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2. 发明申请

US20150001180A1 PROCESS KIT FOR EDGE CRITICAL DIMENSION UNIFORMITY CONTROL 审中-公开
标题翻译：边缘关键尺寸均匀控制的工艺套件
公开(公告)号：US20150001180A1
公开(公告)日：2015-01-01
申请号：US14020774
申请日：2013-09-06
申请人： Applied Materials, Inc.
发明人： Kenny Linh DOAN , Jason Della ROSA , Hamid NOORBAKHSH , Jong Mun KIM
IPC分类号： H01J37/32 , B32B18/00
CPC分类号： H01J37/32642 , H01J37/32449 , H01J37/32623 , H01J37/32651
摘要： A tunable ring assembly, a plasma processing chamber having a tunable ring assembly and method for tuning a plasma process is provided. In one embodiment, a tunable ring assembly includes an outer ceramic ring having an exposed top surface and a bottom surface and an inner silicon ring configured to mate with the outer ceramic ring to define an overlap region, the inner silicon ring having an inner surface, a top surface and a notch formed between the inner surface and the top surface, the inner surface defining an inner diameter of the ring assembly, the notch is sized to accept an edge of a substrate, an outer portion of the top surface of the inner silicon ring configured to contact in the overlap region and underlying an inner portion of the bottom surface of the outer ceramic ring.
摘要翻译：提供了一种可调环组件，具有可调环组件的等离子体处理室和用于调谐等离子体工艺的方法。在一个实施例中，可调谐环组件包括具有暴露的顶表面和底表面的外陶瓷环和被配置为与外陶瓷环配合以限定重叠区域的内硅环，内硅环具有内表面，在所述内表面和所述顶表面之间形成的顶表面和凹口，所述内表面限定所述环组件的内径，所述凹口的尺寸设置成接受基底的边缘，所述内表面的顶表面的外部硅环构造成在重叠区域中接触并且位于外陶瓷环的底表面的内部下方。

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