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1. 发明申请

US20100086752A1 Transfer Films for Firing and Method of Forming Substrate with Functional Pattern 审中-公开
标题翻译：转移膜用于烧制和形成具有功能图案的基板的方法
公开(公告)号：US20100086752A1
公开(公告)日：2010-04-08
申请号：US12637434
申请日：2009-12-14
申请人： Akihiro IIKUMA , Hideaki Shinozaki , Masahiro Kikuchi , Tatsuya Otsuka , Taiichi Kubo , Kazuhisa Ono
发明人： Akihiro IIKUMA , Hideaki Shinozaki , Masahiro Kikuchi , Tatsuya Otsuka , Taiichi Kubo , Kazuhisa Ono
IPC分类号： B32B3/10 , B32B37/06 , B32B17/06
CPC分类号： B44C1/1716 , B44C1/172 , H05K3/207 , H05K2203/1126 , Y10T428/2486 , Y10T428/24926
摘要： Transfer films for firing which have the excellent property of transferring a functional pattern and enable a pyrolysis gas generated by the firing of organic substances to be released smoothly, and which can form on a substrate a functional pattern free from defects such as a shape or function failure. One of the transfer films for firing comprises a release film and a multilayered structure formed so as to be in contact with one of the surfaces of the release film. The multilayered structure includes both a pressure-sensitive adhesive layer for bonding the transfer film for firing to a surface of a substrate and a functional pattern formed between the release film and the pressure-sensitive adhesive layer. The functional pattern comprises inorganic particles and a first organic substance removable by firing, and the pressure-sensitive adhesive layer comprises a second organic substance removable by firing and different from the first organic substance. The heat decomposition temperature of the first organic substance (Tdb), the heat decomposition temperature of the second organic substance (Tda), and the fusion bonding temperature of the inorganic particles (Tw) each measured under the firing conditions to be used for firing the multilayered structure transferred to a surface of a substrate satisfy the relationship Tdb.
摘要翻译：具有转印功能图案的优异性能的转印用转印膜，能够使通过烧成有机物质而产生的热解气体平滑地释放，并且能够在基板上形成没有形状或功能等缺陷的功能图案失败。用于焙烧的转印膜之一包括形成为与剥离膜的一个表面接触的剥离膜和多层结构。多层结构包括用于将烧结用转印膜与基板表面接合的压敏粘合剂层和形成在剥离膜与压敏粘合剂层之间的功能图案。功能图案包括无机颗粒和通过烧制除去的第一有机物质，并且压敏粘合剂层包括通过烧制除去并且不同于第一有机物质的第二有机物质。第一有机物（Tdb）的热分解温度，第二有机物质的热分解温度（Tda）以及在烧成条件下测定的无机粒子（Tw）的熔融粘合温度转移到基板表面的多层结构满足关系Tdb。

2. 发明申请

US20100086754A1 Transfer Film for Firing 审中-公开
标题翻译：转移电影发射
公开(公告)号：US20100086754A1
公开(公告)日：2010-04-08
申请号：US12637481
申请日：2009-12-14
申请人： Akihiro Iikuma , Hideaki Shinozaki , Masahiro Kikuchi , Tatsuya Otsuka , Taiichi Kubo , Kazuhisa Ono
发明人： Akihiro Iikuma , Hideaki Shinozaki , Masahiro Kikuchi , Tatsuya Otsuka , Taiichi Kubo , Kazuhisa Ono
IPC分类号： B32B3/10
CPC分类号： H05K3/207 , B44C1/1712 , H05K1/092 , H05K3/386 , H05K2201/0195 , H05K2203/0156 , H05K2203/0783 , Y10T428/24893
摘要： A transfer film for firing which has a multilayer structure including a functional pattern and a pressure-sensitive adhesive layer. The multilayer structure is free from a shape failure of the functional pattern and a decrease in adhesive force of the adhesive layer, and has the excellent transferability to a substrate. The transfer film gives a fired functional pattern free from defects such as a shape or function failure. The transfer film for firing is one for use in forming a fired functional pattern by transferring a multilayer structure including a functional pattern to a surface of a substrate and firing it. The transfer film comprises a release film and a multilayer structure formed so as to be in contact with one of the surfaces of the release film. The multilayer structure includes a functional pattern and a contact layer which has been formed so as to be in direct contact with the surface of the functional pattern and is constituted of one layer or a larger number of layers. The functional pattern comprises inorganic particles and an organic substance removable by firing. The contact layer comprises an organic substance and a solvent both removable by firing. The organic substance contained in the functional pattern is incompatible with the solvent contained in the contact layer.
摘要翻译：一种具有包括功能图案和压敏粘合剂层的多层结构的烧制用转印膜。多层结构没有功能图案的形状破坏和粘合剂层的粘合力的降低，并且对基材具有优异的转移性。转印膜具有没有诸如形状或功能故障的缺陷的烧制功能图案。用于焙烧的转印膜是通过将包括功能图案的多层结构转移到基板的表面并烧制来形成烧制的功能图案的转印膜。转印膜包括脱模膜和形成为与剥离膜的一个表面接触的多层结构。多层结构包括功能图案和形成为与功能图案的表面直接接触并由一层或多层构成的接触层。功能图案包括无机颗粒和通过焙烧除去的有机物质。接触层包括可通过烧制除去的有机物质和溶剂。包含在功能图案中的有机物质与接触层中所含的溶剂不相容。

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