relief structure having protrusions with a cluster protection layer formed to cover an upper part thereof and recesses without the cluster protection layer; an irradiation step of emitting a gas cluster ion beam onto the solid surface having the relief structure formed in the cluster protection layer formation step; and a removal step of removing the cluster protection layer. A thickness T of the cluster protection layer satisfies T > nY + ( b 2  Y 2  n - nY 2  ( b 4 - 16  a 2 ) 1 2 2 ) 1 2 , where n is a dose of the gas cluster ion beam, and Y is an etching efficiency of the cluster protection layer, expressed as an etching volume per cluster (a and b are constants).
摘要翻译：处理浮雕结构的角部以防止变形的实心表面。用气体簇离子束处理固体表面的方法包括：簇保护层形成步骤，在固体表面上形成具有突起的浮雕结构，所述突起具有形成为覆盖其上部的簇保护层和没有簇的凹部保护层; 在所述簇保护层形成工序中形成有具有所述浮雕结构的固体表面上的气体簇离子束的照射工序; 以及去除簇保护层的去除步骤。簇保护层的厚度T满足T> nY +（b 2 y 2 n n n 2（b 4 - 16 a a 2）1 2 2）1 2，其中n是气体簇的剂量离子束，Y是簇保护层的蚀刻效率，表示为每簇的蚀刻体积（a和b是常数）。

9. 发明授权

US08268183B2 Method of processing solid surface with gas cluster ion beam 有权
标题翻译：用气体簇离子束处理固体表面的方法
公开(公告)号：US08268183B2
公开(公告)日：2012-09-18
申请号：US12312266
申请日：2007-10-30
申请人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
发明人： Akiko Suzuki , Akinobu Sato , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
IPC分类号： B44C1/22 , C23F1/00 , G21G5/00
CPC分类号： H01L21/3083 , H01J2237/0812 , H01L21/3065
摘要： A solid surface is processed while corner portions of a relief structure are protected from deformation. A method of processing a solid surface with a gas cluster ion beam includes a cluster protection layer formation step of forming, on the solid surface, a relief structure having protrusions with a cluster protection layer formed to cover an upper part thereof and recesses without the cluster protection layer; an irradiation step of emitting a gas cluster ion beam onto the solid surface having the relief structure formed in the cluster protection layer formation step; and a removal step of removing the cluster protection layer. A thickness T of the cluster protection layer satisfies T > nY + ( b 2 ⁢ Y 2 ⁢ n - nY 2 ⁡ ( b 4 - 16 ⁢ a 2 ) 1 2 2 ) 1 2 , where n is a dose of the gas cluster ion beam, and Y is an etching efficiency of the cluster protection layer, expressed as an etching volume per cluster (a and b are constants).
摘要翻译：处理浮雕结构的角部以防止变形的实心表面。用气体簇离子束处理固体表面的方法包括：簇保护层形成步骤，在固体表面上形成具有突起的浮雕结构，所述突起具有形成为覆盖其上部的簇保护层和没有簇的凹部保护层; 在所述簇保护层形成工序中形成有具有所述浮雕结构的固体表面上的气体簇离子束的照射工序; 以及去除簇保护层的去除步骤。簇保护层的厚度T满足T> nY +（b 2 Y 2 n-nY 2⁡（b 4 - 16 a 2）1 2 2）1 2，其中n是气体簇的剂量离子束，Y是簇保护层的蚀刻效率，表示为每簇的蚀刻体积（a和b是常数）。

10. 发明授权

US08178857B2 Method and apparatus for flattening solid surface 有权
标题翻译：固体表面平整的方法和装置
公开(公告)号：US08178857B2
公开(公告)日：2012-05-15
申请号：US11920362
申请日：2006-05-18
申请人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
发明人： Akinobu Sato , Akiko Suzuki , Emmanuel Bourelle , Jiro Matsuo , Toshio Seki
IPC分类号： G21G5/00
CPC分类号： H01L21/32137 , C23F4/00 , H01J2237/057 , H01J2237/0812 , H01J2237/20207 , H01J2237/3151 , H01L21/3065 , H01L21/31116
摘要： A method for flattening a sample surface by irradiating the sample surface with a gas cluster ion beam, generates clusters of source gas in a cluster generating chamber, ionizes the generated clusters in an ionization chamber, accelerates the ionized cluster beam in an electric field of an accelerating electrode, selects a cluster size using a magnetic field of a sorting mechanism, and irradiates the surface of a sample. An irradiation angle between the sample surface and the gas cluster ion beam is less than 30° and an average cluster size of the gas cluster ion beam is 50 or above.
摘要翻译：通过用气体簇离子束照射样品表面来平坦化样品表面的方法，在簇生成室中产生源气体簇，将电离室中产生的簇电离，在离子化的电场中加速离子化的簇束加速电极，使用分选机构的磁场选择簇尺寸，并照射样品的表面。样品表面和气体团簇离子束之间的照射角度小于30°，气体团簇离子束的平均簇尺寸为50以上。

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