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1. 发明申请

US20190252127A1 Solid Electrolytic Capacitor for a Tantalum Embedded Microchip 审中-公开
公开(公告)号：US20190252127A1
公开(公告)日：2019-08-15
申请号：US16268610
申请日：2019-02-06
申请人： AVX Corporation
发明人： Joseph W. Paulus , John Sturmer , Jason Laforge
IPC分类号： H01G9/15 , H01G9/052 , H01G9/07 , H01G9/032 , H01G9/028 , H01G9/042 , H01G9/26 , H01G9/00
CPC分类号： H01G9/15 , H01G9/0036 , H01G9/028 , H01G9/032 , H01G9/0425 , H01G9/052 , H01G9/07 , H01G9/26
摘要： A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a porous anode body, an anode foil, a dielectric, a cathode, and anode and cathode terminations. The foil is disposed on a planar surface of the anode body, and both comprise a valve metal. Further, the dielectric overlies at least a portion of the anode body, and the dielectric is also formed within the anode body. The cathode overlies at least a portion of the dielectric that overlies the anode body and includes a solid electrolyte, where at least a portion of a lower surface of the foil is free of both the dielectric and the solid electrolyte. In addition, the anode termination is electrically connected to the portion of the lower surface of the foil that is free of both the dielectric and the solid electrolyte, and the cathode termination is electrically connected to the solid electrolyte.

2. 发明授权

US11257629B2 Solid electrolytic capacitor for a tantalum embedded microchip 有权
公开(公告)号：US11257629B2
公开(公告)日：2022-02-22
申请号：US16268610
申请日：2019-02-06
申请人： AVX Corporation
发明人： Joseph W. Paulus , John Sturmer , Jason Laforge
IPC分类号： H01G9/15 , H01G9/052 , H01G9/07 , H01G9/00 , H01G9/028 , H01G9/042 , H01G9/26 , H01G9/032
摘要： A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a porous anode body, an anode foil, a dielectric, a cathode, and anode and cathode terminations. The foil is disposed on a planar surface of the anode body, and both comprise a valve metal. Further, the dielectric overlies at least a portion of the anode body, and the dielectric is also formed within the anode body. The cathode overlies at least a portion of the dielectric that overlies the anode body and includes a solid electrolyte, where at least a portion of a lower surface of the foil is free of both the dielectric and the solid electrolyte. In addition, the anode termination is electrically connected to the portion of the lower surface of the foil that is free of both the dielectric and the solid electrolyte, and the cathode termination is electrically connected to the solid electrolyte.

3. 发明申请

US20160284476A1 Tantalum Embedded Microchip 有权
标题翻译：钽嵌入式Microchip
公开(公告)号：US20160284476A1
公开(公告)日：2016-09-29
申请号：US14664957
申请日：2015-03-23
申请人： AVX Corporation
发明人： Joseph W. Paulus , John R. Sturmer
IPC分类号： H01G9/012 , H01G9/07 , H01G9/00 , H01G9/15
CPC分类号： H01G9/012 , H01G9/0032 , H01G9/052 , H01G9/07 , H01G9/15
摘要： A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a sintered porous anode body; a sintered anode substrate; a dielectric that overlies at least a portion of the anode body and at least a portion of the anode substrate and that is also formed within at least a portion of the anode body; a solid electrolyte cathode overlying at least a portion of the dielectric that overlies the anode body; an anode termination that is electrically connected to the anode substrate; and a cathode termination that is electrically connected to the solid electrolyte. The anode body is disposed on a planar surface of the anode substrate, and both the anode body and substrate are formed from a powder of a valve metal composition. Further, the anode substrate is hermetic and impermeable to liquids.
摘要翻译：提供了一种固体电解电容器和制造该电容器的方法。电容器包括烧结多孔阳极体; 烧结阳极基板; 覆盖在所述阳极体的至少一部分和所述阳极基板的至少一部分并且还形成在所述阳极体的至少一部分内的电介质; 覆盖在阳极体上的电介质的至少一部分的固体电解质阴极; 阳极端子，其电连接到所述阳极基板; 以及与固体电解质电连接的阴极端子。阳极体设置在阳极基板的平面上，阳极体和基板均由阀金属组合物的粉末形成。此外，阳极基板是气密的且不透液体。

4. 发明授权

US11222754B2 Solid electrolytic capacitor for a tantalum embedded microchip 有权
公开(公告)号：US11222754B2
公开(公告)日：2022-01-11
申请号：US16662560
申请日：2019-10-24
申请人： AVX Corporation
发明人： Joseph W. Paulus
IPC分类号： H01G9/15 , H01G9/052 , H01G9/012 , H01G9/00 , H01G9/08 , H01G9/042 , H01G9/07
摘要： A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a sintered porous anode body formed from a valve metal, a metallic physical vapor deposition (PVD) layer disposed directly on a planar surface of the anode body, a dielectric, a cathode, and anode and cathode terminations. The dielectric overlies at least a portion of the anode body and is also formed within the anode body. The cathode overlies at least a portion of the dielectric that overlies the anode body and includes a solid electrolyte, and a portion of a lower surface of the metallic PVD layer is free of both the dielectric and solid electrolyte. The anode termination is electrically connected to the portion of the lower surface of the metallic PVD layer that is free of both the dielectric and solid electrolyte, and the cathode termination is electrically connected to the solid electrolyte.

5. 发明申请

US20200161059A1 Solid Electrolytic Capacitor for a Tantalum Embedded Microchip 审中-公开
公开(公告)号：US20200161059A1
公开(公告)日：2020-05-21
申请号：US16662560
申请日：2019-10-24
申请人： AVX Corporation
发明人： Joseph W. Paulus
IPC分类号： H01G9/052 , H01G9/15 , H01G9/012 , H01G9/00
摘要： A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a sintered porous anode body formed from a valve metal, a metallic physical vapor deposition (PVD) layer disposed directly on a planar surface of the anode body, a dielectric, a cathode, and anode and cathode terminations. The dielectric overlies at least a portion of the anode body and is also formed within the anode body. The cathode overlies at least a portion of the dielectric that overlies the anode body and includes a solid electrolyte, and a portion of a lower surface of the metallic PVD layer is free of both the dielectric and solid electrolyte. The anode termination is electrically connected to the portion of the lower surface of the metallic PVD layer that is free of both the dielectric and solid electrolyte, and the cathode termination is electrically connected to the solid electrolyte.

6. 发明授权

US09966196B2 Tantalum embedded microchip 有权
公开(公告)号：US09966196B2
公开(公告)日：2018-05-08
申请号：US14664957
申请日：2015-03-23
申请人： AVX Corporation
发明人： Joseph W. Paulus , John R. Sturmer
IPC分类号： H01G9/00 , H01G9/02 , H01G9/04 , H01G9/145 , H01G9/042 , H01G9/045 , H01G4/228 , H01G9/10 , H05K5/03 , H01G9/012 , H01G9/15 , H01G9/07
CPC分类号： H01G9/012 , H01G9/0032 , H01G9/052 , H01G9/07 , H01G9/15
摘要： A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a sintered porous anode body; a sintered anode substrate; a dielectric that overlies at least a portion of the anode body and at least a portion of the anode substrate and that is also formed within at least a portion of the anode body; a solid electrolyte cathode overlying at least a portion of the dielectric that overlies the anode body; an anode termination that is electrically connected to the anode substrate; and a cathode termination that is electrically connected to the solid electrolyte. The anode body is disposed on a planar surface of the anode substrate, and both the anode body and substrate are formed from a powder of a valve metal composition. Further, the anode substrate is hermetic and impermeable to liquids.

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