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1. 发明授权

US5225373A Method of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chips 失效
标题翻译：制造具有两个半导体压力传感器芯片的半导体压力传感器装置的方法
公开(公告)号：US5225373A
公开(公告)日：1993-07-06
申请号：US853190
申请日：1992-03-18
申请人： Yoshiharu Takahashi , Seiji Takemura , Keitaro Tsukui , Junko Itoh , Eitaro Nagai , Yasuo Tada , Yuuji Kishimoto , Sakae Kiguchi
发明人： Yoshiharu Takahashi , Seiji Takemura , Keitaro Tsukui , Junko Itoh , Eitaro Nagai , Yasuo Tada , Yuuji Kishimoto , Sakae Kiguchi
IPC分类号： G01L9/00 , H01L23/495
CPC分类号： G01L19/0061 , G01L19/147 , H01L23/49572 , H01L24/32 , H01L2224/32057 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/10253 , H01L2924/14 , H01L2924/351
摘要： A semiconductor pressure sensor device that improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10. By wire bond receiving projection 4 and supporting projection 11, stress acting on the semiconductor pressure sensor chip 50 is decreased to improve the measuring accuracy.
摘要翻译：公开了一种半导体压力传感器装置及其制造方法，该半导体压力传感器装置在将半导体压力传感器芯片附接到引线框架的同时不提供硅基底来提高测量精度。半导体压力传感器装置包括由用于将半导体压力传感器芯片50固定到引线框架100的弹性材料形成的管芯接合粘合剂10，设置在半导体压力传感器芯片50附接的凹槽中的引线接合突起4 用于在引线接合时从半导体压力传感器芯片50的底部接收压力施加力，以及用于防止引线接合突起4发生的变形应力的支撑突起11。半导体压力传感器芯片50和引线框架100的热变形被芯片接合粘合剂10吸收。通过引线接合突起4和支撑突起11，降低作用在半导体压力传感器芯片50上的应力以提高测量精度。

2. 发明授权

US5126813A Semiconductor pressure sensor device with two semiconductor pressure sensor chips and a method of manufacturing thereof 失效
标题翻译：具有两个半导体压力传感器芯片的半导体压力传感器装置及其制造方法
公开(公告)号：US5126813A
公开(公告)日：1992-06-30
申请号：US664569
申请日：1991-03-06
申请人： Yoshiharu Takahashi , Seiji Takemura , Keitaro Tsukui , Junko Itoh , Eitaro Nagai , Yasuo Tada , Yuuji Kishimoto , Sakae Kiguchi
发明人： Yoshiharu Takahashi , Seiji Takemura , Keitaro Tsukui , Junko Itoh , Eitaro Nagai , Yasuo Tada , Yuuji Kishimoto , Sakae Kiguchi
IPC分类号： G01L9/04 , G01L9/00 , H01L23/495 , H01L29/84
CPC分类号： G01L19/0061 , G01L19/147 , H01L23/49572 , H01L24/32 , H01L2224/05554 , H01L2224/32057 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01014 , H01L2924/01068 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/351
摘要： A semiconductor pressure sensor device that can improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10. By wire bond receiving projection 4 and supporting projection 11, stress acting on the semiconductor pressure sensor chip 50 is decreased to improve the measuring accuracy.
摘要翻译：公开了一种能够提高测量精度的半导体压力传感器装置及其制造方法，而不需要在将半导体压力传感器芯片附接到引线框架的同时提供硅基底。半导体压力传感器装置包括由用于将半导体压力传感器芯片50固定到引线框架100的弹性材料形成的管芯接合粘合剂10，设置在半导体压力传感器芯片50附接的凹槽中的引线接合突起4 用于在引线接合时从半导体压力传感器芯片50的底部接收压力施加力，以及用于防止引线接合突起4发生的变形应力的支撑突起11。半导体压力传感器芯片50和引线框架100的热变形被芯片接合粘合剂10吸收。通过引线接合突起4和支撑突起11，降低作用在半导体压力传感器芯片50上的应力以提高测量精度。

3. 发明授权

US4719572A Fuel injection control system for internal combustion engine 失效
标题翻译：内燃机燃油喷射控制系统
公开(公告)号：US4719572A
公开(公告)日：1988-01-12
申请号：US758848
申请日：1985-07-26
申请人： Yuuji Kishimoto
发明人： Yuuji Kishimoto
IPC分类号： F02D41/34 , F02D41/32 , F02M51/00
CPC分类号： F02D41/32
摘要： A fuel injection control system for an internal combustion engine in which the amount of fuel injected per input stroke of the engine is precisely controlled so that a predetermined constant air-to-fuel ratio is maintained at all times. A fuel flow arithmetic unit, operating from inputs supplied from a sensor which detects the pressure in the intake manifold of the engine, calculates a fuel flow amount per intake stroke. The output of the fuel flow arithmetic unit is applied as an address input to a memory in which are prestored values of driving times for each value supplied from the fuel flow arithmetic unit. The driving times are calculated taking into account the non-zero opening and closing times of the fuel injection valves, thereby eliminating nonlinearities in the fuel flow amount driving time characteristics. A driving signal generating circuit drives (opens) the fuel injection valves for times indicated by the driving times outputted by the memory.
摘要翻译：一种用于内燃机的燃料喷射控制系统，其中精确地控制发动机的每个输入行程喷射的燃料量，使得始终保持预定的恒定的空气 - 燃料比。燃料流量运算单元，其从检测发动机的进气歧管中的压力的传感器提供的输入运算，计算每进气冲程的燃料流量。燃料流量运算单元的输出作为地址输入应用于存储器，其中存储有从燃料流量运算单元提供的每个值的预先存储的驱动时间值。考虑到燃料喷射阀的非零打开和关闭时间来计算驾驶时间，从而消除燃料流量驱动时间特性的非线性。驱动信号发生电路驱动（打开）由存储器输出的驱动时间指示的时间的燃料喷射阀。

4. 发明授权

US5386725A Heat-sensitive flow rate sensor 失效
标题翻译：热敏流量传感器
公开(公告)号：US5386725A
公开(公告)日：1995-02-07
申请号：US110961
申请日：1993-08-24
申请人： Tomoya Yamakawa , Yuuji Kishimoto
发明人： Tomoya Yamakawa , Yuuji Kishimoto
IPC分类号： G01F1/68 , G01F1/684 , G01F1/692 , G01P5/12
CPC分类号： G01F1/6842
摘要： A heat-sensitive flow rate sensor in which a fluid shield is provided so as to cover at least part of a flow velocity probe disposed in a detecting tube, thereby preventing part of heat-sensitive resistor from being directly subjected to change in the flow velocity of a fluid. Temperature of the heat-sensitive resistor is maintained substantially constant even when the fluid flow rate has been drastically changed, thus providing good response characteristic of the flow rate sensor.
摘要翻译：一种热敏流量传感器，其中设置流体屏蔽以覆盖设置在检测管中的流速探针的至少一部分，从而防止热敏电阻的一部分直接受到流速的变化的流体。即使当流体流速急剧变化时，热敏电阻器的温度也保持基本恒定，从而提供了流量传感器的良好的响应特性。

5. 发明授权

US4492211A Air-to-fuel ratio control system for internal combustion engine 失效
标题翻译：内燃机空燃比控制系统
公开(公告)号：US4492211A
公开(公告)日：1985-01-08
申请号：US409226
申请日：1982-08-18
申请人： Setsuhiro Shimomura , Yuuji Kishimoto
发明人： Setsuhiro Shimomura , Yuuji Kishimoto
IPC分类号： F02D41/14 , F02D33/00 , F02D41/00 , F02D41/04 , F02D41/12 , F02D41/34 , F02M23/04 , F02M69/32 , F02D5/02 , F02D9/02 , F02M25/06
CPC分类号： F02D41/0005 , F02M23/04 , F02M69/32 , Y02T10/146 , Y02T10/42
摘要： An electric-type air-to-fuel ratio control system for an internal combustion engine in which the air-to-fuel ratio sucked into the cylinders of the engine is maintained substantially constant following abrupt deceleration. In accordance with the invention, a bypass flow of air is provided into the intake manifold of the engine downstream of the throttle valve and a fuel injection valve using an electrically controlled air supplying device. The air supplying device is opened following closure of the throttle valve to supply an additional flow of air which compensates for overrichness in the air-to-fuel mixture caused by the delay of fuel injected from the fuel injection valve to the cylinders of the engine. Preferably, the time during which air is supplied through the air supplying device and the flow rate of air therethrough is adjusted so as to maintain a predetermined air-to-fuel ratio following deceleration.
摘要翻译：用于内燃机的电式空燃比控制系统，其中吸入发动机气缸的空燃比在急剧减速之后保持基本恒定。根据本发明，在节流阀下游的发动机的进气歧管和使用电控空气供应装置的燃料喷射阀中提供旁路空气流。空气供应装置在关闭节流阀之后打开，以供应额外的空气流，其补偿由燃料喷射阀喷射到发动机气缸的燃料延迟引起的空气 - 燃料混合物的过度饱和。优选地，通过空气供给装置供给空气的时间和通过其的空气的流量被调节，以便在减速之后保持预定的空气 - 燃料比。

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