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1. 发明申请

US20060108678A1 Probe arrays and method for making 审中-公开
标题翻译：探针阵列和制作方法
公开(公告)号：US20060108678A1
公开(公告)日：2006-05-25
申请号：US11173241
申请日：2005-06-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： H01L23/48
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

2. 发明申请

US20080093424A1 Probe Arrays and Method for Making 有权
公开(公告)号：US20080093424A1
公开(公告)日：2008-04-24
申请号：US11929539
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B29C65/00 , B23K35/12
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

3. 发明申请

US20080105355A1 Probe Arrays and Method for Making 审中-公开
标题翻译：探针阵列和制作方法
公开(公告)号：US20080105355A1
公开(公告)日：2008-05-08
申请号：US11929597
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B32B37/00 , B23K31/02
CPC分类号： G01R3/00 , G01R1/06761 , G01R1/07307 , Y10T29/49002 , Y10T156/10
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

4. 发明申请

US20060084265A1 Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data 失效
公开(公告)号：US20060084265A1
公开(公告)日：2006-04-20
申请号：US11029173
申请日：2005-01-03
申请人： Adam Cohen , Jeffrey Thompson
发明人： Adam Cohen , Jeffrey Thompson
IPC分类号： H01L21/44
CPC分类号： C25D5/022 , B33Y10/00 , B33Y50/02 , C25D1/10 , C25D5/10
摘要： Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

5. 发明申请

US20050181315A1 Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data 失效
标题翻译：用于电化学地制造包括数据伪光栅化的三维结构的方法
公开(公告)号：US20050181315A1
公开(公告)日：2005-08-18
申请号：US11028943
申请日：2005-01-03
申请人： Adam Cohen , Jeffrey Thompson
发明人： Adam Cohen , Jeffrey Thompson
IPC分类号： C25D5/02 , C25D5/10 , G03C5/38 , H01L21/8236
CPC分类号： C25D5/02 , B33Y10/00 , B33Y50/00 , B33Y50/02 , C25D1/003 , C25D5/022 , C25D5/10
摘要： Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.
摘要翻译：本发明的一些实施例涉及用于电化学制造多层三维结构的技术，其中至少一个或多个层的选择性图案化通过掩模发生，该掩模使用表示具有三维结构的横截面的数据形成，该三维结构具有被修改为将其定义为仅限定正面积区域的多边形形式。根据是否使用掩模，例如选择性地沉积结构材料或牺牲材料，正面积的区域是结构材料要被定位的区域或者结构材料不被定位的区域。修改的数据可以采取相邻或稍微重叠的相对窄的矩形结构的形式，其中结构的宽度与期望的地层分辨率相关。相邻矩形的中心之间的间距可以是均匀的或可以是变量。数据修改还可以包括形成原始结构，缩放副本，镜像副本，旋转副本，补充副本等的重复副本。

6. 发明申请

US20050067292A1 Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures 审中-公开
标题翻译：具有电介质或活性碱的电化学制造结构以及用于制造这种结构的方法和装置
公开(公告)号：US20050067292A1
公开(公告)日：2005-03-31
申请号：US10841006
申请日：2004-05-07
申请人： Jeffrey Thompson , Adam Cohen , Michael Lockard , Dennis Smalley
发明人： Jeffrey Thompson , Adam Cohen , Michael Lockard , Dennis Smalley
IPC分类号： B81C1/00 , C25D5/02
CPC分类号： C25D1/003 , B81C1/00373 , B81C2201/0181 , B81C2201/019
摘要： Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
摘要翻译：多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换发生。永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

7. 发明授权

US08303958B2 Method of treating immunological disorders by administering truncated BAFF receptors 有权
标题翻译：通过施用截短的BAFF受体来治疗免疫疾病的方法
公开(公告)号：US08303958B2
公开(公告)日：2012-11-06
申请号：US13213826
申请日：2011-08-19
申请人： Christine Ambrose , Jeffrey Thompson , Yen-Ming Hsu , Dingyi Wen , Yaping Sun
发明人： Christine Ambrose , Jeffrey Thompson , Yen-Ming Hsu , Dingyi Wen , Yaping Sun
IPC分类号： A61K38/00 , A61K38/17 , A61K38/18 , C07K14/435 , C07K14/705 , C07K14/71 , C07K14/715
CPC分类号： C07K14/715 , A61K38/00 , A61K39/00 , A61K2039/505 , C07K14/70578 , C07K14/7151 , C07K16/18 , C07K16/2866 , C07K2317/52 , C07K2317/73 , C07K2319/30
摘要： The disclosure provides a non-naturally occurring BAFF-R glycoprotein having a deletion in the extracellular domain which results in an altered 0-linked glycosylation pattern. The disclosure also provides methods and pharmaceutical compositions for treating B-cell- and T-cell-mediated disorders.
摘要翻译：本公开提供在细胞外结构域中具有缺失的非天然存在的BAFF-R糖蛋白，其导致改变的O-连接的糖基化模式。本公开还提供了用于治疗B细胞和T细胞介导的病症的方法和药物组合物。

8. 发明申请

US20120129735A1 NON-AQUEOUS DRILLING ADDITIVE USEFUL TO PRODUCE A FLAT TEMPERATURE-RHEOLOGY PROFILE 审中-公开
标题翻译：非水性钻孔添加剂有助于生产平坦温度 - 流变学特征
公开(公告)号：US20120129735A1
公开(公告)日：2012-05-24
申请号：US12950164
申请日：2010-11-19
申请人： David Dino , Yanhui Chen , Jeffrey Thompson
发明人： David Dino , Yanhui Chen , Jeffrey Thompson
IPC分类号： C09K8/34
CPC分类号： C09K8/32 , C09K8/36
摘要： A method of providing a substantially constant equivalent circulating density of a drilling fluid over a temperature range of about 120° F. to about 40° F. includes adding a drilling fluid additive to the drilling fluid, wherein the drilling fluid additive includes the reaction product of a carboxylic acid with a single carboxylic moiety; and a polyamine having at least two primary amino functionalities and optionally at least one secondary amino functionality.
摘要翻译：在约120°F至约40°F的温度范围内提供钻井液基本上恒定的等效循环密度的方法包括向钻井液中添加钻井液添加剂，其中钻井液添加剂包括反应产物的具有单个羧基部分的羧酸; 和具有至少两个伯氨基官能团和任选至少一个仲氨基官能团的多胺。

9. 发明申请

US20110311530A1 TRUNCATED BAFF RECEPTORS 有权
标题翻译：截断BAFF受体
公开(公告)号：US20110311530A1
公开(公告)日：2011-12-22
申请号：US13213826
申请日：2011-08-19
申请人： Christine Ambrose , Jeffrey Thompson , Yen-Ming Hsu , Dingyi Wen , Yaping Sun
发明人： Christine Ambrose , Jeffrey Thompson , Yen-Ming Hsu , Dingyi Wen , Yaping Sun
IPC分类号： A61K38/17 , C12N15/12 , C12N15/63 , C12N5/10 , C12P21/02 , C07K19/00 , A61K48/00 , A61K39/395 , A61P37/06 , A61P9/10 , A61P29/00 , A61P35/00 , A61P31/12 , A61P13/12 , C07K14/715
CPC分类号： C07K14/715 , A61K38/00 , A61K39/00 , A61K2039/505 , C07K14/70578 , C07K14/7151 , C07K16/18 , C07K16/2866 , C07K2317/52 , C07K2317/73 , C07K2319/30
摘要： The disclosure provides a non-naturally occurring BAFF-R glycoprotein having a deletion in the extracellular domain which results in an altered 0-linked glycosylation pattern. The disclosure also provides methods and pharmaceutical compositions for treating B-cell- and T-cell-mediated disorders.
摘要翻译：本公开提供在细胞外结构域中具有缺失的非天然存在的BAFF-R糖蛋白，其导致改变的O-连接的糖基化模式。本公开还提供了用于治疗B细胞和T细胞介导的病症的方法和药物组合物。

10. 发明授权

US08022182B2 Truncated BAFF receptors 有权
标题翻译：截断的BAFF受体
公开(公告)号：US08022182B2
公开(公告)日：2011-09-20
申请号：US12704190
申请日：2010-02-11
申请人： Christine Ambrose , Jeffrey Thompson , Yen-Ming Hsu , Dingyi Wen , Yaping Sun
发明人： Christine Ambrose , Jeffrey Thompson , Yen-Ming Hsu , Dingyi Wen , Yaping Sun
IPC分类号： C07K14/435 , C07K14/705 , C07K14/71 , C07K14/715 , A61K38/17 , A61K38/18
CPC分类号： C07K14/715 , A61K38/00 , A61K39/00 , A61K2039/505 , C07K14/70578 , C07K14/7151 , C07K16/18 , C07K16/2866 , C07K2317/52 , C07K2317/73 , C07K2319/30
摘要： The disclosure provides a non-naturally occurring BAFF-R glycoprotein having a deletion in the extracellular domain which results in an altered O-linked glycosylation pattern. The disclosure also provides methods and pharmaceutical compositions for treating B-cell- and T-cell-mediated disorders.
摘要翻译：本公开提供在细胞外结构域中具有缺失的非天然存在的BAFF-R糖蛋白，其导致改变的O-连接的糖基化模式。本公开还提供了用于治疗B细胞和T细胞介导的病症的方法和药物组合物。

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