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    • 3. 发明申请
    • SYSTEMS AND METHODS FOR SINGLE MAGNETRON SPUTTERING
    • 单磁珠溅射的系统和方法
    • US20170022604A1
    • 2017-01-26
    • US14809084
    • 2015-07-24
    • Advanced Energy Industries, Inc.
    • David ChristieSkip B. Larson
    • C23C14/35H01J37/34
    • H01J37/3476C23C14/3485C23C14/3492H01J37/3405H01J37/3438H01J37/3488
    • A system and method for single magnetron sputtering are described. One example includes a system having a power supply, a plasma chamber enclosing a substrate, an anode, and a target for depositing a thin film material on the substrate. This example also has a datastore with uncoated anode characterization data and an anode sputtering adjustment system including an anode analysis component to generate a first health value. The first health value is indicative of whether the anode is coated with a dielectric material. This example also has an anode power controller to receive the first health value and provide an anode-energy-control signal to the pulse controller of the pulsed DC power supply to adjust a second anode sputtering energy relative to a first anode sputtering energy to eject at least a portion of the dielectric material from the anode.
    • 描述了用于单磁控溅射的系统和方法。 一个实例包括具有电源的系统,包围衬底的等离子体室,阳极和用于在衬底上沉积薄膜材料的靶。 该示例还具有未涂覆的阳极表征数据的数据存储区和包括阳极分析组件以产生第一健康值的阳极溅射调整系统。 第一健康值表示阳极是否涂有电介质材料。 该示例还具有阳极功率控制器以接收第一健康值并且向脉冲DC电源的脉冲控制器提供阳极能量控制信号,以相对于第一阳极溅射能量调节第二阳极溅射能量以在 来自阳极的电介质材料的至少一部分。