专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100086752A1 Transfer Films for Firing and Method of Forming Substrate with Functional Pattern 审中-公开
标题翻译：转移膜用于烧制和形成具有功能图案的基板的方法
公开(公告)号：US20100086752A1
公开(公告)日：2010-04-08
申请号：US12637434
申请日：2009-12-14
申请人： Akihiro IIKUMA , Hideaki Shinozaki , Masahiro Kikuchi , Tatsuya Otsuka , Taiichi Kubo , Kazuhisa Ono
发明人： Akihiro IIKUMA , Hideaki Shinozaki , Masahiro Kikuchi , Tatsuya Otsuka , Taiichi Kubo , Kazuhisa Ono
IPC分类号： B32B3/10 , B32B37/06 , B32B17/06
CPC分类号： B44C1/1716 , B44C1/172 , H05K3/207 , H05K2203/1126 , Y10T428/2486 , Y10T428/24926
摘要： Transfer films for firing which have the excellent property of transferring a functional pattern and enable a pyrolysis gas generated by the firing of organic substances to be released smoothly, and which can form on a substrate a functional pattern free from defects such as a shape or function failure. One of the transfer films for firing comprises a release film and a multilayered structure formed so as to be in contact with one of the surfaces of the release film. The multilayered structure includes both a pressure-sensitive adhesive layer for bonding the transfer film for firing to a surface of a substrate and a functional pattern formed between the release film and the pressure-sensitive adhesive layer. The functional pattern comprises inorganic particles and a first organic substance removable by firing, and the pressure-sensitive adhesive layer comprises a second organic substance removable by firing and different from the first organic substance. The heat decomposition temperature of the first organic substance (Tdb), the heat decomposition temperature of the second organic substance (Tda), and the fusion bonding temperature of the inorganic particles (Tw) each measured under the firing conditions to be used for firing the multilayered structure transferred to a surface of a substrate satisfy the relationship Tdb.
摘要翻译：具有转印功能图案的优异性能的转印用转印膜，能够使通过烧成有机物质而产生的热解气体平滑地释放，并且能够在基板上形成没有形状或功能等缺陷的功能图案失败。用于焙烧的转印膜之一包括形成为与剥离膜的一个表面接触的剥离膜和多层结构。多层结构包括用于将烧结用转印膜与基板表面接合的压敏粘合剂层和形成在剥离膜与压敏粘合剂层之间的功能图案。功能图案包括无机颗粒和通过烧制除去的第一有机物质，并且压敏粘合剂层包括通过烧制除去并且不同于第一有机物质的第二有机物质。第一有机物（Tdb）的热分解温度，第二有机物质的热分解温度（Tda）以及在烧成条件下测定的无机粒子（Tw）的熔融粘合温度转移到基板表面的多层结构满足关系Tdb。

IPRDB

热门服务

关于我们

友情链接

联系方式